TWI392587B - A method for manufacturing a double-sided flexible printed board, and a double-sided flexible printed circuit board - Google Patents
A method for manufacturing a double-sided flexible printed board, and a double-sided flexible printed circuit board Download PDFInfo
- Publication number
- TWI392587B TWI392587B TW095115451A TW95115451A TWI392587B TW I392587 B TWI392587 B TW I392587B TW 095115451 A TW095115451 A TW 095115451A TW 95115451 A TW95115451 A TW 95115451A TW I392587 B TWI392587 B TW I392587B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- double
- flexible printed
- sided flexible
- aromatic
- Prior art date
Links
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- 238000000034 method Methods 0.000 title description 8
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- 125000003118 aryl group Chemical group 0.000 claims description 34
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- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
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- 229910052742 iron Inorganic materials 0.000 description 1
- LVPMIMZXDYBCDF-UHFFFAOYSA-N isocinchomeronic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)N=C1 LVPMIMZXDYBCDF-UHFFFAOYSA-N 0.000 description 1
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- 238000002844 melting Methods 0.000 description 1
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- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- BWJMJBMBXXOHTM-UHFFFAOYSA-N n,n'-dibromo-n,n'-bis(2-bromophenyl)methanediamine Chemical compound C=1C=CC=C(Br)C=1N(Br)CN(Br)C1=CC=CC=C1Br BWJMJBMBXXOHTM-UHFFFAOYSA-N 0.000 description 1
- HXVJJVFHQYITAA-UHFFFAOYSA-N n,n'-diethoxy-n,n'-diphenylmethanediamine Chemical compound C=1C=CC=CC=1N(OCC)CN(OCC)C1=CC=CC=C1 HXVJJVFHQYITAA-UHFFFAOYSA-N 0.000 description 1
- VOLFIDSFKZJSNJ-UHFFFAOYSA-N n,n'-diethyl-n,n'-bis(2-ethylphenyl)methanediamine Chemical compound C=1C=CC=C(CC)C=1N(CC)CN(CC)C1=CC=CC=C1CC VOLFIDSFKZJSNJ-UHFFFAOYSA-N 0.000 description 1
- KONWVMMCOJSEKH-UHFFFAOYSA-N n,n'-diethyl-n,n'-diphenylmethanediamine Chemical compound C=1C=CC=CC=1N(CC)CN(CC)C1=CC=CC=C1 KONWVMMCOJSEKH-UHFFFAOYSA-N 0.000 description 1
- OEZHRYCQPTUHEG-UHFFFAOYSA-N n,n'-dimethoxy-n,n'-bis(2-methoxyphenyl)methanediamine Chemical compound C=1C=CC=C(OC)C=1N(OC)CN(OC)C1=CC=CC=C1OC OEZHRYCQPTUHEG-UHFFFAOYSA-N 0.000 description 1
- DDSUOSFAJQYSSU-UHFFFAOYSA-N n,n'-dimethoxy-n,n'-diphenylmethanediamine Chemical compound C=1C=CC=CC=1N(OC)CN(OC)C1=CC=CC=C1 DDSUOSFAJQYSSU-UHFFFAOYSA-N 0.000 description 1
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- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229940085991 phosphate ion Drugs 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000656 polylysine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 108010026466 polyproline Proteins 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- GJAWHXHKYYXBSV-UHFFFAOYSA-N pyridinedicarboxylic acid Natural products OC(=O)C1=CC=CN=C1C(O)=O GJAWHXHKYYXBSV-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
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- 229910052623 talc Inorganic materials 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- BKHZQJRTFNFCTG-UHFFFAOYSA-N tris(2-methylphenyl) phosphite Chemical compound CC1=CC=CC=C1OP(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C BKHZQJRTFNFCTG-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Polyamides (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
Description
本發明係關於一種雙面可撓性印刷基板之製造方法，其係具有充分之耐熱性，並且製造步驟簡單、不需要複雜設備者。
至於可撓性印刷基板，其係高分子絕緣薄膜之表面上形成有導體電路且具有可撓性之配線版，近年來作為實現電子機器之小型化、高密度化之方法被廣泛使用。其中，使用芳香族聚醯亞胺作為絕緣薄膜者占主流。因先前之可撓性印刷基板係藉由使用黏接劑黏合聚醯亞胺薄膜與銅箔之方法製造，故而所謂耐熱性、難燃性、電氣特性、密著性等物性受到所使用之黏接劑之制約，無法充分地表現聚醯亞胺之優良之諸多特性。作為解決該問題之方法，實施金屬箔上直接塗布聚醯胺酸(聚醯亞胺之先驅體)之清漆，並去除溶劑硬化，藉此製造之方法(專利文獻1)。又，最近隨著基板之高密度化，對於聚醯亞胺薄膜之兩側黏合有銅箔之雙面可撓性基板的要求日益提高。該雙面可撓性印刷基板之情形時，通常提出有上述單面可撓性印刷基板上塗布熱可塑性聚醯亞胺等，並以高熱層壓銅箔之方法。又，於專利文獻2或3中，揭示有不使用該等聚醯亞胺薄膜，使用黏接聚醯亞胺薄膜與金屬箔之黏接劑層作為絕緣薄膜之可能性。
[專利文獻1]日本專利特開昭61－245868號公報[專利文獻2]WO02/00791號公報[專利文獻1]WO2004/048436號公報
於單面可撓性印刷基板之情形時，藉由金屬箔上直接塗布聚醯胺酸(聚醯亞胺之先驅體)之清漆，並去除溶劑硬化之製造方法，可解決上述黏接劑造成諸多特性下降之問題。然而，通常使聚醯胺酸熱硬化之步驟，其必須於通常250至350℃之高熱下加熱2至5小時，故而生產性方面存在問題。又，於聚醯胺酸之縮合步驟中，硬化收縮較大，故而存在製造後可撓性印刷基板產生捲縮之問題。又，製造雙面可撓性印刷基板之情形時，該單面可撓性印刷基板之製造上存在難點，並且必須使用熱可塑性聚醯亞胺，但因熔點通常高達200℃以上，故而加熱熔融時需要大型設備。
本發明者們鑒於如此之實際狀況，尋求不需要高溫下長時間硬化之步驟且硬化收縮亦較小之雙面可撓性基板，進行積極研究，結果完成本發明。
即，本發明係提供(1)一種雙面可撓性印刷基板之製造方法，其包含：將含有下述式(1)表示之芳香族聚醯胺樹脂、環氧樹脂及有機溶劑之清漆，直接塗布於金屬箔上之步驟，去除溶劑設置樹脂層之步驟，以及，使金屬箔黏合於樹脂層側，使其硬化之步驟；
(式中，m、n係平均值，m＋n係2至200之正數，n係0.1以上之正數。Ar1
、Ar3
係二價芳香族基，Ar2
係含有苯酚性羥基之二價芳香族殘基。)
(2)一種雙面可撓性印刷基板，其係藉由如上述(1)揭示之製造方法所得者；(3)一種雙面可撓性印刷基板，其包含絕緣層與設置於其雙面之金屬箔所成之3層，該絕緣層包含含有苯酚性羥基之芳香族聚醯胺樹脂及環氧樹脂。
本發明之製造方法既簡單且不需要大型設備，故而經濟方面較為良好。藉由本發明所得之雙面可撓性基板，其具有接近使用聚醯亞胺之情形時之耐熱性、難燃性，並且可以普通環氧樹脂之硬化條件製造，故而工業方面極為有利。
作為本發明中使用之金屬箔，可列舉銅、鋁、鐵、金、銀、鎳鈀、鉻、鉬等或者該等之合金，為提高與樹脂層之黏接性，亦可藉由電暈放電、砂磨、電鍍、鋁醇化物、鋁螯合物及矽烷偶合劑等，實施機械性或化學性表面處理。其中，特別好的是銅箔。作為銅箔之種類，亦可係電解銅箔，亦可係壓延銅箔。作為金屬箔之厚度，通常是3至50 μm，較好的是4至40 μm。
本發明中使用之芳香族聚醯胺樹脂，其只要是含有苯酚性羥基之聚醯胺樹脂，就可無特別限制地使用，較好的是下述式(1)表示之芳香族聚醯胺樹脂。如此之芳香族聚醯胺樹脂，其例如可依據揭示於日本專利特開平8－143661號公報等之方法所得。
以下，就本發明中使用之芳香族聚醯胺樹脂之製造方法，加以說明。上述式(1)表示之聚醯胺樹脂，其可藉由下述處理所得：溶劑中，以相對於芳香族二羧酸之莫耳數成為過剩之方式，加入芳香族二胺進行縮聚。
芳香族羧酸與芳香族二胺之縮聚反應，其較好的是於作為縮合劑之芳香族亞磷酸酯與吡啶衍生物之存在下實施。
作為於此使用之芳香族亞磷酸酯，可列舉亞磷酸三苯酯、亞磷酸二苯酯、亞磷酸三鄰甲苯酯、亞磷酸二鄰甲苯酯、亞磷酸三間甲苯酯、亞磷酸二間甲苯酯、亞磷酸三對甲苯酯、亞磷酸二對甲苯酯、亞磷酸三對氯苯酯等。芳香族亞磷酸酯之使用量，其相對於芳香族二胺1莫耳，通常是0.5至3莫耳，較好的是1至2.5莫耳。
作為吡啶衍生物，可列舉吡啶、2－甲基吡啶、3－甲基吡啶、4－甲基吡啶、2,4－二甲基吡啶、2,6－二甲基吡啶、3,5－二甲基吡啶等。吡啶衍生物之使用量，其相對於芳香族二胺1莫耳，通常是1至5莫耳，較好的是2至4莫耳。
作為上述芳香族聚醯胺樹脂之製造時使用之芳香族二胺之例子，可列舉二胺基苯、二胺基甲苯、二胺基苯酚、二胺甲基苯、二胺基均三甲基苯、二胺基氯苯、二胺基硝基苯、二胺基偶氮苯、二胺基萘、二胺基聯苯、二胺基二甲氧基聯苯、二胺基二苯基醚、二胺基二甲基二苯基醚、亞甲基二苯胺、亞甲雙(甲氧基苯胺)、亞甲雙(二甲氧基苯胺)、亞甲雙(乙基苯胺)、亞甲雙(二乙氧基苯胺)、亞甲雙(乙氧基苯胺)、亞甲雙(二乙氧基苯胺)、亞甲雙(二溴苯胺)、異亞丙基二苯胺、六氟異亞丙基二苯胺、二胺基二苯甲酮、二胺基二甲基二苯甲酮、二胺基蒽醌、二胺基二苯基硫醚、二胺基二苯基亞碸或二胺基芴等，其中較好的是二胺基二苯基醚與亞甲雙(二乙基苯胺)。
作為上述芳香族聚醯胺樹脂之製造時使用之芳香族二羧酸之例子，可列舉鄰苯二甲酸、間苯二甲酸、對苯二甲酸、苯二醋酸、苯二丙酸、聯苯二羧酸、氧二苯甲酸、硫代二苯甲酸、二硫代二苯甲酸、二硫代雙(硝基苯甲酸)、羰基二苯甲酸、磺醯基二苯甲酸、萘二羧酸、亞甲基二苯甲酸、異亞丙基二苯甲酸、六氟異亞丙基苯甲酸、吡啶二羧酸等不含有苯酚性羥基之芳香族二羧酸，羥基間苯二甲酸、羥基對苯二甲酸、二羥基間苯二甲酸、二羥基對苯二甲酸等含有苯酚性羥基之芳香族二羧酸。於本發明中，因使用芳香族聚醯胺樹脂作為環氧樹脂之硬化劑，故而芳香族聚醯胺必須含有苯酚性羥基。為獲得如此之芳香族聚醯胺樹脂，於上述芳香族二羧酸成分中以含有苯酚性羥基之芳香族二羧酸占1莫耳%以上之比例使用。
反應時，當使用無機鹽作為催化劑時，可易於進行反應，故而較好。作為無機鹽之具體例，可列舉氯化鋰、氯化鈣、硫酸鈉或該等之混合物。該等無機鹽之使用量，其相對於使用之式(5)或式(1)之化合物1.0莫耳，通常是0.1至2.0莫耳，較好的是0.2至1.0莫耳。
至於芳香族聚醯胺樹脂之製造時使用之溶劑，只要是引起芳香族聚醯胺樹脂與溶劑混和之溶劑，就不會加以特別限制，作為具體例，可列舉N,N－二甲基甲醯胺、N,N－二甲基乙醯胺、N－甲基－2－吡咯烷酮、二甲基亞碸等或該等之混合溶劑，特別好的是N－甲基－2－吡咯烷酮。又，溶液中之芳香族聚醯胺樹脂之濃度較好的是2至50重量%，考慮到生產效率與操作性良好之溶液黏度方面，特別好的是5至30重量%。
製造芳香族聚醯胺樹脂時，縮合反應結束後，滴水至反應系內。於添加水時，攪拌下通常是60至110℃、較好的是70至100℃之範圍添加。水之添加量，其相對於反應液之總重量通常是10至200重量%，較好的是20至150重量%。
作為滴水時間，通常是30分鐘至15小時，較好的是1至10小時。殘留之縮合劑係於該滴水步驟中水解為磷酸離子及苯酚類。攪拌下，直至樹脂層與水層開始層分離為止持續滴水。
層分離開始之時刻停止攪拌並將其放置，藉此分為上層(水層)與下層(樹脂層)，從而去除上層之水層。於該情形時，通常樹脂層之黏度較高且形成為漿料狀，故而藉由傾析等易於去除水層。又，亦可藉由泵等，送液至系外。水層中，含有磷酸、亞磷酸、催化劑、苯酚類、吡啶等雜質及溶劑之一部分。
去除水層後殘留之樹脂層，其因亦去除一部分溶劑，使得黏度很快上升難以操作，故而再次添加有機溶劑稀釋。該情形時可使用之有機溶劑，其係N,N－二甲基甲醯胺、N,N－二甲基乙醯胺、N－甲基－2－吡咯烷酮、二甲基亞碸等。至於所使用之溶劑量，只要是充分降低黏度之範圍內，就不會加以特別規定，相對於清洗前之反應液重量，通常是5至100重量%，較好的是10至80重量%。
將上述清洗步驟通常重複1至10次、較好的是重複2至8次，藉此可獲得降低離子性雜質或低分子量有機雜質之芳香族聚醯胺樹脂之處理液。
將經清洗．稀釋之処理液加入不良溶劑中，從而析出聚醯胺樹脂。作為不良溶劑，只要是難以引起芳香族聚醯胺樹脂與溶劑混和之液體，就不會加以特別限制，作為具體例，可列舉水、甲醇、乙醇等或該等之混合溶劑。至於其使用量，期望的是可以無任何操作問題地濾別所析出之聚醯胺樹脂之範圍內儘量少量，相對於反應中使用之溶劑1重量份，較好的是0.5至50重量份，特別好的是1至10重量份。
至於經清洗之處理液與不良溶劑之混合，其亦可攪拌下將不良溶劑緩慢加入處理液中，亦可攪拌下將反應液加入不良溶劑中。使用送液泵、壓縮機及二流體噴嘴，或者使用送液泵及一流體噴嘴，將反應液噴霧至不良溶劑中之方法，其可易於析出粒徑適度之芳香族聚醯胺樹脂，故而較好。混合反應液與不良溶劑時之溫度，通常是0至100℃，較好的是20至80℃。
藉由與不良溶劑之混合所析出之芳香族聚醯胺樹脂，其藉由濾別而離析，並藉由以水清洗濾餅而去除離子性雜質。藉由乾燥該濾餅，可獲得聚醯胺樹脂，但亦可藉由進而以水溶性有機溶劑清洗，降低離子性雜質。
作為水溶性有機溶劑，可列舉甲醇、乙醇、正丙醇、異丙醇等醇類或丙酮等，該等可單獨使用或混合使用，特別好的是甲醇。
使用水溶性有機溶劑之清洗，其即使過濾器上清洗藉由濾別離析之上述芳香族聚醯胺樹脂濾餅，亦有效果，但藉由下述方式，可發揮更好之純化效果：將含有離析之溶劑與不良溶劑之聚醯胺樹脂濾餅，或者暫時藉由乾燥去除該濾別之溶劑及不良溶劑之聚醯胺樹脂，以及上述水溶性有機溶劑重新裝入容器中，攪拌懸浮後，再次進行濾別。該情形之水溶性有機溶劑之使用量，其相對於純淨聚醯胺樹脂1重量份為1至100重量份，較好的是2至50重量份；攪拌之溫度，較好的是常溫至懸浮液之沸點，特別好的是沸點下之攪拌。又，攪拌時間為0.1至24小時，較好的是1至5小時。進而，該操作通常於常壓下進行，但加壓下亦可進行。
上述懸浮處理後，將芳香族聚醯胺樹脂濾別，通常進而使用上述水溶性有機溶劑清洗濾餅，繼而根據情況，進而使用水清洗濾餅後進行乾燥，藉此可獲得目的之離子性雜質較少之芳香族聚醯胺樹脂。
本發明中使用之芳香族聚醯胺樹脂之固有黏度值(以30℃下為0.5 g/dl之N,N－二甲基乙醯胺溶液測定)，較好的是0.1至4.0 dl/g之範圍。通常，是否具有較好之平均聚合度係藉由參照固有黏度判斷。當固有黏度小於0.1 dl/g時，成膜性或作為芳香族聚醯胺樹脂之性質表現並不充分，故而並不較好。相反，當固有黏度大於4.0 dl/g時，聚合度過高且溶劑溶解性不良，並且產生成形加工性不良之問題。
如此獲得之式(1)之聚醯胺樹脂之m與n值，其取決於不具有苯酚性羥基之芳香族二羧酸與具有苯酚性羥基之芳香族二羧酸之添加比例，通常平均值為2至200，較好的是5至150。
於本發明之製造方法中，樹脂層係自含有芳香族聚醯胺樹脂、環氧樹脂及有機溶劑之清漆，去除有機溶劑所得。作為該清漆中使用之環氧樹脂之具體例，只要是一個分子中含有2個以上環氧基之樹脂，就不會加以限定，例如可列舉雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚醛型樹脂、甲酚醛型環氧樹脂、聯苯型環氧樹脂、三苯基甲烷型環氧樹脂、聯苯酚醛清漆型環氧樹脂、脂環式環氧樹脂等。該等可單獨使用，亦可併用2種以上。
上述清漆中環氧樹脂之使用量，其相對於芳香族聚醯胺樹脂之活性氫當量1當量，較好的是0.5至1.5當量。所謂芳香族聚醯胺樹脂之活性氫當量，其可自分子末端之胺基及分子中之苯酚性羥基量算出。相對於活性氫1當量未滿0.5當量之情形或超過1.5當量之情形時，存有硬化均不完全無法獲得良好之硬化物性之可能性。
又，上述清漆中，亦可使用硬化促進劑。作為可使用之硬化促進劑之例子，可列舉2－甲基咪唑、2－乙基咪唑、2－乙基－4－甲基咪唑、2－十一烷基咪唑、2－十七烷基咪唑、2－苯基咪唑、2－苯基－4－甲基咪唑、1－苄基－2－甲基咪唑、1－苄基－2－苯基咪唑、1－氰乙基－2－甲基咪唑、1－氰乙基－2－乙基－4－甲基咪唑、1－氰乙基－2－十一烷基咪唑、1－氰乙基－2－苯基咪唑、2－苯基－4,5－二羥基甲基咪唑、2－苯基－4－甲基－5－二羥基甲基咪唑等咪唑類，2－(二甲基胺甲基)苯酚、1,8－二氮雜雙環(5,4,0)十一烯－7等第三級胺類，三苯基膦等膦類，辛基酸錫等金屬化合物。至於硬化促進劑，相應需要相對於芳香族聚醯胺樹脂100重量份使用0.01至5.0重量份。
本發明之環氧樹脂組合物，其相應需要可含有無機填充劑。作為可使用之無機填充劑之具體例，可列舉二氧化矽、氧化鋁、滑石等。無機填充劑係以本發明之環氧樹脂組合物中占0至90重量%之量使用。進而，本發明之環氧樹脂組合物中，可添加矽烷偶合劑、硬脂酸、棕櫚酸、硬脂酸鋅、硬脂酸鈣等脫模劑，顏料等各種添加劑。
本發明中使用之清漆，其係藉由將上述說明之環氧樹脂、芳香族聚醯胺樹脂溶解於有機溶劑所獲得。作為所使用之溶劑，可列舉γ－丁內酯類、N－甲基吡咯烷酮(NMP)、N,N－二甲基甲醯胺(DMF)、N,N－二甲基乙醯胺、N,N－二甲基咪唑啉酮等醯胺系溶劑，四亞甲基碸等碸類，二乙二醇二甲基醚、二乙二醇二乙基醚、丙二醇、丙二醇單甲基醚、丙二醇單甲基醚單乙酸酯、丙二醇單丁基醚等醚系溶劑，甲基乙基酮、甲基異丁基酮、環戊酮、環己酮等酮系溶劑，甲苯、二甲苯等芳香族系溶劑。所得之清漆中之固形分濃度(溶劑以外成分之濃度)，通常是10至80重量%，較好的是20至70重量%。
本發明中，為工業性地使樹脂層形成於金屬箔上，將上述清漆自製膜用狹槽噴出至金屬箔之表面。作為該塗布方法，可列舉藉由輥式塗布機、刮刀式塗布機、刀片塗布機、塗膠刀平面塗布機、密閉塗布機等之方法。實驗室內簡單塗布之情形時，可使用敷料器。
繼而，60至180℃下，自塗布於金屬箔上之清漆加熱去除有機溶劑。該步驟既可於減壓下進行，亦可於紅外線之照射下進行。去除溶劑後，將金屬箔黏合於樹脂面上，加壓下於150至250℃下0.1至10小時加熱硬化樹脂層，藉此可獲得作為目的之雙面可撓性印刷基板。樹脂層之厚度取決於塗布之清漆之固形分濃度，通常是2至200 μm，較好的是3至150 μm。
繼而，藉由實施例更具體說明本發明，下述說明中只要未特別限制，份係指重量份。
向安裝有溫度計、冷卻管、分餾管及攪拌機之燒瓶中注入潔淨氮氣，並添加5－羥基間苯二甲酸2.7份、間苯二甲酸119.6份、3,4'－二胺基二苯基醚150份、氯化鋰7.8份、N－甲基吡咯烷酮811.5份、吡啶173.6份加以攪拌溶解後，95℃下添加亞磷酸三苯酯376.2份縮合反應4小時，從而獲得聚醯胺樹脂之反應液(A)。90℃下耗費2小時，將水490份滴至該反應液(A)中，並將其放置。因上層為水層、下層為油層(樹脂層)之方式層分離，故而藉由傾析去除上層。廢水量為1100份。油層(樹脂層)中添加N,N－二甲基甲醯胺610份，加以稀釋。繼而，90℃下耗費1小時滴水245份。藉由傾析，去除上層。廢水量為1100份。進而重複3次該清洗步驟，獲得芳香族聚醯胺樹脂之處理液1600份。向經攪拌之水3200份中，使用滴下漏斗滴下該聚醯胺溶液，析出微粒子狀之芳香族聚醯胺樹脂並加以濾別。將所得之濕濾餅分散至甲醇2400份中，攪拌下回流2小時。繼而，濾別甲醇，以水1600份清洗進行乾燥，藉此獲得下述式(2)
表示之芳香族聚醯胺樹脂240份。藉由硫酸．硝酸，濕式氧化分解包含於該芳香族聚醯胺樹脂中之總磷量後，藉由鉬青－抗壞血酸吸光光度法定量時為550 ppm。所得之芳香族聚醯胺樹脂之固有黏度為0.52 dl/g(二甲基乙醯胺溶液，30℃)，式中m值約為39.2，n值約為0.8。又，對於自添加比率計算之含有苯酚性羥基之芳香族聚醯胺樹脂之環氧基的活性氫當量約為5000 g/eq。
相對於所得之芳香族聚醯胺樹脂7.50份，使用NC－3000(日本化藥股份有限公司製造、環氧當量為275 g/eq、軟化點為55℃)0.42份作為環氧樹脂、2PHZ－PW(四國化成製造)0.01份作為硬化催化劑、以及N－甲基吡咯烷酮17份作為溶劑加以攪拌溶解，從而調整清漆。
使用敷料器，將合成例1中獲得之清漆塗布於厚度18 μm之電解銅箔之粗面為100 μm，130℃下乾燥30分鐘，藉此去除溶劑。繼而，藉由180℃下硬化1小時，從而獲得單面可撓性基板。硬化後，並未確認室溫下之捲縮。
將所得之單面可撓性基板煮沸30分鐘後，使聚醯亞胺面30秒接觸於260℃之焊錫槽上，觀察銅箔面之外觀時並未觀察到異常。
藉由蝕刻去除所得之單面可撓性基板之銅箔，測定樹脂層之玻璃轉化溫度時為235℃。又，基於UL94規格，觀察難燃性時為V－0電平。
使用敷料器，將合成例1中所得之清漆塗布於厚度18 μm之電解銅箔之粗面的為100 μm，130℃下乾燥30分鐘，藉此去除溶劑。繼而，藉由將厚度18 μm之電解銅箔黏合於樹脂面上，以熱板衝壓機30 Kg/cm2
壓力下180℃下硬化1小時，藉此獲得雙面可撓性基板。
基於JIS－C6471規格剝離銅箔進行試驗測定時，所得之雙面可撓性基板之黏接性為2.1 Kg/cm。
Claims (3)
- 一種雙面可撓性印刷基板之製造方法，其包含：將含有下述式(1)表示之芳香族聚醯胺樹脂、環氧樹脂及有機溶劑之清漆，直接塗布於金屬箔上之步驟；去除溶劑以形成樹脂層之步驟；以及，將另一金屬箔黏合於該樹脂層側並硬化該樹脂層之步驟：
- 一種雙面可撓性印刷基板，其係藉由如請求項1之製造方法所得。
- 一種雙面可撓性印刷基板，其包含絕緣層與設置於該絕緣層雙面之金屬箔所成之3層，該絕緣層包含下述式(1)表示之含有苯酚性羥基之芳香族聚醯胺樹脂及環氧樹脂：
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| JP2005131794A JP2006310574A (ja) | 2005-04-28 | 2005-04-28 | 両面フレキシブルプリント基板の製造法及び両面フレキシブルプリント基板。 |
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| TW095115451A TWI392587B (zh) | 2005-04-28 | 2006-04-28 | A method for manufacturing a double-sided flexible printed board, and a double-sided flexible printed circuit board |
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| US (1) | US20090056982A1 (zh) |
| EP (1) | EP1876873B1 (zh) |
| JP (1) | JP2006310574A (zh) |
| KR (1) | KR101258891B1 (zh) |
| CN (1) | CN101167416B (zh) |
| CA (1) | CA2605613A1 (zh) |
| ES (1) | ES2366800T3 (zh) |
| TW (1) | TWI392587B (zh) |
| WO (1) | WO2006118239A1 (zh) |
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| CN101208373B (zh) | 2005-07-21 | 2010-12-01 | 日本化药株式会社 | 聚酰胺树脂，环氧树脂组合物及其固化物 |
| KR101312369B1 (ko) | 2005-10-31 | 2013-09-27 | 니폰 가야꾸 가부시끼가이샤 | 고무 변성 폴리아미드 수지, 에폭시 수지 조성물 및 그경화물 |
| CN101511938B (zh) * | 2006-09-09 | 2012-10-10 | 帝人芳纶有限公司 | 可交联的芳族聚酰胺共聚物 |
| JP4884298B2 (ja) * | 2007-05-17 | 2012-02-29 | 日本化薬株式会社 | 樹脂層付き銅箔 |
| CN101722694A (zh) * | 2009-11-17 | 2010-06-09 | 丹阳市永和电器科技有限公司 | 一种高Tg高导热型铝基覆铜箔层压板 |
| JP6074830B2 (ja) * | 2014-07-02 | 2017-02-08 | 東洋インキＳｃホールディングス株式会社 | 熱硬化性樹脂組成物、接着性シート、硬化物およびプリント配線板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002194282A (ja) * | 2000-10-20 | 2002-07-10 | Nippon Kayaku Co Ltd | ポリアミド樹脂含有ワニス及びその用途 |
| JP2005029720A (ja) * | 2003-07-09 | 2005-02-03 | Nippon Kayaku Co Ltd | 芳香族ポリアミド樹脂、エポキシ樹脂組成物及びその硬化物 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61245868A (ja) * | 1985-04-24 | 1986-11-01 | Hitachi Chem Co Ltd | フレキシブルプリント基板の製造法 |
| EP0360971A3 (en) * | 1988-08-31 | 1991-07-17 | Mitsui Mining & Smelting Co., Ltd. | Mounting substrate and its production method, and printed wiring board having connector function and its connection method |
| EP0388243B1 (en) * | 1989-03-17 | 1994-06-22 | Tomoegawa Paper Co. Ltd. | Block copolymer and method of producing the same |
| JPH0362988A (ja) * | 1989-07-31 | 1991-03-19 | Chisso Corp | フレキシブルプリント回路用基板およびその製造法 |
| JPH03164241A (ja) * | 1989-11-24 | 1991-07-16 | Toyobo Co Ltd | 金属箔積層長尺体の製造方法 |
| JPH03234731A (ja) * | 1990-02-09 | 1991-10-18 | Teijin Ltd | 全芳香族ポリアミド及びその成型物 |
| JP3076060B2 (ja) * | 1990-11-21 | 2000-08-14 | 鐘淵化学工業株式会社 | フレキシブルプリント基板及びその製造方法 |
| JP2000313787A (ja) * | 1999-04-30 | 2000-11-14 | Tomoegawa Paper Co Ltd | エポキシ樹脂組成物及びその硬化物 |
| JP2001081282A (ja) * | 1999-09-16 | 2001-03-27 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料 |
| JP2002080693A (ja) * | 2000-06-28 | 2002-03-19 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びその硬化物 |
| JP4148501B2 (ja) * | 2002-04-02 | 2008-09-10 | 三井金属鉱業株式会社 | プリント配線板の内蔵キャパシタ層形成用の誘電体フィラー含有樹脂及びその誘電体フィラー含有樹脂を用いて誘電体層を形成した両面銅張積層板並びにその両面銅張積層板の製造方法 |
| TWI306867B (en) * | 2002-11-28 | 2009-03-01 | Nippon Kayaku Kk | Flame-retardant epoxy resin and its cured product |
| US7608336B2 (en) * | 2002-11-28 | 2009-10-27 | Nippon Kayaku Kabushiki Kaisha | Flame-retardant epoxy resin composition and cured product obtained therefrom |
| JP3949676B2 (ja) * | 2003-07-22 | 2007-07-25 | 三井金属鉱業株式会社 | 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法 |
| JP3977790B2 (ja) * | 2003-09-01 | 2007-09-19 | 古河サーキットフォイル株式会社 | キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板 |
| JP2005089616A (ja) * | 2003-09-18 | 2005-04-07 | Nippon Kayaku Co Ltd | 熱硬化性樹脂組成物及びその硬化物 |
| MY143242A (en) * | 2004-11-10 | 2011-04-15 | Hitachi Chemical Co Ltd | Metal foil provided with adhesion auxiliary material and printed wiring board using same |
| CN101208373B (zh) * | 2005-07-21 | 2010-12-01 | 日本化药株式会社 | 聚酰胺树脂，环氧树脂组合物及其固化物 |
| KR101312369B1 (ko) * | 2005-10-31 | 2013-09-27 | 니폰 가야꾸 가부시끼가이샤 | 고무 변성 폴리아미드 수지, 에폭시 수지 조성물 및 그경화물 |
| JP4884298B2 (ja) * | 2007-05-17 | 2012-02-29 | 日本化薬株式会社 | 樹脂層付き銅箔 |
-
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002194282A (ja) * | 2000-10-20 | 2002-07-10 | Nippon Kayaku Co Ltd | ポリアミド樹脂含有ワニス及びその用途 |
| JP2005029720A (ja) * | 2003-07-09 | 2005-02-03 | Nippon Kayaku Co Ltd | 芳香族ポリアミド樹脂、エポキシ樹脂組成物及びその硬化物 |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2366800T3 (es) | 2011-10-25 |
| US20090056982A1 (en) | 2009-03-05 |
| CN101167416A (zh) | 2008-04-23 |
| EP1876873A1 (en) | 2008-01-09 |
| CA2605613A1 (en) | 2006-11-09 |
| JP2006310574A (ja) | 2006-11-09 |
| EP1876873B1 (en) | 2011-07-27 |
| EP1876873A4 (en) | 2009-07-22 |
| CN101167416B (zh) | 2012-08-22 |
| TW200709923A (en) | 2007-03-16 |
| KR101258891B1 (ko) | 2013-04-29 |
| KR20080003846A (ko) | 2008-01-08 |
| WO2006118239A1 (ja) | 2006-11-09 |
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