TWI393201B - 探測裝置製造方法 - Google Patents

探測裝置製造方法 Download PDF

Info

Publication number
TWI393201B
TWI393201B TW098118192A TW98118192A TWI393201B TW I393201 B TWI393201 B TW I393201B TW 098118192 A TW098118192 A TW 098118192A TW 98118192 A TW98118192 A TW 98118192A TW I393201 B TWI393201 B TW I393201B
Authority
TW
Taiwan
Prior art keywords
forming
hole
connection pad
test
manufacturing
Prior art date
Application number
TW098118192A
Other languages
English (en)
Chinese (zh)
Other versions
TW200952108A (en
Inventor
Yoshio Komoto
Yoshiharu Umemura
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200952108A publication Critical patent/TW200952108A/zh
Application granted granted Critical
Publication of TWI393201B publication Critical patent/TWI393201B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW098118192A 2008-06-02 2009-06-02 探測裝置製造方法 TWI393201B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2008/060170 WO2009147718A1 (fr) 2008-06-02 2008-06-02 Procédé de fabrication d'une plaquette à sondes
PCT/JP2009/002366 WO2009147804A1 (fr) 2008-06-02 2009-05-28 Procédé de fabrication d’un dispositif sonde

Publications (2)

Publication Number Publication Date
TW200952108A TW200952108A (en) 2009-12-16
TWI393201B true TWI393201B (zh) 2013-04-11

Family

ID=41397809

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098118192A TWI393201B (zh) 2008-06-02 2009-06-02 探測裝置製造方法

Country Status (2)

Country Link
TW (1) TWI393201B (fr)
WO (2) WO2009147718A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011149938A (ja) * 2010-01-22 2011-08-04 Kodi-S Co Ltd フィルムタイプのプローブユニット及びその製造方法
US10229877B2 (en) 2016-06-22 2019-03-12 Nanya Technology Corporation Semiconductor chip and multi-chip package using thereof
US20200072561A1 (en) * 2017-05-23 2020-03-05 Mitsubishi Electric Corporation Plate heat exchanger and heat pump hot water supply system
US10761146B2 (en) 2017-05-29 2020-09-01 Samsung Electronics Co., Ltd. Wafer probe card for evaluating micro light emitting diodes, analysis apparatus including the same, and method of fabricating the wafer probe card
KR102452488B1 (ko) * 2017-05-29 2022-10-11 삼성전자주식회사 웨이퍼 프로브 카드 및 이를 포함하는 분석 장치 및 웨이퍼 프로브 카드의 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005109A (ja) * 2004-06-17 2006-01-05 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2006322876A (ja) * 2005-05-20 2006-11-30 Seiko Epson Corp 半導体装置の検査プローブ及び半導体装置の検査プローブの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274252A (ja) * 1998-03-19 1999-10-08 Mitsubishi Electric Corp 半導体装置の検査装置及びその検査方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005109A (ja) * 2004-06-17 2006-01-05 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2006322876A (ja) * 2005-05-20 2006-11-30 Seiko Epson Corp 半導体装置の検査プローブ及び半導体装置の検査プローブの製造方法

Also Published As

Publication number Publication date
TW200952108A (en) 2009-12-16
WO2009147804A1 (fr) 2009-12-10
WO2009147718A1 (fr) 2009-12-10

Similar Documents

Publication Publication Date Title
JP4171513B2 (ja) コンタクタ、該コンタクタを備えたコンタクトストラクチャ、プローブカード、及び、試験装置
JP5396112B2 (ja) プローブカード
JP4514855B2 (ja) プロービングカードの製造方法
TWI393201B (zh) 探測裝置製造方法
JP2008504559A (ja) パターン化された導電層を有する基板
JP2001057378A (ja) コンタクトストラクチャの製造方法
US20130088251A1 (en) Probe card and manufacturing method thereof
JP4343256B1 (ja) 半導体装置の製造方法
KR101990458B1 (ko) 프로브 카드 및 그 제조방법
JP5551396B2 (ja) 検査用プローブおよび検査用プローブの製造方法
JP2004347591A (ja) 集積回路用プローブ・カード
JP2009270835A (ja) 半導体部品の検査方法及び装置
JP4960854B2 (ja) 電子部品検査装置用配線基板
JP2006275579A (ja) 検査基板および検査装置
JP5475657B2 (ja) プローブ装置製造方法
JP4097003B2 (ja) 半導体チップ用パッケージの良否検査方法及びその装置
JP2011038930A (ja) プローブカード及び被検査装置のテスト方法
JP2010243303A (ja) 低熱膨張インターポーザ
KR102276512B1 (ko) 전기 검사용 지그 및 그의 제조 방법
US20060169591A1 (en) Method of making printed wiring board and method of forming plating film
JP4492976B2 (ja) 半導体装置
KR101106607B1 (ko) 반도체 장치의 시험 장치
JP2004245671A (ja) プローブカード及びその製造方法、プローブ装置、プローブ試験方法、半導体装置の製造方法
JP2004301713A (ja) 電子回路装置及びその試験方法
JP2011163850A (ja) プローブカード、電子装置の電気特性測定装置、電子装置の電気特性測定方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees