TWI388729B - 用於真空泵浦之前級預處理 - Google Patents

用於真空泵浦之前級預處理 Download PDF

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Publication number
TWI388729B
TWI388729B TW094142673A TW94142673A TWI388729B TW I388729 B TWI388729 B TW I388729B TW 094142673 A TW094142673 A TW 094142673A TW 94142673 A TW94142673 A TW 94142673A TW I388729 B TWI388729 B TW I388729B
Authority
TW
Taiwan
Prior art keywords
vacuum
chamber
low pressure
processing
exhaust
Prior art date
Application number
TW094142673A
Other languages
English (en)
Chinese (zh)
Other versions
TW200632219A (en
Inventor
拜利 克里斯多夫Ｍ
柏格 麥可Ｓ
Original Assignee
艾德華真空公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/750,309 external-priority patent/US7278831B2/en
Application filed by 艾德華真空公司 filed Critical 艾德華真空公司
Publication of TW200632219A publication Critical patent/TW200632219A/zh
Application granted granted Critical
Publication of TWI388729B publication Critical patent/TWI388729B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B25/00—Multi-stage pumps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F04D19/046—Combinations of two or more different types of pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Treating Waste Gases (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Chemical Vapour Deposition (AREA)
TW094142673A 2003-12-31 2005-12-02 用於真空泵浦之前級預處理 TWI388729B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/750,309 US7278831B2 (en) 2003-12-31 2003-12-31 Apparatus and method for control, pumping and abatement for vacuum process chambers
US11/003,125 US7021903B2 (en) 2003-12-31 2004-12-03 Fore-line preconditioning for vacuum pumps

Publications (2)

Publication Number Publication Date
TW200632219A TW200632219A (en) 2006-09-16
TWI388729B true TWI388729B (zh) 2013-03-11

Family

ID=36565566

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142673A TWI388729B (zh) 2003-12-31 2005-12-02 用於真空泵浦之前級預處理

Country Status (7)

Country Link
US (1) US7021903B2 (https=)
EP (1) EP1817500B1 (https=)
JP (1) JP5996834B2 (https=)
KR (1) KR101194511B1 (https=)
CN (1) CN100587264C (https=)
TW (1) TWI388729B (https=)
WO (1) WO2006060275A2 (https=)

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US9240308B2 (en) * 2014-03-06 2016-01-19 Applied Materials, Inc. Hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system
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JP6418838B2 (ja) * 2014-07-31 2018-11-07 エドワーズ株式会社 ドライポンプ及び排ガス処理方法
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GB2584881B (en) * 2019-06-19 2022-01-05 Edwards Vacuum Llc Multiple vacuum chamber exhaust system and method of evacuating multiple chambers
CN113948415A (zh) * 2020-07-17 2022-01-18 中国科学院微电子研究所 一种回收装置、回收方法和回收系统
KR102300561B1 (ko) * 2020-07-31 2021-09-13 삼성전자주식회사 증착 시스템 및 공정 시스템
US12060637B2 (en) 2020-12-01 2024-08-13 Applied Materials, Inc. Actively cooled foreline trap to reduce throttle valve drift
JP7502217B2 (ja) * 2021-02-26 2024-06-18 株式会社荏原製作所 真空排気方法および真空排気システム
KR102583557B1 (ko) * 2021-05-26 2023-10-10 세메스 주식회사 기판 처리 설비의 배기 장치 및 배기 방법
KR20230025590A (ko) * 2021-08-13 2023-02-22 삼성디스플레이 주식회사 배출 방법, 배출 시스템 및 이를 포함하는 기판 처리 장치
CN116110814A (zh) * 2021-11-11 2023-05-12 细美事有限公司 基板处理装置
CN114975183B (zh) * 2022-05-31 2025-09-16 北京北方华创微电子装备有限公司 半导体工艺设备的补水控制方法和半导体工艺设备
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Also Published As

Publication number Publication date
EP1817500A2 (en) 2007-08-15
EP1817500A4 (en) 2012-09-12
US7021903B2 (en) 2006-04-04
KR20070085630A (ko) 2007-08-27
CN101069017A (zh) 2007-11-07
JP5996834B2 (ja) 2016-09-21
WO2006060275A2 (en) 2006-06-08
KR101194511B1 (ko) 2012-10-25
WO2006060275A3 (en) 2006-08-17
TW200632219A (en) 2006-09-16
CN100587264C (zh) 2010-02-03
EP1817500B1 (en) 2014-07-30
JP2010504847A (ja) 2010-02-18
US20050142010A1 (en) 2005-06-30

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