JP5745764B2 - 分離されたスリットバルブドアシールコンパートメントを備えたロードロックチャンバ - Google Patents

分離されたスリットバルブドアシールコンパートメントを備えたロードロックチャンバ Download PDF

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Publication number
JP5745764B2
JP5745764B2 JP2009523069A JP2009523069A JP5745764B2 JP 5745764 B2 JP5745764 B2 JP 5745764B2 JP 2009523069 A JP2009523069 A JP 2009523069A JP 2009523069 A JP2009523069 A JP 2009523069A JP 5745764 B2 JP5745764 B2 JP 5745764B2
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Prior art keywords
slit valve
valve door
assembly
load lock
seal
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JP2009523069A
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Japanese (ja)
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JP2010500740A (ja
JP2010500740A5 (enExample
Inventor
ジャエ チュル リー
ジャエ チュル リー
栗田　真一
真一 栗田
シュハイル アンワー
シュハイル アンワー
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Photovoltaic Devices (AREA)
  • Physical Vapour Deposition (AREA)
JP2009523069A 2006-08-04 2007-08-03 分離されたスリットバルブドアシールコンパートメントを備えたロードロックチャンバ Active JP5745764B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US82148706P 2006-08-04 2006-08-04
US60/821,487 2006-08-04
US11/782,267 2007-07-24
US11/782,267 US8124907B2 (en) 2006-08-04 2007-07-24 Load lock chamber with decoupled slit valve door seal compartment
PCT/US2007/075190 WO2008019317A2 (en) 2006-08-04 2007-08-03 Load lock chamber with decoupled slit valve door seal compartment

Publications (3)

Publication Number Publication Date
JP2010500740A JP2010500740A (ja) 2010-01-07
JP2010500740A5 JP2010500740A5 (enExample) 2011-03-03
JP5745764B2 true JP5745764B2 (ja) 2015-07-08

Family

ID=39033593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009523069A Active JP5745764B2 (ja) 2006-08-04 2007-08-03 分離されたスリットバルブドアシールコンパートメントを備えたロードロックチャンバ

Country Status (6)

Country Link
US (1) US8124907B2 (enExample)
JP (1) JP5745764B2 (enExample)
KR (1) KR101323224B1 (enExample)
CN (2) CN101496158B (enExample)
TW (1) TWI393206B (enExample)
WO (1) WO2008019317A2 (enExample)

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WO2013143081A1 (en) * 2012-03-28 2013-10-03 Acm Research (Shanghai) Inc. Vacuum chuck
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US10115605B2 (en) * 2016-07-06 2018-10-30 Rjr Technologies, Inc. Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates
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KR102400186B1 (ko) 2017-06-19 2022-05-20 삼성전자주식회사 공정 챔버 및 이를 포함하는 기판 처리 장치
US10636629B2 (en) * 2017-10-05 2020-04-28 Applied Materials, Inc. Split slit liner door
US20200194234A1 (en) * 2018-12-17 2020-06-18 Lam Research Corporation Vacuum chamber opening system
JP7280132B2 (ja) * 2019-07-12 2023-05-23 株式会社アルバック 真空チャンバ及び基板処理装置
KR102544775B1 (ko) * 2020-11-05 2023-06-20 주식회사 케이씨텍 기판 처리 장치
CN115910869B (zh) * 2022-12-30 2024-02-02 江苏微导纳米科技股份有限公司 装载腔体及其清洗方法、及半导体设备

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US20080087214A1 (en) 2008-04-17
WO2008019317A3 (en) 2008-09-18
CN101496158A (zh) 2009-07-29
KR20090046917A (ko) 2009-05-11
TW200816355A (en) 2008-04-01
CN101496158B (zh) 2011-08-17
TWI393206B (zh) 2013-04-11
JP2010500740A (ja) 2010-01-07
KR101323224B1 (ko) 2013-10-30
US8124907B2 (en) 2012-02-28
WO2008019317A2 (en) 2008-02-14
CN102254791A (zh) 2011-11-23

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