TWI390798B - 插入式接頭 - Google Patents

插入式接頭 Download PDF

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Publication number
TWI390798B
TWI390798B TW096150659A TW96150659A TWI390798B TW I390798 B TWI390798 B TW I390798B TW 096150659 A TW096150659 A TW 096150659A TW 96150659 A TW96150659 A TW 96150659A TW I390798 B TWI390798 B TW I390798B
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Taiwan
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circuit board
printed circuit
plug
connector
contacts
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TW096150659A
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English (en)
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TW200838038A (en
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Ulrich Hetzer
Ferenc Nad
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Adc Gmbh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Description

插入式接頭
本發明係關於一種根據請求項1之導言之插入式接頭。
此一普通插入式接頭自DE 100 51 097 A1中已知。
此外，此一普通插入式接頭自US 2005/0202697 A1中已知，其中用於容納RF觸點之印刷電路板呈一撓性印刷電路板之形式。
由於對傳輸容量之需求變得愈來愈大，RF觸點之長度代表一約束邊界條件，但是該長度不能根據需要縮短，因為RF觸點仍需要執行足夠大之彈性偏移移動以補償配合插入接頭之容差且以足夠接觸力確保可靠之電接觸。
因此，本發明基於提供一種具有電傳輸性能得到改良之插入式接頭之技術問題。
該技術問題之解決方案產生自具有請求項1之特徵之標的物。本發明之進一步有利組態可自附屬項中發現。
關於此方面，該插入式接頭包括一外殼，一印刷電路板及RF觸點，該等RF觸點電連接至該印刷電路板，該等RF觸點由一整體、撓性印刷電路板形成，個別RF觸點自該撓性印刷電路板切斷開，一彈簧彈性元件對該撓性印刷電路板施加預應力。
因此，RF觸點在其尺寸方面可選擇為較短，該彈簧彈性元件實施必要之偏移。
在一個較佳實施例中，該彈簧彈性元件呈一彈性體形式。
在一進一步較佳之實施例中，該撓性印刷電路板佈置於一砧座上且連接至該砧座，該彈簧彈性元件佈置於該砧座下方。於此情形下，該砧座較佳地固定地連接(例如，銲接)至該撓性印刷電路板且用作對該撓性印刷電路板之機械支撐。進一步較佳地，該砧座具有一整體設計。該砧座由一非導電材料組成。於此情形下，預應力由正被壓至該彈性體上之砧座產生，出於此目的，將一梳形元件以一已定義方式自上方壓至該砧座上。除此之外，該梳形元件用於該撓性印刷電路板或該砧座之側向機械穩定。
在一進一步較佳之實施例中，安裝承載該撓性印刷電路板之剛性印刷電路板以便其可經由一彈簧彈性元件而移動。因此，可經由該剛性印刷電路板之移動施加一大部分之所需偏移移動，其結果係可將該撓性印刷電路板所需之偏移移動選擇為極小。該彈簧彈性元件可同樣呈一彈簧體之形式或呈一簧片之形式。
在一較佳之實施例中，該外殼經設計以具有兩個部分，該彈簧彈性元件安裝於第一外殼部分內，該印刷電路板固定地安裝於第二外殼部分內，且第一與第二部分彼此連接以便其可移動。此確保該剛性印刷電路板之偏移移動對該印刷電路板上之其它觸點不具有任何影響。
在一進一步較佳之實施例中，第一與第二外殼部分之間的連接呈一樞軸承之形式。
在一進一步較佳之實施例中，至少兩個毗鄰RF觸點經設計朝向該接觸區域以相反方向彎曲，其結果係其之間的電容性耦合得以最小化。
在一進一步較佳之實施例中，額外電容形成在該撓性印刷電路板上且補償串擾，進一步較佳地該等電容形成一非電流攜載路徑。在該撓性印刷電路板上之補償之優點係以下事實：該補償直接發生在串擾之位置處。若此外該補償發生在一自該接觸區域分支之非電流攜載路徑中，則傳播時間為零，亦即其得到同相補償。
在一進一步較佳之實施例中，額外電容形成於該剛性印刷電路板上。此可例如藉由導體跡線或交叉之額外非電流攜載導體跡線而發生。
根據本發明之插入式接頭之一較佳應用領域係作為一RJ45插座之設計。
圖1圖解說明呈一RJ45插座形式之插入式接頭1。插入式接頭1包括具有一容座3之一剛性印刷電路板2。此外，插入式接頭1包括一撓性印刷電路板4、一砧座5、一彈性體元件6及一彈性體容座7。RF觸點K1-K8自撓性印刷電路板4切斷開。撓性印刷電路板4由一非導電基礎材料組成，用於形成觸點之金屬結構及導體跡線被施加於該非導電基礎材料上。於此情形下，切斷開之RF觸點K1-K8朝上彎曲，於此情形下，如後文對於圖4將闡述，並非整個拱形形成RF觸點K1-K8。撓性印刷電路板4固定地連接至由一非導 電塑膠整體組成之砧座5。砧座5亦具有切斷部分，RF觸點K1-K8倚靠在砧座5之拱形8上，此可見於圖2中。較佳整體式彈性體元件6具有八個球形突出物9，其各自佈置於砧座5之一拱形8下方。由於撓性印刷電路板4上梳形元件(未圖解說明)之緣故，砧座5之拱形8隨後向下推球形突出物9(見圖2)，其結果係以彈簧彈性方式給RF觸點K1-K8施加預應力。於此情形下，砧座5之拱形8在一側上藉由一薄膜鉸鏈11及一彈性拉桿12連接至砧座5之框架結構13。於此情形下，薄膜鉸鏈11在框架結構13之拉桿點處形成該佈置之旋轉點。彈性拉桿12不具有進一步力作用且主要用於穩定砧座5之目的。一偏移限制構件14亦佈置於拱形8與彈性拉桿12之間且限制向上之偏移。
彈性體元件6由彈性體容座7固持，而彈性體容座7又被佈置於剛性印刷電路板2之容座3中。尤其如在圖2中所見，球形突出物9位於彈性體容座7中之凹陷中，球形突出物9之止擋邊緣14倚靠在彈性體容座7之上側上。於此情形下，RF觸點K1-K8之實際接觸區域15係在撓性印刷電路板4之拱形頂點處。
中間件16佈置在剛性印刷電路板2下方，而一彈簧彈性元件(未圖解說明，例如呈一簧片之形式)又佈置於該中間件下方。在已組裝狀態下，印刷電路板2隨後由該彈簧彈性元件施加預應力。
八個絕緣位移觸點K11-K18佈置於印刷電路板2之對置側上且藉由SMD狀觸點連接至印刷電路板2。絕緣位移觸 點K11-K18藉由導體跡線(未圖解說明)連接至相關聯RF觸點K1-K8，在每一情形下，K1連接至K11，K2連接至K12等。
為使因中間件16下方之彈簧彈性元件(未圖解說明)所致之印刷電路板2之偏移移動在SMD狀觸點情形下對焊接接合點不具有任何影響，插入式接頭1之外殼經設計以具有兩個部分。於此情形下，第一外殼部分21具有一針對匹配插入接頭30(見圖1)之接納開口且接納中間件16及彈簧彈性元件。第二外殼部分22接納絕緣位移觸點K11-K18，印刷電路板2固定地安裝於第二外殼部分22內。於此情形下，第一外殼部分21及第二外殼部分22彼此連接以便其可經由一樞軸承而移動，出於此目的，第一外殼部分21經設計以具有至少一個圓筒23且第二外殼部分22經設計以具有一互補容座24。因此，將印刷電路板2之偏移移動斷開。由於印刷電路板2之此偏移移動，現可將RF觸點K1-K8設計成相當短，乃因出於補償插入式接頭1及匹配插入接頭30之組件容差之目的，大部分所需之偏移移動僅藉由印刷電路板2之偏移移動即得到補償。
圖4以僅圖解說明切斷開之RF觸點K1-K8而未圖解說明撓性印刷電路板4之其餘部分之極簡化方式示例性圖解說明一使用兩個毗鄰RF觸點K1-K8來減少及補償近端串擾NEXT之基本原理。正面RF觸點具有一來自撓性基礎材料25之上側上接觸區域15之鍍金屬26，該鍍金屬在一接觸點27處產生一至剛性印刷電路板2之電連接，隨後該電連接 藉由一導體跡線被轉到SMD狀觸點。此外，另一鍍金屬28自下側上之接觸區域15轉到印刷電路板2上之另一接觸點29。彼處，若適合，可連接撓性印刷電路板4及/或剛性印刷電路板2上之另一導體跡線，但該導體跡線係開放式，亦即彼處不發生信號流。於此情形下，撓性基礎材料25上側上之鍍金屬26表示真實RF觸點K1-K8。如所見，正面RF觸點從左至右向上彎曲。然而，在背面RF觸點之情形下，此正好相反，亦即，電流攜載RF觸點僅具有一最小電容性耦合。隨後已減小之串擾還可經由下部鍍金屬28及相應導向導體跡線之非電流攜載路徑進一步得到補償，由於在接觸區域15處之直接補償過程，未發生相位差。因此，串擾與補償係同相。在接觸區域15上，於此情形下僅示意性地圖解說明匹配插入式接頭30之觸點31。然而，應注意以下事實：RF觸點K1-K8以相反方向向後彎曲並非絕對必要。
1‧‧‧插入式接頭
2‧‧‧剛性印刷電路板
3‧‧‧容座
4‧‧‧撓性印刷電路板
5‧‧‧砧座
6‧‧‧彈性體元件
7‧‧‧彈性體容座
8‧‧‧拱形
9‧‧‧球形突出物
11‧‧‧薄膜鉸鏈
12‧‧‧彈性拉桿
13‧‧‧框架結構
14‧‧‧止擋邊緣
15‧‧‧接觸區域
16‧‧‧中間件
21‧‧‧第一外殼部分
22‧‧‧第二外殼部分
23‧‧‧圓筒
24‧‧‧容座
25‧‧‧撓性基礎材料
26‧‧‧鍍金屬
27‧‧‧接觸點
28‧‧‧另一鍍金屬
29‧‧‧另一接觸點
30‧‧‧配合插入式接頭
31‧‧‧配合插入式接頭之觸點
K1‧‧‧RF觸點
K2‧‧‧RF觸點
K3‧‧‧RF觸點
K4‧‧‧RF觸點
K5‧‧‧RF觸點
K6‧‧‧RF觸點
K7‧‧‧RF觸點
K8‧‧‧RF觸點
K11‧‧‧絕緣位移觸點
K12‧‧‧絕緣位移觸點
K13‧‧‧絕緣位移觸點
K14‧‧‧絕緣位移觸點
K15‧‧‧絕緣位移觸點
K16‧‧‧絕緣位移觸點
K17‧‧‧絕緣位移觸點
K18‧‧‧絕緣位移觸點
上文已參照一較佳實例性實施例更詳細地闡述了本發明。在該等圖中：圖1顯示一已移除外殼之插入式接頭之一透視分解圖解說明；圖2顯示一穿過該插入式接頭之橫截面圖解說明；圖3顯示該插入式接頭之外殼之一側視圖；及圖4顯示接觸導向以相反方向彎曲之兩個毗鄰RF觸點之一示例性圖解說明。
1‧‧‧插入式接頭
2‧‧‧剛性印刷電路板
3‧‧‧容座
4‧‧‧撓性印刷電路板
5‧‧‧砧座
6‧‧‧彈性體元件
7‧‧‧彈性體容座
8‧‧‧拱形
9‧‧‧球形突出物
13‧‧‧框架結構
16‧‧‧中間件
30‧‧‧配合插入式接頭
K1‧‧‧RF觸點
K2‧‧‧RF觸點
K3‧‧‧RF觸點
K4‧‧‧RF觸點
K5‧‧‧RF觸點
K6‧‧‧RF觸點
K7‧‧‧RF觸點
K8‧‧‧RF觸點
K11‧‧‧絕緣位移觸點
K12‧‧‧絕緣位移觸點
K13‧‧‧絕緣位移觸點

Claims (10)

  1. 一種插入式接頭，其包括一外殼，一印刷電路板及RF觸點，該等RF觸點電連接至該印刷電路板，其中該等RF觸點(K1-K8)由一整體、撓性印刷電路板(4)形成，該等個別觸點(K1-K8)自該撓性印刷電路板(4)切斷開，一彈簧彈性元件(6)對該撓性印刷電路板(4)施加預應力；其中該撓性印刷電路板(4)佈置於一砧座(5)上且連接至該砧座(5)，該彈簧彈性元件(6)佈置於該砧座(5)下方。
  2. 如請求項1之插入式接頭，其中該彈簧彈性元件(6)呈一彈性體之形式。
  3. 如請求項1之插入式接頭，其中承載該撓性印刷電路板(4)之印刷電路板(2)經安裝以使其可經由另一彈簧彈性元件而移動。
  4. 如請求項3之插入式接頭，其中該外殼經設計以具有兩個部分，該彈簧彈性元件安裝於該第一外殼部分(21)內，該印刷電路板(2)固定地安裝於該第二外殼部分(22)內，且該等第一及第二外殼部分(21，22)彼此連接以便其可移動。
  5. 如請求項4之插入式接頭，其中該等第一與第二外殼部分(21，22)之間的連接呈一樞軸承之形式。
  6. 如請求項1之插入式接頭，其中至少兩個毗鄰觸點(K1-K8)朝向該接觸區域(15)以相反方向彎曲。
  7. 如請求項1之插入式接頭，其中額外電容形成在該撓性印刷電路板(4)上且補償串擾。
  8. 如請求項7之插入式接頭，其中該等電容形成一非電流傳導路徑。
  9. 如請求項3之插入式接頭，其中額外電容形成在該印刷電路板(2)上。
  10. 如請求項1之插入式接頭，其中該插入式接頭(1)呈一RJ45插座之形式。
TW096150659A 2007-02-06 2007-12-27 插入式接頭 TWI390798B (zh)

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US20100203763A1 (en) 2010-08-12
US20120164884A1 (en) 2012-06-28
WO2008095522A1 (de) 2008-08-14
US8435083B2 (en) 2013-05-07
TW200838038A (en) 2008-09-16
US8083551B2 (en) 2011-12-27
EP2118970A1 (de) 2009-11-18

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