TWI381037B - An electrically conductive particles having an insulating particle, an anisotropic conductive material, and a connecting structure - Google Patents

An electrically conductive particles having an insulating particle, an anisotropic conductive material, and a connecting structure Download PDF

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Publication number
TWI381037B
TWI381037B TW100126845A TW100126845A TWI381037B TW I381037 B TWI381037 B TW I381037B TW 100126845 A TW100126845 A TW 100126845A TW 100126845 A TW100126845 A TW 100126845A TW I381037 B TWI381037 B TW I381037B
Authority
TW
Taiwan
Prior art keywords
particles
conductive
insulating
insulating particles
conductive particles
Prior art date
Application number
TW100126845A
Other languages
English (en)
Chinese (zh)
Other versions
TW201213493A (en
Inventor
Shigeo Mahara
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201213493A publication Critical patent/TW201213493A/zh
Application granted granted Critical
Publication of TWI381037B publication Critical patent/TWI381037B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
TW100126845A 2010-07-28 2011-07-28 An electrically conductive particles having an insulating particle, an anisotropic conductive material, and a connecting structure TWI381037B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010169502 2010-07-28
JP2010169503 2010-07-28

Publications (2)

Publication Number Publication Date
TW201213493A TW201213493A (en) 2012-04-01
TWI381037B true TWI381037B (zh) 2013-01-01

Family

ID=45530129

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100126845A TWI381037B (zh) 2010-07-28 2011-07-28 An electrically conductive particles having an insulating particle, an anisotropic conductive material, and a connecting structure

Country Status (5)

Country Link
JP (4) JP5025825B2 (ja)
KR (1) KR101242235B1 (ja)
CN (1) CN102884590B (ja)
TW (1) TWI381037B (ja)
WO (1) WO2012014925A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740807B (zh) * 2014-10-29 2021-10-01 日商迪睿合股份有限公司 導電材料、連接構造體、及連接構造體之製造方法

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0250858A (ja) * 1988-08-12 1990-02-20 Tokyo Electric Co Ltd 印刷装置
JP5821552B2 (ja) * 2011-11-10 2015-11-24 日立化成株式会社 撥水性導電粒子、異方導電材料及び導電接続構造体
KR101987509B1 (ko) * 2012-01-19 2019-06-10 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6188456B2 (ja) * 2012-07-03 2017-08-30 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6438186B2 (ja) * 2012-09-06 2018-12-12 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6212374B2 (ja) * 2012-12-05 2017-10-11 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
JP6357347B2 (ja) * 2013-05-14 2018-07-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6357348B2 (ja) * 2013-05-22 2018-07-11 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6426913B2 (ja) * 2013-05-29 2018-11-21 積水化学工業株式会社 突起粒子、導電性粒子、導電材料及び接続構造体
JP6392617B2 (ja) * 2013-10-02 2018-09-19 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6453032B2 (ja) * 2013-10-21 2019-01-16 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6450154B2 (ja) * 2013-11-12 2019-01-09 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6397316B2 (ja) * 2013-11-18 2018-09-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6739894B2 (ja) * 2013-11-18 2020-08-12 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6119718B2 (ja) * 2013-11-19 2017-04-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
WO2015105119A1 (ja) * 2014-01-08 2015-07-16 積水化学工業株式会社 バックコンタクト方式の太陽電池モジュール用導電性粒子、導電材料及び太陽電池モジュール
CN105917418B (zh) * 2014-01-08 2018-02-13 积水化学工业株式会社 背接触式太阳能电池模块用导电性粒子、导电材料及太阳能电池模块
KR20160106007A (ko) * 2014-01-08 2016-09-09 세키스이가가쿠 고교가부시키가이샤 백 콘택트 방식의 태양 전지 모듈의 제조 방법
EP2942129B1 (de) * 2014-05-05 2017-07-05 Heraeus Deutschland GmbH & Co. KG Metallpaste und deren Verwendung zum Verbinden von Bauelementen
JP6564302B2 (ja) * 2014-10-28 2019-08-21 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
WO2017051842A1 (ja) * 2015-09-24 2017-03-30 積水化学工業株式会社 導電性粒子、導電材料、および接続構造体
KR102019298B1 (ko) * 2016-07-04 2019-09-06 가부시키가이샤 스즈키 전사 방법 및 실장 방법
CN110520938B (zh) * 2017-05-08 2021-10-08 日本化学工业株式会社 包覆颗粒及其制造方法
JP7062555B2 (ja) * 2018-08-27 2022-05-06 日本化学工業株式会社 被覆粒子

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03112011A (ja) * 1989-09-26 1991-05-13 Catalysts & Chem Ind Co Ltd 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
JPH04259766A (ja) * 1991-02-14 1992-09-16 Hitachi Chem Co Ltd 回路の接続部材
JP2010073578A (ja) * 2008-09-19 2010-04-02 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2010103080A (ja) * 2008-03-27 2010-05-06 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR20040052126A (ko) * 2002-12-13 2004-06-19 엘지전선 주식회사 이방 도전성 접착제, 이를 이용한 회로 접속 방법 및 회로접속 구조체
JP4724369B2 (ja) * 2003-09-29 2011-07-13 ソニーケミカル＆インフォメーションデバイス株式会社 導電粒子の製造方法
JP5529431B2 (ja) * 2008-03-27 2014-06-25 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03112011A (ja) * 1989-09-26 1991-05-13 Catalysts & Chem Ind Co Ltd 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
JPH04259766A (ja) * 1991-02-14 1992-09-16 Hitachi Chem Co Ltd 回路の接続部材
JP2010103080A (ja) * 2008-03-27 2010-05-06 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2010073578A (ja) * 2008-09-19 2010-04-02 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740807B (zh) * 2014-10-29 2021-10-01 日商迪睿合股份有限公司 導電材料、連接構造體、及連接構造體之製造方法

Also Published As

Publication number Publication date
KR20120124075A (ko) 2012-11-12
JP2012124169A (ja) 2012-06-28
TW201213493A (en) 2012-04-01
JP5850752B2 (ja) 2016-02-03
JPWO2012014925A1 (ja) 2013-09-12
JP5850806B2 (ja) 2016-02-03
JP5025825B2 (ja) 2012-09-12
WO2012014925A1 (ja) 2012-02-02
JP2012234821A (ja) 2012-11-29
CN102884590B (zh) 2014-01-15
JP2012094541A (ja) 2012-05-17
KR101242235B1 (ko) 2013-03-11
CN102884590A (zh) 2013-01-16
JP4977276B2 (ja) 2012-07-18

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