TWI377340B - Inspecting apparatus - Google Patents

Description

1377340 IX. Description of the Invention: [Technical Field] The present invention relates to an inspection apparatus, and more particularly to an inspection apparatus for inspecting a defect of a 3-dimensional shape generated on a surface of an article. [Prior Art] In the past, in the manufacture of a chip size package (hereinafter referred to as CSP) in which the external dimensions of a semiconductor device are miniaturized to the outer dimensions of a semiconductor device, a proposal has been made which is used. A tape (hereinafter referred to as csp tape) which is formed by repeating a pattern corresponding to one wafer to be formed several times, and a large number of packages are manufactured at one time. The CSP tape is a long-sized tape which is formed by forming a conductive film such as a copper foil on a surface of a substrate such as a polyimide substrate by vapor deposition, and then wiring the CSP using a general etching technique. The pattern of the electrode, the beam lead, and the through hole is repeatedly patterned and produced several times. A check has been made as to whether or not the metal pattern formed on such a CSP tape is good. For example, Patent Document 1 discloses that a light beam is irradiated from below the CSP glue*, and the transmitted light is photographed by a camera. The technique of conducting inspections. In addition, a proposal has been made for the detection of defects such as defects in the dust-repellent agent pattern portion attached to the csp tape portion, for example, as disclosed in Patent Document 2, which is shot from above the CSP tape. Hit, 丨,, tens of thousands, and shoot nine beams, use the camera to shoot reflected light, and use this to detect the technology. [Patent Document 1] Japanese Patent Application Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. However, in the case of a defect of a three-dimensional shape such as a pit generated on a metal pattern formed on a tape-like substrate such as a CSP tape, the inspection technique has not been established, and the above-described prior art cannot detect the defect of the three-dimensional shape with high precision. The present invention is to solve the above problems, and the developer aims to provide

- A defect that can detect the 3-dimensional shape produced on the surface of the article with high precision. [Technical means for solving the problem] In order to achieve the above object, the invention of claim 1 includes an inspection mechanism including: a plurality of illumination mechanisms that illuminate an inspection object from different directions, and a photographing mechanism, JL The mountain re-photographing is performed by the plurality of illumination mechanisms, and each of the images generated by the first inspection is reflected on the inspection object; and the detection mechanism is obtained from the photographs taken by the photographing and photographing mechanism. In the image, the defect of the 3 dimensional shape is detected.

The irradiation unit may include an oblique irradiation mechanism of the present invention, which includes a first illumination device that irradiates the inspection object from the first oblique direction, a radiation mechanism, and a second illumination that irradiates the inspection object from the second oblique direction. In the organization, the illuminating object is irradiated to the inspection object from the top at the timing of the oblique irradiation mechanism. By illuminating the oblique illuminating mechanism and the coin J... and the illuminating mechanism at different timings, it is possible to separate the 料 昭 昭 的 的 的 Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ 在 在 在 在 在 在 在 在 在 在 在 在The image of the first captured image and the illumination of the third illumination unit 131466.doc 1377340 image taken by the light reflected on the inspection object. In this case, the detecting means extracts a region outside the specific range of the second range from the image captured by the photographing means when the light is irradiated by the oblique illumination means, and when the light is irradiated by the upper irradiation means In the image captured by the photographing mechanism, an area outside the second specific range is extracted, and a defect of a three-dimensional shape is detected based on each of the captured regions. The first specific range as used herein refers to a range of the concentration level of a region in which an image of a defect of a three-dimensional shape is not generated in an image which is irradiated with light by an oblique illumination means. In addition, the second specific range is a range of the concentration level of the region where the defect of the three-dimensional shape is not generated in the image captured by the third illuminating means when the light is irradiated. The light path of the light reflected on the inspection object varies depending on the 3-dimensional shape of the inspection object. Therefore, when the inspection object produces a defect of a 3-dimensional shape, in the captured image, the defect level of the 3-dimensional shape has a different concentration level than the other regions. In this way, the defect of the 3-dimensional shape can be detected by extracting the region outside the concentration level range of the region where the captured image has a defect level of the defect of the 3 dimensional shape. In addition, when the inspection object does not produce a defect of a 3-dimensional shape, the density level in the captured image differs depending on the direction of the light that is incident on the inspection object. Therefore, as long as the plurality of images captured by the respective objects reflected by the inspection object are irradiated from different directions, the concentration level is extracted outside the specific range, that is, the defect of the 3-dimensional shape is improved. Detection accuracy. For example, when photographed by a shooting mechanism when irradiating light with an oblique illumination mechanism, 131466.doc

In the /J4U image, the area where the concentration level is outside the first specific range is excavated, and in the image taken by the photographing mechanism when the light is irradiated by the upper irradiation means, the level of the mating level is the second specific range. In the outer region, when the regions captured are substantially the same position, it can be determined that the region is a defect region of a 3-dimensional shape. Further, it is possible to further include a fourth irradiation unit that irradiates the inspection target from below at the same timing as the third irradiation mechanism. Further, the 'multiple illumination mechanisms may be configured to illuminate different colors of light. Under the If; brother, the respective images can be separated by color. The detecting means detects an area outside the specific I level from each of the images captured by the photographing means, and detects at least one of the positional relationship and the shape of each of the occupied areas. Defects in the shape of the dimension. The characteristic range of the ? stomach here is a range of the concentration level of the region where the defect of the 3 dimensional shape is not generated in the image captured by the irradiation means when the light is irradiated. For example, in an image captured when the light is irradiated by the illumination means that irradiates light from one side of the inspection object, an area outside the specific range is extracted, and the light is irradiated on the other side of the inspection object. In the image captured by the illumination unit when the light is irradiated, the concentration level is extracted outside the specific range, and the distance between the respective regions is determined, thereby determining whether or not a defect of the 3 dimensional shape is generated. It is also possible to determine whether or not a defect of a 3-dimensional shape is generated based on the characteristics of the shape of the captured region. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 131466.doc <First Embodiment> As shown in Fig. 1, the inspection apparatus 10 of the first embodiment includes a tape supply unit 12, a winding unit μ, and the like, and is inspected and transported by the tape supply unit 12. The CSP tape 16' is wound around the winding unit 14. (Tape Supply Unit) The tape supply unit 12 includes a take-up side reel 22 that holds the csp tape 16 and the spacer tape 18 which are repeatedly formed by a plurality of package patterns to form a roll of the CSP reel 20 And a side-out spacer shaft 24 that winds and holds the spacer tape 18 that is rolled out together with the CSP tape 16. A guide member 6 for changing the conveying direction of the cSp tape 16 is disposed on the delivery side of the CSP reel 20. Further, the CSP tape 16 of the present embodiment is formed by forming a metal pattern such as a copper foil by patterning a surface of a base tape made of a light-transmissive synthetic tree, and further forming an insulating resist pattern thereon. . (Winding Unit) The winding unit 14 includes a winding side spacer shaft 28 that holds a roll-shaped spacer tape 18, and a winding side spool 30 that winds the spacer tape 18 together and inspects it. Csp tape 16 people. Further, on the tape winding side of the winding side reel 30, a guide 32 for changing the conveying direction of the cSP tape 16 is disposed. Between the tape supply unit 12 and the winding unit 14, a short guide wheel 34 that forms a conveying path of the CSP tape 16 is disposed in sequence; a first conveying roller 36; a second conveying roller 38; a long guide wheel 40; 42, 44, 46, 48; and short guide wheels 50. Further, the first transport roller 36 and the second transport roller 38 are arranged in parallel with each other between the first transport roller 36 and the second transport roller 38, and are provided with a first scanning table 52 and a second scanning table. %. (First scanning stage) As shown in Fig. 2, the first scanning stage 52 is provided with a table 54. Air is ejected from the table 54 to the CSP tape 16 and a thin layer of air is formed between the CSP tape 16 and the table 54. Each of the respective pressing rollers 56 is configured such that each of the freely rotatable driven rollers abuts against the upper surface of the csp knee band 16 to restrict the csp tape 16 from moving upward. Further, from the guide member 26, the short guide pulley 34, the long guide pulley 4, the guide members 42, 44, 46, 48 and the short guide pulley 5 (), air is also ejected to the kennel belt 16 while in the CSP. A thin layer of air is formed between the tape 16 and the components. As shown in Fig. 2, an image reading unit is disposed directly above the center portion of the CSP tape 16 in the transport direction of the table 54, and includes a lens brother and a CCD line sensor 6 as an imaging mechanism. The CCD line sensor is arranged with pixels in the width direction of the tape 16 (the front and back directions of the paper of the circle 2). . Further, on the upstream side in the transport direction of the CSP tape 16, a first illumination means (line light source) 62 which is guided by a single dotted line and a lower illumination light irradiated to the (10) line (4) is disposed. Below the transport direction of the CSP tape 16, a fourth (four) shooting mechanism, that is, a second illumination device (line light source) 64, which is irradiated to the lower side of the coffee line sensor 6 () in accordance with the optical path L2 indicated by the one-dot chain line is disposed. . The first irradiation device 62 and the second irradiation device 64 are configured to include a plurality of LEDs (not shown) disposed along the width direction of the 131466.doc 1377340 CSP tape 16 and to direct the light beam emitted from the LED toward the CSP tape 16 . A light guide plate that is linearly illuminated (not shown). Here, the second illumination device 62iLED and the second illumination device emit light beams of the same color with the LED system. Further, the respective light beams are irradiated toward one point when viewed from the lateral side in the tape conveying direction. As a result, the respective light beams are superposed on the surface (upper surface) of the csp tape η and are irradiated in a line shape toward the tape width direction. The CSP tapes 16 are hung on the respective conveying rollers 56, and are conveyed at a constant speed in a single direction by the respective conveying rollers 56, and are photographed by the image reading unit when passing through the table 54. The surface of the tape μ. Next, an image taken by the first scanning stage 52 will be described. The reflected light that is reflected by the first irradiation device 62 and the second irradiation device 64 and reflected by the CSP tape 16 will be described with reference to Fig. 3 . On the CSP tape 16 shown in Figs. 3(A) and (c), a defect of a three-dimensional shape is generated. Further, as shown in Figs. 3(A) and (C), the present embodiment is described by taking a v-shaped pit as an example. However, the shape of the pit to be inspected by the inspection apparatus 1 is not limited to the V-shape. Fig. 3(A) shows an optical path of a light beam which is irradiated onto the CSP tape 16 by the first irradiation device 62 from the upstream side in the transport direction of the cSP tape 16. The arrow A1 indicates an optical path in a case where the light beam irradiated by the first irradiation device 62 is reflected in a region where no pit is generated. As indicated by the arrow gossip, the reflected light reflected in the area where the pit is not generated travels in a direction inclined with respect to the optical axis of the CCD line sensor 6, so that the light incident on the CCD line sensor 60 is 131466. .doc 12 1377340 Less in quantity. The arrow A2 indicates an optical path in a case where the light beam irradiated by the first irradiation device 62 is reflected by the slope area on the side of the pit. As indicated by the arrow A2, the reflected light reflected on the sloped surface on the upstream side of the pit travels in a direction substantially perpendicular to the optical axis of the CCD) line sensor 60, and thus is incident on the ccd line sensor 60. The amount of light is small.

The arrow A3 indicates an optical path in a case where the light beam irradiated by the first irradiation device 62 is reflected by the slope area on the side below the pit. As indicated by an arrow VIII, the reflected light reflected on the slope area on the downstream side of the pit travels along the optical axis of the CCD line sensor 60, so that the amount of light incident on the CCD line sensor 6 is large. Fig. 3(B) shows an outline of the change in the amount of light of the light beam which is irradiated by the second irradiation device 62 and reflected by the csp tape 16 and incident on the CCD line sensor 60. The horizontal axis indicates the position of the CSP tape 16 in the transport direction, and the vertical axis indicates the amount of light. above

The amount of light reflected in the slope area of the swimming side is small, and the amount of light reflected in the slope area of the downstream side is large. Next, the case where the CSP tape 16 is irradiated from the downstream side in the transport direction of the tape 16 by the second irradiation farm 64 will be described. Fig. 3(C) shows the optical path of the light beam irradiated by the second irradiation device 64^104 and reflected on the CSP tape 16. The arrow A4 indicates an optical path in a case where the light beam irradiated by the second irradiation device r·u 64 64 is reflected in a region where no pit is generated. R^Ac of the pit: As the front head A4 does not, in the absence of the reflected light of the concave & field reflection, the light uranium tilts toward the yaw axis of the CCD line sensor 60, due to incidence Light to the CCD line sensor 60 13l466.doc -13 - 1377340 The arrow Α5 indicates an optical path in a case where the light beam irradiated by the second irradiation device 64 is reflected on the slope area on the upstream side of the pit. As indicated by the arrow Α5, the reflected light reflected in the slope area on the upstream side of the pit travels along the optical axis of the Ccd line sensor 60, so that the amount of light incident on the CCD line sensor 6 is large. The arrow A6 indicates an optical path in a case where the light beam irradiated by the second irradiation device 64 is reflected by the slope area on the side below the pit. As indicated by the arrow A6, the reflected light 'reflected on the sloped surface on the downstream side of the pit will travel in a direction substantially perpendicular to the optical axis of the Ccd line sensor 60, and thus is incident on the light of the ccD line sensor 60. Less. Fig. 3(D) shows an outline of the change in the amount of light of the light beam which is reflected by the second irradiation device 64 and reflected by the CSP tape 16 and incident on the CCD line sensor 60. The horizontal axis indicates the position of the CSP tape 16 in the transport direction, and the vertical axis indicates the amount of light. The amount of light reflected in the sloped area on the upstream side is large, and the amount of light reflected in the sloped area on the downstream side is small. The CCD line sensor 60 transmits an image signal corresponding to the amount of incident light to a computer 82 as a detecting means (refer to Fig. 1). The computer 82 reads the image signal transmitted from the CCD line sensor 60, performs image processing, and inspects the CSP tape 16. As described above, the amount of light that is reflected by the first irradiation device 62 and reflected by the slope area on the downstream side in the pit area and incident on the CCD line sensor 6 is large. Further, the amount of light that is reflected by the second irradiation device 64 and reflected by the sloped region on the upstream side in the region of the pit and incident on the CCI) line sensor 60 is large. Therefore, from the first photo 131466.doc 1377340, both the illuminating device 62 and the second illuminating device 64 illuminate the smear 1 ..-and "barrier, the pit area is generated compared to the region where the pit is not generated w ·»· Field*', the amount of light incident on the CCD line sensor 60 will be relatively large. Due to this, the computer 82 detects the pit from the captured region by extracting the region of the image obtained by the first scanning station 52 from the region where the density level is lower than the specific value. °° In addition, the computer 82 can display an image on the display 84, etc. The CSP tape 16 that is not photographed.

In addition, the configuration of the first irradiation device and the second irradiation device is set to be in the opposite direction to the downstream side of the transport direction of the csp tape with respect to the CCD line sensor, but The irradiation device and the second irradiation may be provided at an opposite position centering on the CCD line sensor, and may be, for example, an opposite position in the width direction of the CSP tape. (Second scanning station) From the work table As shown in Fig. 4, the table 68 is placed in the second scanning table 66. The table 68 will eject air to the CSP tape 16 and form a thin layer of air between the CSP tapes 16 and 68.

Further, the respective pressing rollers 70 are driven rollers that are freely rotatable, and abut against the upper surface of the CSP tape 16 to restrict the CSP tape 16 from moving upward. As shown in Fig. 4, an image reading unit including a lens 72 and a ccd linear sensor 74 is disposed directly above the center portion of the CSP tape 16 in the transport direction of the table 68. The CCD line sensor 74 is arranged with pixels arranged in the width direction of the CSP tape 16 (in the front and back directions of the sheet of Fig. 4). Further, above the table 68, a third 131466.doc -15-1377340 irradiation device (line light source) 76 and a half mirror 78 as a third irradiation means are provided, and a light beam is irradiated at right angles to the CSP tape 16. The epi-illumination unit. Further, in the table 68, a transmitted light irradiation device (line light source) 80 that irradiates a light beam from the back surface of the CSP tape 16 is disposed. The epi-illumination unit and the transmitted-light irradiation unit 8 illuminate the light beam along the optical axis L3 of the CCD line sensor 74 indicated by a single dotted line. The third irradiation device 76 and the transmitted light irradiation device 80 include a plurality of LEDs arranged along the width direction of the CSP tape 16 and a light guide plate that irradiates the light beam emitted from the LEDs toward the CSP tape 16 in a line shape. Here, the LED of the third irradiation device 76 and the led of the transmitted light irradiation device 80 are irradiated with light beams of the same color. Further, the third irradiation device 76 and the transmitted light irradiation device 8 are irradiated with light beams toward one point when viewed from the lateral side in the tape conveying direction. As a result, on the surface (upper surface) of the CSP tape 16, a light beam is irradiated in a line shape in the width direction of the csp tape 16 on the back surface (below), and the light beam irradiation position on the surface (top surface) is opposite. The light beam is irradiated in a line shape in the width direction of the csp tape 丨6. The CSP tapes 16 are hung on the respective conveying rollers 7 ,, and are conveyed at a constant speed in one direction by the respective conveying rollers 70, and are photographed by the image reading unit when passing through the table 68. On the surface 0 of the CSP tape 16, the light beam irradiated by the third irradiation device 76 is partially reflected by the metal pattern portion of the csp tape μ, and is transmitted through a portion other than the metal pattern portion (hereinafter referred to as a base portion). Further, the light beam irradiated by the transmitted light irradiation means is not partially transmitted through the metal pattern of the csp tape 16, but is partially transmitted through the base portion of 131466.doc 1377340. In the present embodiment, for example, when the image is set to a high concentration of ～250 (low concentration), the irradiation of the third illuminating device 2 is adjusted so that the metal pattern portion is about 2 之. At the concentration level, the base portion becomes a concentration level of about 1 。. In this way, the metal pattern portion and the base portion can be distinguished in the image obtained by the second scanning stage 66. Further, when the irradiation of the third irradiation device % and the transmitted light irradiation device 80 is adjusted as described above, the region of the pit is a concentration level of about 5 。.

Further, the epi-illumination unit is configured to include a third irradiation device and an I-mirror. However, the present invention is not limited thereto, and any beam irradiation unit may be used to irradiate the light beam substantially along the optical axis of the coffee-line sensor. Next, an image obtained by the second scanning stage 66 will be described. The reflected light that is irradiated by the third irradiation device 76 and reflected in the metal pattern portion of the csp tape 16 will be described with reference to Fig. 5 . A pit is formed in the metal pattern portion of the csp tape 16 shown in Fig. 5(A). Moreover, as shown in FIG. 5(A), this is

The configuration is described by taking a V-shaped pit as an example, but the shape of the pit to be inspected by the inspection device 1 is not limited to the V shape. Fig. 5(A) shows an optical path of a light beam which is irradiated from above the CSP tape 16 by the third irradiation device 76 and reflected in the metal pattern portion of the CSP tape 16. The arrow A7 indicates an optical path in a case where the light beam irradiated by the third irradiation device 76 is reflected in a region where no pit is generated. As indicated by the arrow A7, the reflected light 'reflected in the region where no pit is generated travels along the optical axis of the CCD line sensor 74, so that the amount of light incident on the CCD line sensor 74 is large. The arrow A8 and the arrow A9 indicate the optical path in the case where the light beam irradiated by the third irradiation device 76 is reflected in the slope area of the pit of 131466.doc • 17· 1377340. As indicated by the arrow A8 and the arrow A9, the reflected light reflected in the slope area of the pit travels in a direction inclined with respect to the optical axis of the CCD line sensor 60, and thus the amount of light incident on the CCD line sensor 74 is less. Fig. 5(B) shows an overview of the change in the amount of light of the light beam incident on the CCD line sensor 74 by the third irradiation device 76 and reflected by the metal portion of the CSP tape 16. The horizontal axis represents the position of the reflected CSP tape 16, and the vertical axis represents the amount of light. It can be seen from the figure that the amount of light reflected in the region other than the pit is large, and the amount of light reflected in the pit region is small. The CCD line sensor 74 transmits an image signal corresponding to the amount of incident light to the computer 82. The computer 82 reads the image signal transmitted from the CCD line sensor 74, performs image processing, and inspects the CSP tape 16. As described above, when the light beam is irradiated from above the table 68, the amount of light incident on the CCD line sensor 60 is small when reflected in the pit area. Therefore, the computer 82 picks up an area in which the density level is higher than a specific value from the image obtained in the second scanning stage 66, and detects the pit based on the captured area. Referring next to Figure 6, the features of the image.

6(B) is obtained on the second scanning stage 66. The first scanning stage 52 and the second scanning stage 66 are obtained. > A low area TP indicates a pit. An example of a picture. Dark band area 13I466.doc •18· 1377340 TB denotes a pattern portion, a bright band-shaped region tm denotes a metal pattern portion, and a region ΤΜ ρ on the region 浓度 concentration level is significantly higher than the circumference. Thus, when the pit is created, the first! The area in which the concentration level is lower than the circumference in the image obtained by the scanning stage 52, and the area in which the concentration level in the image obtained by the second scanning stage 66 is higher than the circumference is substantially the same. On the other hand, Figs. 6(C) and (D) show an example of an image of a region where dust or the like adheres. Fig. 6(C) shows an example of an image obtained on the i-th scanning stage 52. The bright strip-shaped area TB represents the base portion, and the dark strip-shaped area 7] represents the metal pattern portion. In the area TM, there is no area where the concentration levels are significantly different. As a result, in the image obtained by the first scanning stage 52, there is little possibility that the image corresponding to the area where the dust or the like adheres has a significantly lower concentration level. FIG. 6(D) shows an example of an image obtained by the second scanning stage 66. The dark strip region TB indicates the base portion, the bright strip region TM indicates the metal pattern portion, and the region TM on the region TM is significantly higher than the surrounding region td indicating dust or the like. When J: 匕' is attached to the image obtained by the second scanning stage 66 in the metal pattern portion, the concentration level of the portion where the dust or the like adheres may become high. As is apparent from the above description, the image obtained by the i-th scanning stage 52 may be detected as a pit having a low density level and a density in the image obtained by the second scanning stage 66. Therefore, the computer 82 only needs to extract an area where the intensity level is significantly lower from the image found by the first scanning station, and the concentration level obtained from the image obtained by the second scanning station is significantly higher. In the high area, (4) each area taken 13l466.doc •19· 1377340 when the position is approximately the same, it can be determined that the area is a pit. In this way, it is possible to surely detect the 3 defects generated in the metal pattern portion. (Marking Unit) As shown in Fig. 1, a marking unit 86' is disposed between the guide 44 and the guide 46, and is attached to a predetermined position of the package pattern detected as defective. "/, it is necessary to use the image obtained by reflecting light from the oblique direction of the csp tape and the image obtained by reflecting the light from above the csp tape to obtain a high-precision inspection. Defects in the 3-dimensional shape produced on the metal pattern on the [pi] tape. <Second Embodiment> Next, an inspection apparatus according to a second embodiment of the present invention will be described. In the first embodiment, the IT shape in which the defect of the ternary shape generated in the metal pattern portion is inspected based on the respective images obtained by the two scanning stations will be described. However, in the second embodiment, A description will be given of a case where a defect in a three-dimensional shape generated in a metal pattern portion is inspected by an image obtained by a scanning platform. The differences from the first embodiment will be described below. As shown in Fig. 7, the inspection apparatus 1 of the second embodiment is provided with a scanning table 1〇2 between the first transport roller 36 and the second transport roller 38. (Scanning Station) As shown by the circle 8, the scanning table 102 is provided with a table 1〇4. From the workbench 1〇4 I31466.doc -20- 1377340, air is ejected to the CSP strip 16 and a thin layer of air is formed between the CSP tape 16 and the table 104. Further, each of the pressing rollers 106 is a freely rotatable driven roller that abuts against the upper surface of the CSP tape 16 to restrict the csp tape 16 from moving upward. As shown in Fig. 8, an image reading unit including a lens log and a color CCD line sensor 11 is disposed directly above the center portion of the csp tape cassette 6 in the transport direction of the table 1〇4. In the upstream side of the transport direction of the csp tape 16, an R color light irradiation device (line light source) 丨12 is disposed, which is irradiated with an r-color beam below the CCD line sensor 60; in the csp tape 丨6 On the downstream side in the transport direction, a B-color light irradiation device (line light source) 丨丨4 is disposed, which is irradiated with a B-color beam below the CCD line sensor 60. Each of the R color light irradiation device 112 and the B color light irradiation device 14 is irradiated with light beams of respective colors along the optical paths LR and LB indicated by dashed-dotted lines. The R color light irradiation device 112 and the B color light irradiation device 114 include a plurality of LEDs arranged in the width direction (the front and back directions of the paper surface of FIG. 8) of the CSP tape 16 and the light beam irradiated from the LEDs toward the CSP. The tape 16 is irradiated with a light guide plate in a line shape. Here, the LED of the R color light irradiation device 112 illuminates a red (R) light beam, and the LED of the B color light irradiation device 11 4 illuminates a blue (B) light beam. Further, the R color light irradiation device 112 and the B color light irradiation device 114 are irradiated toward one point when viewed from the lateral side in the tape transport direction. As a result, the red light beam and the blue light beam are superposed on the surface (top surface) of the CSP tape 16 and lined in the width direction of the tape. 131466.doc 1377340 Further, the CCD line sensor 110 has pixels (RGB) arranged in the width direction of the CSP tape 16. The CSP tapes 16 are hung on the respective conveying rollers 1〇6, and are conveyed at a constant speed in a single direction by the respective conveying rollers 106 to be photographed by the image reading unit when passing through the table 104. The surface of the tape. Next, an image obtained at the scanning station 1 〇 2 will be described. Fig. 9 shows an optical path of a light beam which is irradiated to and reflected by the CSP tape 16 by each of the R color light irradiation device 112 and the B color light irradiation device 114, and the captured image β. First, referring to Fig. 9(A), pits are generated for irradiation. The case of the csp tape 16 will be described. Further, as shown in Fig. 9(A), the present embodiment is described by way of example, but the shape of the pit to be inspected by the inspection device 1 is not limited to a V shape. The arrow R1 indicates the optical path of the case where the chromatic color beam irradiated by the R color light irradiation device 112 is reflected in the region where the pit is not generated. As shown by the arrow ^, the reflected light reflected in the area where no pit is generated will travel obliquely toward the optical axis of the CCD line sensor, so that the amount of light incident on the CCD line sensor 11 is less. R2 denotes an optical path in a case where the R color light beam irradiated by the R color light irradiation device 112 is reflected on the slope area on the downstream side of the pit. As indicated by the arrows, the reflected light reflected by the slope area on the downstream side of the pit travels along the optical axis of the CCD line sensor i 10, so that the amount of light incident on the line sensor 110 is large. 131466.doc -22· 1377340 The arrow R3 indicates an optical path in a case where the R color light beam irradiated by the r color light irradiation device i 12 is reflected on the slope area on the upstream side of the four pits. As indicated by the arrow R2, the reflected light reflected on the sloped surface on the upstream side of the pit travels in a direction substantially perpendicular to the optical axis of the CCD line sensor 110, and thus is incident on the CCD line sensor 11 The amount of light is very small. Therefore, a shadow appears in the area corresponding to the bevel area on the upstream side of the stencil image. The arrow B1 indicates an optical path in a case where the b-color light beam irradiated by the B color light irradiation device Π4 is reflected in a region where no pit is generated. As indicated by the arrow Β, the reflected light reflected in the area where no pit is generated will travel obliquely to the optical axis of the C cd line sensor 11 ,, so that the amount of light incident on the CCD line sensor n 少 is small. The arrow B2 indicates an optical path in a case where the b-color light beam irradiated by the B color light irradiation device Π4 is reflected on the slope area on the upstream side of the pit. As indicated by the arrow B2, the reflected light reflected on the sloped area on the upstream side of the pit travels along the optical axis of the CCD line sensor 11', so that the amount of light incident on the line sensor 110 is large. The arrow B 3 indicates an optical path in a case where the b-color light beam irradiated by the B color light irradiation device 114 is reflected on the slope area on the downstream side of the pit. As shown by the arrow B3, the reflected light reflected by the sloped surface on the downstream side of the pit travels in a direction substantially perpendicular to the optical axis of the CCD line sensor 11b, and thus is incident on the CCD line sensor 110. The amount of light is very small. Therefore, a shadow appears in the area corresponding to the bevel area on the downstream side of the b-color image. Therefore, if the R color image of the CSP tape 16 having the pit is overlapped with the B color image, the slope area on the upstream side becomes the shaded area of the R color image and 131466.doc -23· 1377340 appears B color. The sloped area on the downstream side becomes the shaded area of the b-color image and the R color appears. Next, a case where the CSP tape 16 that generates the bump is irradiated will be described with reference to Fig. 9(B). Further, as shown in Fig. 9(B), the present embodiment is described by taking an inverted v-shaped pit as an example. However, the shape of the pit to be inspected by the inspection device 1 is not limited to the inverted V shape. An arrow R4 indicates an optical path in a case where the r-color light beam irradiated by the R color light irradiation device 112 is reflected in a region where no pit is generated. As indicated by the arrow R4, the reflected light reflected in the area where the pit is not generated will be directed to the CCD line sensor! The optical axis of 10 travels obliquely, so that the amount of light incident on the CCD line sensor 丨10 is small. The arrow R5 indicates that the r-color beam irradiated by the R color light irradiation device 112 is reflected on the slope area on the upstream side of the pit. The light path. As indicated by the arrow R5, the reflected light reflected by the sloped area on the upstream side of the pit travels along the optical axis of the CCD line sensor 110, so that the amount of light incident on the 匚 cd line sensor 110 is large. Arrow R6 The optical path in the case where the r-color light beam irradiated by the R color light irradiation device 112 is reflected on the slope area on the downstream side of the pit is shown. As shown by the arrow R6, the reflected light reflected by the slope area on the downstream side of the pit travels in a direction substantially perpendicular to the optical axis of the CCD line sensor 11 ,, and thus is incident on the CCD line sensor 110. The amount of light is very small. Therefore, a shadow appears in the area corresponding to the bevel area on the downstream side of the stencil image. An arrow B4 indicates an optical path in a case where the b-color light beam irradiated by the B color light irradiation device 114 is reflected in a region where no pit is generated. As indicated by the arrow, the reflected light reflected in the area where the pit is not formed in 131466.doc -24 - 1377340 will travel obliquely toward the optical axis of the CCD line sensor 110, and thus is incident on the CCD line sensor 110. Less light. The arrow B5 indicates an optical path in a case where the B color beam irradiated by the B color light irradiation device π 4 is reflected on the slope area on the downstream side of the pit. As indicated by the arrow, the reflected light reflected by the sloped area on the downstream side of the pit travels in a direction substantially perpendicular to the optical axis of the CCD line sensor 11 ,, and thus is incident on the CCD line sensor 11 〇 The amount of light is large. An arrow B6 indicates an optical path in a case where the B color light beam irradiated by the B color light irradiation device 114 is reflected on the slope area on the upstream side of the pit. As indicated by the arrow, the reflected light reflected in the bevel area on the upstream side of the pit will follow the CCD line sensor! The optical axis of the 行进 is traveling, so the amount of light incident on the ccd line sensor 110 is very small. Therefore, a shadow appears in the area corresponding to the slope area on the upstream side of the B color image. Therefore, when the R color image of the CSP tape 16 on which the bump is generated overlaps with the B color image, the slope area on the upstream side becomes the shaded area of the B color image and the R color appears, and the slope area on the downstream side becomes The B color appears in the shaded area of the R color image. Further, as can be seen from the contents of the drawings of FIGS. 9(A) and (B), the b color appears in the sloped region which is inclined toward the upstream side in the transport direction of the CSP tape 16, and is directed toward the transport direction of the CSP tape 16. The sloped area of the upstream side rises to the R color. That is, from the positional relationship of the regions in which the respective colors are displayed, it is judged whether or not the defect of the 3-dimensional shape generated in the metal pattern portion is a pit or a bump. 131466.doc •25- 1377340 The CCD line sensor 11 transmits an image signal corresponding to the amount of incident light to the computer 82 (refer to Figure 7). Next, the features of the image obtained by the scanning station 102 will be described with reference to Fig. 10 . Fig. 1A(A) shows an example of an image obtained when a CSP tape 16 which generates pits is irradiated. The dark strip region TB represents the base portion, and the bright strip region TM represents the metal pattern portion. In the region where the concentration level on the area TM is significantly different from the surrounding area, the upper side area (red area in the color image) TPR represents the slope area on the downstream side of the pit, and the lower side area (blue in the color image) The color area) TPB represents the slope area on the upstream side of the pit. Fig. 1 (B) is an example of an image obtained by irradiating a CSP tape 16 which produces a bump. The dark strip-shaped region TB indicates a base portion, and the bright strip-shaped region TM indicates a metal pattern portion. In the area where the concentration level on the area TM is significantly different from the surrounding area, the upper side area (blue area in the color image) TPB represents the slope area on the downstream side of the bump, and the lower side area (in the color image The red area) TPR indicates the slope area on the upstream side of the bump. The strip-shaped area TM indicates a metal pattern portion, and the area TD where the 丨 is apparently directed indicates dust or the like. On the other hand, Fig. 10(C) shows an example of an image of a region where dust or the like adheres to the metal pattern portion. The dark band-shaped region D indicates the base portion, and the concentration level on the bright region TM is smaller than the case where there is no defect in the 3-dimensional shape, and the incident angle of each color beam is substantially

Therefore, when dust or the like adheres, the change of τ· will be substantially the same. Images of only eleven 13M66.doc -26-1377340 colors are rarely detected. As described above, when the light beams of different colors are irradiated from different directions, in the image of the region where the defect of the 3 dimensional shape is generated, one of the colors appears corresponding to the slope of the defect of the 3 times of the defect. Therefore, the computer 82 captures the areas in which the colors appear in the image (hereinafter referred to as the colored areas), and detects the defects of the 3-dimensional shape based on at least one of the positional relationship and the shape of the respective colored areas. The detection of the positional relationship can also be performed by taking, for example, the distance between the center positions of the respective colored regions. It is determined in advance that the distance range of the defect of the three-dimensional shape is determined, and whether or not the pit is determined based on whether the distance between the colored regions extracted from the image obtained by the scanning table 102 is within the distance range. . On the other hand, depending on the detection of the shape, it is also possible to determine whether, for example, the colored area is a snowman shape as shown in Fig.... Furthermore, the computer 82 determines whether the defect of the 3-dimensional shape is a pit or a bump based on the positional relationship of the respective colored regions. As described above, by irradiating the csp tape with light beams of different colors from different directions, it is possible to reliably detect the defect of the three-dimensional shape generated in the metal pattern portion by one scanning table under a short time. Further, by irradiating the CSP tape with light beams of different colors from different directions, it is possible to further discriminate the defect shape of the 3-dimensional shape generated in the metal pattern portion. Further, as shown in FIG. 11, a G color incident device including a G color light irradiation device (line light source) 12A and a half mirror 122, and a light beam irradiated to the csp tape 16 at right angles may be further disposed above the table 1A4. In the irradiation unit, a G-color transmitted light irradiation device (line light source) 124 that irradiates a light beam from the back surface of the CSP tape 16 is further disposed in a table ι 4131466.doc • 27· 1377340. The G color light irradiation device 120 and the G color transmitted light irradiation device 124 are configured to emit an LED that emits a green (g) light beam, and illuminate the G color along the optical axis lg of the CCD line sensor n 表示 indicated by a single dotted line. beam. The amount of incident light entering the CCD line sensor 11 gg color is increased when a defect occurs in the metal pattern portion. The detection of the defect of the csp tape by using the image obtained by the reflected light of the G color can detect the defect of the ternary shape generated on the metal pattern with higher precision. In addition, the configuration of the R color light irradiation device and the B color light irradiation device is set to the position on the upstream side and the downstream side in the transport direction of the CSP tape with respect to the CCD line sensor, but the R color light irradiation device The B-color light irradiation device may be disposed at an opposite position centering on the CCD line sensor. For example, when the arrangement positions of the R color light irradiation device and the B color light irradiation device are reversed, the positional relationship of the regions in which the respective colors appear is exchanged. Further, when the chromatic light irradiation device and the B color light irradiation device are disposed at the opposite positions in the width direction of the CSP tape, the regions where the respective colors appear are arranged side by side in the width direction of the CSP tape. Further, in the above-described embodiment, the case where the light beam is obliquely irradiated from both the upstream side and the downstream side of the CSP tape under the CCD line sensor is described, but it may be based on the upstream side and the downstream side of the CSP tape. The image obtained by obliquely illuminating the light beam, and the image obtained by irradiating the light beam along the optical axis of the CCD line sensor, perform defect inspection. Further, in the above embodiment, the description is made on the case of examining the defect of the 3-dimensional shape generated in the metal portion of the CSP tape, but it is not limited to the case where the inspection is performed on the surface of other articles. The present invention can also be applied to the case of a defect of a three-dimensional shape. [Effect of the Invention] As described above, according to the present invention, the following effects can be obtained: the defect of the 3-dimensional shape generated on the surface of the article can be inspected with high precision. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic configuration diagram of an inspection apparatus according to a first embodiment of the present invention. Fig. 2 is a schematic configuration diagram of a first scanning stage. 3(A) to 3(D) are diagrams for explaining reflected light of the first scanning stage. Fig. 4 is a schematic configuration diagram of a second scanning stage. 5(A) and 5(B) are diagrams for explaining reflected light of the second scanning stage. 6(A) to 6(D) are diagrams showing an example of images obtained by the first scanning stage and the second scanning stage. Fig. 7 is a schematic configuration diagram of an inspection apparatus according to a second embodiment of the present invention. Fig. 8 is a schematic configuration diagram of a scanning table according to a second embodiment. 9(A) and 9(B) are views for explaining the reflected light of the scanning table of the second embodiment. Fig. 10 (A) to (C) are views showing an example of a _ image obtained by the scanning table of the second embodiment. Fig. 11 is a view showing a modification of the scanning table of the second embodiment. [Explanation of main component symbols] 10 Inspection device 16 CSP tape 131466.doc -29- 1377340 52 1st scanning table 54 Table 60 CCD line sensor 62 First irradiation device 64 Second irradiation device 66 Second scanning table 74 CCD line sensor 76 third illumination device 82 computer 100 inspection device 102 scanning table 110 CCD line sensor 112 R color light irradiation device 114 B color light irradiation device 131466.doc -30-

Claims (1)

1377340 Patent Application No. 097118563 j Chinese Patent Application Replacement (1) X. Patent Application Scope 1. The inspection apparatus includes a plurality of illumination mechanisms that illuminate the inspection object from different directions; the photographing mechanism is photographed by the plurality of illumination mechanisms. Each of the images generated by the respective light reflected on the inspection object; and a detection mechanism that detects a defect of a three-dimensional shape from each of the images captured by the imaging mechanism; the illumination mechanism includes: an oblique illumination mechanism Further, the system includes at least one of a third irradiation unit that irradiates light to the inspection target from the second oblique direction, and a second irradiation unit that irradiates light to the inspection target from the second oblique direction. The inspection target is irradiated with light from above; the third illumination mechanism is irradiated in a different order from the oblique illumination mechanism; and the detection mechanism is configured to extract the concentration bit from the front by the oblique illumination mechanism. Expected to be the first! special In the image taken by the photographing mechanism, the inspection device outside the range of the above-mentioned photographing range is excluded, wherein Set, which includes: Defects in shape. As for the request item 1. More includes & timing, an inspection device, I31466-1010706.doc 1377340 plural illumination mechanism, illuminating; the system is directed to the inspection object from different directions from each other. Each image generated by each light reflected by the mechanism and reflected by the inspection object, and a detecting means for detecting a defect of a three-dimensional shape from each image captured by the imaging means; the plurality of irradiations Each of the mechanisms illuminates light of different colors; the detecting mechanism extracts an area outside the specific range from the images captured by the photographing mechanism, and according to the positional relationship and shape of each area taken The defect of the 3-dimensional shape is detected by at least one of them. 131466-1010706.doc