TWI390087B - Method for manufacturing anode copper balls for electroplating - Google Patents

Method for manufacturing anode copper balls for electroplating Download PDF

Info

Publication number
TWI390087B
TWI390087B TW095104226A TW95104226A TWI390087B TW I390087 B TWI390087 B TW I390087B TW 095104226 A TW095104226 A TW 095104226A TW 95104226 A TW95104226 A TW 95104226A TW I390087 B TWI390087 B TW I390087B
Authority
TW
Taiwan
Prior art keywords
copper ball
copper
electroplating
oil
anode
Prior art date
Application number
TW095104226A
Other languages
English (en)
Chinese (zh)
Other versions
TW200700588A (en
Inventor
Masanori Yonoki
Shoji Nomura
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of TW200700588A publication Critical patent/TW200700588A/zh
Application granted granted Critical
Publication of TWI390087B publication Critical patent/TWI390087B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
    • B21K1/00—Making machine elements
    • B21K1/02—Making machine elements balls, rolls, or rollers, e.g. for bearings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW095104226A 2005-02-21 2006-02-08 Method for manufacturing anode copper balls for electroplating TWI390087B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005043952A JP4635639B2 (ja) 2005-02-21 2005-02-21 メッキ用アノード銅ボールの製造方法

Publications (2)

Publication Number Publication Date
TW200700588A TW200700588A (en) 2007-01-01
TWI390087B true TWI390087B (zh) 2013-03-21

Family

ID=36987363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104226A TWI390087B (zh) 2005-02-21 2006-02-08 Method for manufacturing anode copper balls for electroplating

Country Status (4)

Country Link
JP (1) JP4635639B2 (ko)
KR (1) KR101146552B1 (ko)
CN (1) CN1834293A (ko)
TW (1) TWI390087B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104846419B (zh) * 2015-05-06 2017-10-13 江苏金奕达铜业股份有限公司 一种铜球及其制备方法
CN113106456A (zh) * 2021-03-30 2021-07-13 金昌镍都矿山实业有限公司 一种压制生产的颗粒状铜阳极的后处理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61257488A (ja) * 1985-05-10 1986-11-14 Mitsubishi Shindo Kk 金属めつき板材および形材の製造法
JP3518947B2 (ja) * 1996-05-14 2004-04-12 三井化学株式会社 ボンベ内面の清浄処理方法
JP2000054199A (ja) * 1998-07-30 2000-02-22 Mitsubishi Materials Corp めっきアノード電極用銅または銅合金ボールの製造方法
JP2001032082A (ja) * 1999-07-22 2001-02-06 Hitachi Cable Ltd 銅管の製造方法
JP4123330B2 (ja) * 2001-03-13 2008-07-23 三菱マテリアル株式会社 電気メッキ用含燐銅陽極

Also Published As

Publication number Publication date
KR101146552B1 (ko) 2012-05-25
KR20060093282A (ko) 2006-08-24
JP4635639B2 (ja) 2011-02-23
CN1834293A (zh) 2006-09-20
JP2006225746A (ja) 2006-08-31
TW200700588A (en) 2007-01-01

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