KR101086374B1 - Inspection apparatus - Google Patents

Abstract

The inspection apparatus of the present invention inspects a three-dimensional defect in the surface of an article with high accuracy. The 1st scan stage of this invention image | photographs the image by the light reflected by irradiating light to a CSP tape from the diagonal direction, and the 2nd scan stage is based on the light reflected by irradiating light to a CSP tape from an upward direction. Image pickup Then, the computer of the present invention extracts a region having a significantly low density level from the image obtained in the first scan stage, and extracts a region having a significantly high density level from the image obtained from the second scan stage and extracts the extracted angle. If the areas are at approximately the same position, it is determined that the area is a three-dimensional defect.

Description

Inspection device {INSPECTION APPARATUS}

TECHNICAL FIELD The present invention relates to an inspection apparatus, and more particularly, to an inspection apparatus for inspecting a three-dimensional shape defect generated on the surface of an article.

Conventionally, in the manufacture of a chip size package (hereinafter referred to as CSP) in which the external dimension of a semiconductor device is reduced to approximately the external dimension of a semiconductor element, a tape in which a plurality of patterns formed corresponding to one chip are repeatedly patterned (hereinafter, A method of manufacturing a large amount of packages at one time using a CSP tape is proposed.

This CSP tape forms a conductive film such as copper foil on the surface of a substrate such as a polyimide substrate by evaporation or the like, and then uses a conventional etching technique for wiring, electrodes, beam leads and through holes for CSP. It is a tape of a long shape which repeated and patterned the pattern of this.

As for the inspection of both parts of the metal pattern formed on such a CSP tape, as described in patent document 1, the technique which irradiates a light beam from the lower side of a CSP tape and image | photographs the transmitted light with a camera is proposed, and is proposed, for example. have.

In addition, detection of the dust attached to a CSP tape part, the defect of a resist pattern part, etc. is detected by irradiating a light beam from the upper part of a CSP tape, for example, as described in patent document 2, and imaging a reflected light with a camera. The technique to make is proposed.

[Patent Document 1]

Japanese Patent Application Laid-Open No. 2004-212159

[Patent Document 2]

Japanese Patent Application Laid-Open No. 2006-105816

However, a technique for inspecting a three-dimensional shape defect such as a pit generated in a metal pattern formed on a tape-shaped substrate such as the CSP tape has not been established. In the conventional technology, the three-dimensional shape defect is accurately inspected. I could not do it.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an inspection apparatus capable of accurately inspecting a defect of a three-dimensional shape occurring on the surface of an article.

In order to achieve the above object, the invention of claim 1 comprises a plurality of irradiation means for irradiating light to an inspection object from different directions, and each by each of the light reflected from the inspection object by being irradiated by the plurality of irradiation means; Image pickup means for picking up an image of an image, and detection means for detecting a three-dimensional shape defect from each image picked up by the image pickup means.

The irradiating means includes inclined direction irradiating means comprising at least one of a first irradiating means for irradiating light to the inspection object from the first inclined direction and a second irradiating means for irradiating light to the inspection object from the second inclined direction, and an inclined direction The third irradiation means for irradiating light to the inspection object from the upper direction at a different timing than the irradiation means may be included.

The inclined direction irradiating means and the third irradiating means irradiate at different timings so that the image is irradiated by the inclined direction irradiating means and reflected by the inspection object, and the light reflected by the third irradiating means is reflected on the inspection object. Image can be separated.

In this case, the detecting means captures the image when the density level is outside the first predetermined range in the image picked up by the imaging means when the light is irradiated by the oblique direction irradiation means and when the light is irradiated by the upward direction irradiation means. In the image picked up by the means, a region having a density level outside the second predetermined range is extracted, and a defect of a three-dimensional shape is detected based on each extracted region.

Here, the first predetermined range is a range of density levels in the region where a three-dimensional defect is not generated in the image picked up when light is irradiated by the oblique direction irradiation means. The second preset range is a range of density levels in the region where a three-dimensional defect is not generated in the image photographed when the light is irradiated by the third irradiation means.

The optical path of the light reflected from the inspection object depends on the three-dimensional shape of the inspection object. For this reason, when the three-dimensional shape defect generate | occur | produces in a test | inspection object, the area | region of the three-dimensional shape defect is different in density | concentration level from another area | region in the image picked up. Thereby, the three-dimensional defect can be detected by extracting the area | region outside the density | concentration level range of the area | region where the density level does not generate | occur | produce the three-dimensional shape defect in the image picked up.

In addition, when the three-dimensional shape defect generate | occur | produces in a test | inspection object, the density level in a picked-up image changes with the direction to which light is irradiated to a test subject. Therefore, it is possible to improve the accuracy of defect detection in the three-dimensional shape by extracting an area outside the preset range of the density level from each image by each light reflected from the inspection object by being irradiated from a plurality of different directions.

For example, when the light is irradiated by the oblique direction irradiation means, when the density level is extracted from the image picked up by the imaging means outside the first preset range, and when the light is irradiated by the upward irradiation means, In the image picked up by the image pickup means, an area outside the second predetermined range may be extracted, and when the extracted areas are at substantially the same position, the area may be determined to be a three-dimensional defect area.

Moreover, what is necessary is just to further provide 4th irradiation means which irradiates a light to an inspection object from a downward direction at the same timing as 3rd irradiation means.

In addition, the plurality of irradiation means may emit light of different colors, respectively. In this case, each image can be separated according to the color.

The detection means extracts an area outside the preset range of the density level from each image picked up by the image pickup means, and detects a three-dimensional shape defect based on at least one of the positional relationship and shape of each extracted area.

Here, the predetermined range is the range of the density level of the area | region where the three-dimensional defect did not generate | occur | produced in the image image | photographed when light was irradiated by the irradiation means.

For example, when the light is irradiated by the irradiation means for irradiating light from one side of the inspection object, the image is extracted from an area outside the preset range of the density level, and is irradiated with light from the other side of the inspection object. When the light is irradiated by the irradiating means to extract an area outside the preset range of the density level, the distance between each extracted area is determined to determine whether or not a three-dimensional defect is occurring. You may also Moreover, based on the characteristic of the shape of the extracted area | region, you may determine whether the defect of a three-dimensional shape has generate | occur | produced.

According to the present invention, it is possible to obtain an effect that the defect of the three-dimensional shape generated on the surface of the article can be inspected with high accuracy.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to drawings.

≪ First Embodiment >

As shown in FIG. 1, the inspection apparatus 10 according to the first embodiment includes a tape supply unit 12, a winding unit 14, and the like, and is supplied and conveyed by the tape supply unit 12. The CSP tape 16 is inspected and wound around the winding unit 14.

(Tape supply unit)

The tape supply unit 12 includes a unwinding side reel shaft for holding a CSP roll 20 formed by winding a CSP tape 16 and a spacer tape 18 having a plurality of package patterns repeatedly formed in a roll shape ( 22) and the unwinding side spacer shaft 24 which winds and holds the spacer tape 18 taken out with the CSP tape 16 is provided.

On the sending side of the CSP roll 20, the guide 26 which changes the conveyance direction of the CSP tape 16 is arrange | positioned.

In the CSP tape 16 of the present embodiment, a metal pattern such as copper foil is formed on the surface of a base tape made of synthetic resin that transmits light by etching, and an insulating resist pattern is formed thereon.

(Winding unit)

The winding unit 14 winds up the winding side spacer shaft 28 which holds the spacer tape 18 formed in roll shape, and the winding side which winds up the spacer tape 18 and the CSP tape 16 which were examined. The reel shaft 30 is provided.

Moreover, the guide 32 which changes the conveyance direction of the CSP tape 16 is arrange | positioned at the tape winding side of the winding side reel shaft 30. As shown in FIG.

Between the tape supply unit 12 and the winding unit 14, the shot dancer 34 which forms the conveyance path | route of the CSP tape 16, the 1st feed roller 36, the 2nd feed roller 38, The long dancer 40, the guides 42, 44, 46, 48, and the short dancer 50 are arrange | positioned in order.

Moreover, the 1st feed roller 36 and the 2nd feed roller 38 are arrange | positioned horizontally at the space | interval, and the 1st scanning stage between the 1st feed roller 36 and the 2nd feed roller 38 is carried out. 52 and the second scan stage 66 are provided.

(First scan stage)

As shown in FIG. 2, the table 54 is arranged in the first scan stage 52. Air is blown out from the table 54 toward the CSP tape 16, and a thin air layer is formed between the CSP tape 16 and the table 54.

Moreover, each press roller 56 is a driven roller which freely rotates, respectively, and abuts on the upper surface of the CSP tape 16 to limit the movement of the CSP tape 16 upwards.

Moreover, air is blown toward the CSP tape 16 also from the guide 26, the short dancer 34, the long dancer 40, the guides 42, 44, 46, 48, and the short dancer 50, A thin air layer is formed between the CSP tape 16 and each member.

As shown in FIG. 2, the image reading part which consists of the lens 58 and the CCD line sensor 60 which is an imaging means is arrange | positioned just above the CSP tape 16 conveyance direction center part of the table 54. As shown in FIG. In the CCD line sensor 60, pixels are arranged in the width direction of the CSP tape 16 (the front and back directions in Fig. 2).

In addition, on the upstream side of the CSP tape 16 in the conveying direction, a first irradiation device (line light source) 62 serving as a first irradiation means for irradiating the lower portion of the CCD line sensor 60 with an optical path L1 indicated by a dashed line is provided. 2nd irradiation apparatus (line light source) 64 which is arrange | positioned and is 2nd irradiation means which irradiates on the optical path L2 which shows the lower side of CCD line sensor 60 with a dashed-dotted line downstream of the CSP tape 16 conveyance direction. Is arranged.

The first irradiating device 62 and the second irradiating device 64 each include a plurality of LEDs (not shown) arranged along the width direction of the CSP tape 16 and a light beam irradiated from the CSP tape 16. It is comprised by the light-guide plate (illustration omitted) irradiated in line shape toward the surface. Here, the LED of the first irradiating device 62 and the LED of the second irradiating device 64 irradiate light beams of the same color.

Moreover, each light beam is irradiated toward one point when it sees from the tape conveyance direction side. As a result, respective light beams are superposed on the surface (upper surface) of the CSP tape 16 and irradiated in a line shape in the tape width direction.

The CSP tape 16 is placed on each feed roller 56, and is fed at a constant speed in one direction by the rotation of each feed roller 56, and the image reading portion when passing over the table 54. The surface of the CSP tape 16 is imaged by this.

Next, the image picked up by the first scan stage 52 will be described.

With reference to FIG. 3, the reflected light irradiated by the 1st irradiation apparatus 62 and the 2nd irradiation apparatus 64, and reflected by the CSP tape 16 is demonstrated. Pits that are three-dimensional defects are generated in the CSP tape 16 shown in FIGS. 3A and 3C. 3A and 3C, in this embodiment, a pit having a V shape is described as an example, but the shape of the pit inspected by the inspection apparatus 10 is not limited to the V shape.

3A shows the optical path of the light beam irradiated from the upstream side of the conveyance direction of the CSP tape 16 by the first irradiation device 62 and reflected on the CSP tape 16.

Arrow A1 has shown the optical path in the case where the light beam irradiated by the 1st irradiation apparatus 62 was reflected in the area | region where pit does not generate | occur | produce. As indicated by the arrow A1, since the reflected light reflected in the region where no pit is generated travels in the inclined direction with respect to the optical axis of the CCD line sensor 60, the amount of light incident on the CCD line sensor 60 is little.

Arrow A2 represents an optical path in the case where the light beam irradiated by the first irradiating device 62 is reflected in the slope region on the upstream side of the pit. As indicated by arrow A2, the reflected light reflected in the slope region upstream of the pit proceeds in a direction substantially perpendicular to the optical axis of the CCD line sensor 60, and thus enters the CCD line sensor 60. The amount of light is small.

The arrow A3 represents the optical path in the case where the light beam irradiated by the first irradiating device 62 is reflected in the slope region on the downstream side of the pit. As indicated by arrow A3, since the reflected light reflected in the slope region downstream of the pit travels along the optical axis of the CCD line sensor 60, the amount of light incident on the CCD line sensor 60 is large.

FIG. 3B shows the outline of the change in the light amount of the light beam irradiated by the first irradiating device 62, reflected by the CSP tape 16, and incident on the CCD line sensor 60. The horizontal axis represents the position of the CSP tape 16 in the conveying direction, and the vertical axis represents the light amount. The amount of light when reflected in the slope region on the upstream side is small, and the amount of light when reflected on the slope region on the downstream side increases.

Next, the case where the CSP tape 16 is irradiated by the 2nd irradiation apparatus 64 from the downstream side of the conveyance direction of the CSP tape 16 is demonstrated.

3C shows the optical path of the light beam irradiated by the second irradiation device 64 and reflected on the CSP tape 16.

An arrow A4 represents an optical path in the case where the light beam irradiated by the second irradiation device 64 is reflected in a region where no pit is generated. As indicated by the arrow A4, since the reflected light reflected in the region where no pit is generated travels in the inclined direction with respect to the optical axis of the CCD line sensor 60, the amount of light incident on the CCD line sensor 60 is little.

An arrow A5 represents an optical path in the case where the light beam irradiated by the second irradiation device 64 is reflected in the slope region on the upstream side of the pit. As indicated by arrow A5, since the reflected light reflected in the slope region upstream of the pit travels along the optical axis of the CCD line sensor 60, the amount of light incident on the CCD line sensor 60 is large.

An arrow A6 indicates an optical path in the case where the light beam irradiated by the second irradiation device 64 is reflected in the slope region on the downstream side of the pit. As indicated by the arrow A6, the reflected light reflected in the slope region downstream of the pit proceeds in a direction substantially perpendicular to the optical axis of the CCD line sensor 60, and thus enters the CCD line sensor 60. The amount of light is small.

FIG. 3D shows the outline of the change in the amount of light of the light beam irradiated by the second irradiating device 64, reflected by the CSP tape 16, and incident on the CCD line sensor 60. The horizontal axis represents the position of the CSP tape 16 in the conveying direction, and the vertical axis represents the light amount. The amount of light when reflected in the slope region on the upstream side is large, and the amount of light when reflected on the slope region on the downstream side is small.

The CCD line sensor 60 sends an image signal corresponding to the incident light amount to a computer 82 (see Fig. 1) which is a detection means.

The computer 82 introduces an image signal sent from the CCD line sensor 60 and performs image processing to inspect the CSP tape 16. As described above, the amount of light of the light beam irradiated by the first irradiating device 62 and reflected on the downstream slope region among the pit regions and incident on the CCD line sensor 60 is large. Further, the amount of light of the light beam irradiated by the second irradiation device 64, reflected in the upstream slope region among the pit regions, and incident on the CCD line sensor 60 is large. For this reason, when irradiating a light beam from both the 1st irradiation apparatus 62 and the 2nd irradiation apparatus 64, the area | region where a pit generate | occur | produces the CCD line sensor 60 rather than the area | region where a pit does not generate | occur | produce. The amount of light of the incident light beam increases. Therefore, the computer 82 extracts an area whose density level is lower than the predetermined level from the image obtained by the first scan stage 52, and detects pits based on the extracted area.

In addition, the computer 82 can display the captured image of the CSP tape 16 and the like on the monitor 84.

The first irradiating device and the second irradiating device are provided at positions opposite to the upstream side and the downstream side of the conveyance direction of the CSP tape with respect to the CCD line sensor. What is necessary is just to provide in the position which opposes centering on a line sensor, for example, you may provide in the position which opposes the width direction of a CSP tape.

(Second scan stage)

As shown in FIG. 4, the table 68 is disposed in the second scan stage 66. In the table 68, air is blown toward the CSP tape 16, and a thin air layer is formed between the CSP tape 16 and the table 68. As shown in FIG.

Moreover, each press roller 70 is a driven roller which freely rotates, respectively, and abuts on the upper surface of the CSP tape 16 to restrict the movement upward of the CSP tape 16.

As shown in FIG. 4, the image reading part which consists of the lens 72 and the CCD line sensor 74 is arrange | positioned just above the CSP tape 16 conveyance direction center part of the table 68. As shown in FIG. In the CCD line sensor 74, pixels are arranged in the width direction of the CSP tape 16 (the front and rear directions in Fig. 4).

Moreover, the upper part of the table 68 is comprised of the 3rd irradiation apparatus (line light source) 76 and the half mirror 78 which are 3rd irradiation means, and fall-off to irradiate a CSP tape 16 with a light beam at a right angle ( I) An irradiation unit is arranged. Moreover, in the table 68, the transmitted light irradiation apparatus (line light source) 80 which irradiates a light beam from the back surface of the CSP tape 16 is arrange | positioned. The fall irradiator and the transmitted light irradiator 80 irradiate the light beam along the optical axis L3 of the CCD line sensor 74 represented by the dashed line.

The third irradiating device 76 and the transmitted light irradiating device 80 irradiate a plurality of LEDs arranged along the width direction of the CSP tape 16 and the light beam irradiated from the LEDs toward the CSP tape 16 in a line shape. It is comprised by the light guide plate. Here, the LED of the third irradiation device 76 and the LED of the transmitted light irradiation device 80 irradiate light beams of the same color.

Moreover, the 3rd irradiation apparatus 76 and the transmitted light irradiation apparatus 80 irradiate a light beam toward one point when it sees from the tape conveyance direction side. Accordingly, the light beam is irradiated on the surface (upper surface) of the CSP tape 16 in a line shape in the width direction of the CSP tape 16, and on the rear surface (lower surface), the position opposite to the irradiation position of the light beam on the surface (upper surface) The light beam is irradiated in a line shape in the width direction of the CSP tape 16.

The CSP tape 16 is placed on each feed roller 70, and is fed at a constant speed in one direction by the rotation of each feed roller 70, and the image reading portion when passing over the table 68. The surface of the CSP tape 16 is imaged at.

Moreover, the light beam irradiated by the 3rd irradiation apparatus 76 is reflected by the metal pattern part of the CSP tape 16, and is transmitted by the parts other than a metal pattern part (henceforth a base part). In addition, the light beam irradiated by the transmitted light irradiation apparatus 80 does not transmit the metal pattern part of the CSP tape 16, but transmits the base part. In this embodiment, when the density level of an image is made into 0 (high density | concentration)-250 (low density | concentration), for example, when a metal pattern part becomes a density level of 200 vicinity, a base part becomes a density level of 100 vicinity, 3 Irradiation by the irradiator 76 and the transmitted light irradiator 80 is adjusted. This makes it possible to distinguish the metal pattern portion and the base portion from the image obtained by the second scan stage 66. In addition, when the irradiation by the 3rd irradiation apparatus 76 and the transmitted light irradiation apparatus 80 was prepared as mentioned above, the area | region of a pit becomes a density level of 50 vicinity.

In addition, although the fall irradiating part was set as the structure which consists of a 3rd irradiation apparatus and a half mirror, it is not limited to this as long as it can irradiate a light beam so that it may substantially follow the optical axis of a CCD line sensor.

Next, the image obtained by the 2nd scanning stage 66 is demonstrated.

With reference to FIG. 5, the reflected light irradiated by the 3rd irradiation apparatus 76 and reflected on the metal pattern part of the CSP tape 16 is demonstrated. Pits are generated in the metal pattern portion of the CSP tape 16 shown in FIG. 5A. In addition, as shown to FIG. 5A, in this embodiment, although the V-shaped pit is demonstrated as an example, the shape of the pit examined by the test | inspection apparatus 10 is not limited to V-shaped.

FIG. 5A shows the optical path of the light beam irradiated from the upper side of the CSP tape 16 by the third irradiator 76 and reflected on the metal pattern portion of the CSP tape 16.

The arrow A7 represents the optical path in the case where the light beam irradiated by the third irradiation device 76 is reflected in the region where no pit is generated. As indicated by the arrow A7, since the reflected light reflected in the region where no pit is generated travels along the optical axis of the CCD line sensor 74, the amount of light incident on the CCD line sensor 74 is large.

Arrows A8 and A9 indicate the optical paths when the light beam irradiated by the third irradiating device 76 is reflected in the slope region of the pit. As indicated by arrows A8 and A9, the reflected light reflected in the slope region of the pit travels in an inclined direction with respect to the optical axis of the CCD line sensor 60, so that the amount of light incident on the CCD line sensor 74 Is less.

FIG. 5B shows the outline of the change in the amount of light of the light beam irradiated by the third irradiating device 76, reflected by the metal pattern portion of the CSP tape 16 and incident on the CCD line sensor 74. The horizontal axis shows the position of the CSP tape 16 reflected, and the vertical axis shows the light amount. It can be seen that the amount of light when reflected in a region other than the pit is large and the amount of light when reflected in the region of the pit is small.

The CCD line sensor 74 sends an image signal corresponding to the incident light amount to the computer 82.

The computer 82 introduces an image signal sent from the CCD line sensor 74 and performs image processing to inspect the CSP tape 16. As described above, when the light beam is irradiated from above the table 68, the amount of light incident on the CCD line sensor 60 when the light is reflected in the region of the pit becomes small. Therefore, the computer 82 extracts an area whose density level is higher than the predetermined level from the image obtained by the second scan stage 66, and detects pits based on the extracted area.

Next, with reference to FIG. 6, the characteristic of the image obtained by the 1st scan stage 52 and the 2nd scan stage 66 is demonstrated.

6A and 6B show an example of an image of an area including a pit. 6A is an example of the image obtained by the 1st scan stage 52. FIG. The bright band region TB represents the base portion, the dark band region TM represents the metal pattern portion, and the region TP markedly lower than the surroundings on the region TM represents pits. have. FIG. 6B is an example of the image obtained by the 2nd scan stage 66. As shown in FIG. The dark band-shaped region TB represents the pattern portion, the bright band-shaped region TM represents the metal pattern portion, and the region TP markedly higher than the surroundings on the region TM represents the pits. have.

As described above, when pits are generated, the area having a lower density level than the surroundings in the image obtained by the first scan stage 52 and the area having a higher density level than the surroundings in the image obtained by the second scan stage 66 are approximately. same.

6C and 6D show an example of the image of the area | region to which dust etc. adhered.

6C is an example of an image obtained by the first scan stage 52. The bright strip region TB represents the base portion, and the dark strip region TM represents the metal pattern portion. In the region TM, there is no region where the concentration level is significantly different. Thus, in the image obtained by the 1st scan stage 52, the density level of the image corresponding to the area | region with dust etc. rarely becomes low significantly.

6D is an example of the image obtained by the second scan stage 66. The dark band-shaped region TB represents the base portion, the bright band-shaped region TM represents the metal pattern portion, and the region TD of which the concentration level is significantly higher than the surroundings on the region TM is used for dust and the like. It is shown. Thus, when dust etc. adhere to the metal pattern part, in the image obtained by the 2nd scan stage 66, the density | concentration level of the part with dust etc. may increase.

In the above description, it can be seen that an image obtained by the first scan stage 52 has a low density level, and in an image obtained by the second scan stage 66, a region having a high density level can be detected as a pit. .

Therefore, the computer 82 extracts a region where the density level is significantly lower in the image obtained by the first scan stage 52 and at the same time the density level is significantly higher in the image obtained by the second scan stage 66. What is necessary is just to extract an area | region, and to determine that the said area | region is a pit when each extracted area | region is about the same position. Thereby, the three-dimensional defect which generate | occur | produced in the metal pattern part can be detected reliably.

(Marking unit)

As shown in FIG. 1, the marking unit 86 which performs marking in the predetermined position of the package pattern detected as a defect is arrange | positioned between the guide 44 and the guide 46. FIG.

Thus, by using a combination of the image obtained by the reflected light of the light beam irradiated from the oblique direction of the CSP tape and the image obtained by the reflected light of the light beam irradiated from above the CSP tape, the three-dimensional shape generated in the pattern of the metal formed on the CSP tape The defect can be checked with high precision.

(2nd embodiment)

Next, the inspection apparatus which concerns on 2nd Embodiment of this invention is demonstrated.

In the first embodiment, the case where the defect of the three-dimensional shape generated in the metal pattern portion is inspected based on the respective images obtained in the two scan stages, but in the second embodiment, the image obtained in one scan stage The case where the defect of the three-dimensional shape which generate | occur | produced in the metal pattern part is examined based on this is demonstrated. Hereinafter, the difference with respect to 1st Embodiment is demonstrated.

As shown in FIG. 7, in the inspection apparatus 100 according to the second embodiment, a scan stage 102 is provided between the first feed roller 36 and the second feed roller 38.

(Scan stage)

As shown in FIG. 8, the table 104 is disposed on the scan stage 102. Air is blown out from the table 104 toward the CSP tape 16, and a thin air layer is formed between the CSP tape 16 and the table 104.

Moreover, each press roller 106 is a driven roller which freely rotates, respectively, and contacts the upper surface of the CSP tape 16 to limit the movement of the CSP tape 16 upwards.

As shown in FIG. 8, the image reading part which consists of the lens 108 and the CCD line sensor 110 of color is arrange | positioned just above the CSP tape 16 conveyance direction center part of the table 104. As shown in FIG. In addition, an R-color light irradiation apparatus (line light source) 112 for irradiating the lower side of the CCD line sensor 60 with an R-colored light beam is disposed on the upstream side of the CSP tape 16 in the conveying direction. On the downstream side in the conveying direction, a B-color light irradiation apparatus (line light source) 114 is provided which irradiates the lower side of the CCD line sensor 60 with a light beam of B color. Each of the R-color light irradiation apparatus 112 and the B-color light irradiation apparatus 114 irradiates light beams of each color along the optical paths LR and LB indicated by the dashed-dotted lines.

The R-color light irradiation apparatus 112 and the B-color light irradiation apparatus 114 include a plurality of LEDs arranged along the width direction of the CSP tape 16 (the front and back directions in FIG. 8), and the light beam irradiated from the CSP tape. It is comprised by the light guide plate irradiated to line 16 toward 16. Here, the LED of the R-color light irradiation apparatus 112 irradiates a light beam of red (R), and the LED of the B-color light irradiation apparatus 114 irradiates a light beam of blue (B).

Moreover, the R color light irradiation apparatus 112 and the B color light irradiation apparatus 114 are irradiated toward one point when it sees from the tape conveyance direction side. As a result, a red light beam and a blue light beam are superposed on the surface (upper surface) of the CSP tape 16 and irradiated in a line shape in the tape width direction.

In the CCD line sensor 110, the pixels RGB are arranged in the width direction of the CSP tape 16.

The CSP tape 16 is placed on each feed roller 106, and is fed at a constant speed in one direction by the rotation of each feed roller 106, and the image reading portion when passing over the table 104. At the surface of the tape is imaged.

Next, the image obtained by the scanning stage 102 is demonstrated.

9 shows an optical path of an optical beam irradiated by each of the R-color light irradiation apparatus 112 and the B-color light irradiation apparatus 114 and reflected on the CSP tape 16 and the image picked up.

First, with reference to FIG. 9A, the case where the CSP tape 16 which the pit generate | occur | produced is irradiated is demonstrated. In addition, as shown to FIG. 9A, in this embodiment, although the V-shaped pit is demonstrated as an example, the shape of the pit examined by the test | inspection apparatus 100 is not limited to V-shaped.

An arrow R1 indicates an optical path in the case where the R-color light beam irradiated by the R-color light irradiation apparatus 112 is reflected in a region where no pit is generated. As indicated by the arrow R1, since the reflected light reflected in the region where no pit is generated travels in the inclined direction with respect to the optical axis of the CCD line sensor 110, the amount of light incident on the CCD line sensor 110 is little.

An arrow R2 represents an optical path in the case where the R-color light beam irradiated by the R-color light irradiation apparatus 112 is reflected in the slope region on the downstream side of the pit. As indicated by arrow R3, since the reflected light reflected in the slope region downstream of the pit travels along the optical axis of the CCD line sensor 110, the amount of light incident on the CCD line sensor 110 is large.

An arrow R3 represents an optical path in the case where the R-color light beam irradiated by the R-color light irradiation apparatus 112 is reflected in the slope region on the upstream side of the pit. As indicated by the arrow R2, the reflected light reflected in the slope region upstream of the pit travels in a direction substantially perpendicular to the optical axis of the CCD line sensor 110, and thus enters the CCD line sensor 110. The amount of light is very small. For this reason, the region corresponding to the slope region on the upstream side of the R-color image is shaded.

Arrow B1 has shown the optical path in the case where the light beam of the B color irradiated by the B-color light irradiation apparatus 114 is reflected in the area | region where a pit does not generate | occur | produce. As indicated by the arrow B1, since the reflected light reflected in the region where no pit is generated travels in the inclined direction with respect to the optical axis of the CCD line sensor 110, the amount of light incident on the CCD line sensor 110 is little.

An arrow B2 indicates an optical path in the case where the light beam of B color irradiated by the B-color light irradiation apparatus 114 is reflected in the slope region on the upstream side of the pit. As indicated by arrow B3, since the reflected light reflected in the slope region upstream of the pit travels along the optical axis of the CCD line sensor 110, the amount of light incident on the CCD line sensor 110 is large.

Arrow B3 shows the optical path in the case where the light beam of B color irradiated by the B-color light irradiation apparatus 114 is reflected in the slope area downstream of a pit. As indicated by arrow B2, the reflected light reflected in the slope region downstream of the pit travels in a direction substantially perpendicular to the optical axis of the CCD line sensor 110, and thus enters the CCD line sensor 110. The amount of light is very small. For this reason, the area | region corresponding to the slope area | region downstream of a B-color image is shaded.

Therefore, when the R color image and the B color image of the CSP tape 16 where pits are generated overlap each other, the upstream slope region becomes the shade region of the R color image, and the B color appears, and the downstream slope region is B It becomes the shade area of a color image and R color appears.

Next, with reference to FIG. 9B, the case where the CSP tape 16 which protrudes is irradiated is demonstrated. In addition, as shown in FIG. 9B, in this embodiment, the protrusion of an inverted V shape is demonstrated as an example, but the shape of the protrusion examined by the inspection apparatus 100 is not limited to an inverted V shape.

An arrow R4 represents an optical path in the case where the R-color light beam irradiated by the R-color light irradiation apparatus 112 is reflected in a region where no pit is generated. As indicated by the arrow R4, the reflected light reflected in the region where no pit is generated travels in the inclined direction with respect to the optical axis of the CCD line sensor 110, so that the amount of light incident on the CCD line sensor 110 little.

An arrow R5 represents an optical path in the case where the R-color light beam irradiated by the R-color light irradiation apparatus 112 is reflected in the slope region on the upstream side of the pit. As indicated by arrow R5, since the reflected light reflected in the slope region upstream of the pit travels along the optical axis of the CCD line sensor 110, the amount of light incident on the CCD line sensor 110 is large.

An arrow R6 indicates an optical path in the case where the R-color light beam irradiated by the R-color light irradiation apparatus 112 is reflected in the slope region downstream of the pit. As indicated by the arrow R6, the reflected light reflected in the slope region downstream of the pit proceeds in a direction substantially perpendicular to the optical axis of the CCD line sensor 110, and thus enters the CCD line sensor 110. The amount of light is very small. For this reason, the area | region corresponding to the slope area | region downstream of an R color image is shaded.

Arrow B4 shows the optical path in the case where the light beam of B color irradiated by the B-color light irradiation apparatus 114 is reflected in the area | region where a pit does not generate | occur | produce. As indicated by the arrow B4, the reflected light reflected in the region where no pit is generated travels in the inclined direction with respect to the optical axis of the CCD line sensor 110, so that the amount of light incident on the CCD line sensor 110 little.

An arrow B5 indicates an optical path in the case where the light beam of the B color irradiated by the B-color light irradiation apparatus 114 is reflected in the slope region on the downstream side of the pit. As indicated by arrow B5, the reflected light reflected in the slope region downstream of the pit proceeds in a direction substantially perpendicular to the optical axis of the CCD line sensor 110, and therefore enters the CCD line sensor 110. There is much light to do.

An arrow B6 indicates an optical path in the case where the light beam of the B color irradiated by the B-color light irradiation apparatus 114 is reflected in the slope region on the upstream side of the pit. As indicated by arrow B6, since the reflected light reflected in the slope region upstream of the pit travels along the optical axis of the CCD line sensor 110, the amount of light incident on the CCD line sensor 110 is very small. For this reason, the region corresponding to the slope region upstream of the B-color image is shaded.

Therefore, when the R-color image and the B-color image of the CSP tape 16 on which protrusions are generated overlap each other, the upstream slope region becomes the shade region of the B-color image, and the R color appears, and the downstream slope region is R It becomes the shade area of a color image, and B color appears.

In addition, from the contents shown in Figs. 9A and 9B, the color B appears in the slope region descending toward the upstream side of the CSP tape 16 in the conveying direction, and in the slope region rising toward the upstream side of the CSP tape 16 in the conveying direction. It is also seen that R color appears. That is, it is possible to determine whether the defect of the three-dimensional shape which occurred in the metal pattern part is a pit or protrusion from the positional relationship of the area | region where each color appears.

The CCD line sensor 110 sends an image signal corresponding to the incident light amount to the computer 82 (see FIG. 7).

Next, with reference to FIG. 10, the characteristic of the image obtained by the scanning stage 102 is demonstrated.

10A is an example of the image obtained when the CSP tape 16 which pit generate | occur | produced was irradiated. The dark strip region TB represents the base portion, and the bright strip region TM represents the metal pattern portion. Of the regions where the density level on the region TM is significantly different from the surroundings, the upper region (red region in the color image) TPR indicates the slope region downstream of the pit, and the lower region (blue in the color image). Region (TPB) represents the slope region upstream of the pit.

FIG. 10B is an example of the image obtained when the CSP tape 16 which protruded is irradiated. The dark band region TB represents a base portion, and the bright band region TM represents a metal pattern portion. Of the regions where the density level on the region TM is significantly different from the surroundings, the upper region (blue region in the color image) TPB represents the slope region downstream of the projection, and the lower region (red image in the color image). Region (TPR) represents the slope region on the upstream side of the protrusion.

On the other hand, FIG. 10C has shown an example of the image of the area | region where dust etc. adhere to the metal pattern part. The dark band-shaped region TB represents the base portion, the bright band-shaped region TM represents the metal pattern portion, and the region TD, which has a significantly higher density level than the surroundings on the region TM, contains dust or the like. It is shown.

In the absence of a three-dimensional defect, the incidence angles of the light beams of each color are approximately the same, and the light amount of the light beams of each color incident on the CCD line sensor 110 is approximately the same, so that the density level of the image of each color The change is approximately equal. For this reason, when dust or the like is attached, it is rare that only an image of one color is detected.

As described above, when light beams of different colors are irradiated from different directions, one color appears in the image of the region where the three-dimensional shape defect is generated along the slope of the three-dimensional shape defect. Therefore, the computer 82 extracts a region (hereinafter referred to as a colored region) where each color appears in the image, and detects a defect of a three-dimensional shape based on at least one of the positional relationship and the shape of each extracted colored region. do. Detection based on the positional relationship may be performed, for example, by obtaining the distance of the center position between each colored region. A distance range that can be regarded as a three-dimensional shape defect is determined in advance, and it is determined whether or not the distance between the colored areas extracted from the image obtained by the scan stage 102 is within the distance range or not as a pit. On the other hand, detection based on the shape may be performed by, for example, judging whether or not the colored area is a snowman shape as shown in FIG. 10. In addition, the computer 82 determines whether the defect of the three-dimensional shape is a pit or a protrusion based on the positional relationship of each colored region.

As described above, by irradiating the CSP tape with light beams of different colors in different directions, it is possible to reliably detect the three-dimensional defects generated in the metal pattern portion by a short inspection by one scan stage. Moreover, by irradiating a CSP tape with the light beam of a different color from a different direction, the shape of the three-dimensional defect which generate | occur | produced in the metal pattern part can further be discriminated.

11, the G color light irradiation apparatus (line light source) 120 and the half mirror 122 are provided above the table 104, and the CSP tape 16 irradiates a light beam at a right angle. In addition to arranging the G color fall-off irradiation section, a G-color transmitted light irradiation apparatus (line light source) 124 for irradiating a light beam from the back surface of the CSP tape 16 may be further disposed in the table 104. The G-color light irradiation apparatus 120 and the G-color transmitted light irradiation apparatus 124 include LEDs for irradiating green (G) light beams, and are arranged along the optical axis LG of the CCD line sensor 110 represented by a dashed line. Irradiate a light beam of G color. The amount of light of G color incident light on the CCD line sensor 110 increases when there is a defect on the metal pattern portion. By detecting the defects of the CSP tape using a combination of the images obtained by the reflected light of G color, the defects of the three-dimensional shape generated in the metal pattern can be inspected with higher accuracy.

The R color light irradiating device and the B color light irradiating device are provided at positions opposite to the upstream side and the downstream side of the CSP tape in the conveying direction with respect to the CCD line sensor. It should just be installed in the opposite position centering on the line sensor. For example, when the installation positions of the R-color light irradiation apparatus and the B-color light irradiation apparatus are replaced, the positional relationship of the region where each color appears is replaced. In addition, in the case where the R-color light irradiation device and the B-color light irradiation device are provided at positions opposite to the width direction of the CSP tape, the areas where each color appears are arranged in the width direction of the CSP tape.

Moreover, in the above-mentioned aspect, although the case where light beam is irradiated below the CCD line sensor from the inclination direction of both the upstream and downstream of a CSP tape was demonstrated, the inclination of either the upstream and downstream of a CSP tape was inclined. The defect may be inspected based on the image obtained by the light beam irradiated from the direction and the image obtained by the light beam irradiated along the optical axis of the CCD line sensor.

In addition, although the above-mentioned aspect demonstrated the case where the 3D shape defect which generate | occur | produced in the metal pattern part of CSP tape was demonstrated, it is not limited to this, In the case of inspecting the 3D shape defect which generate | occur | produced on the surface of another article. The present invention can also be applied.

1 is a schematic configuration diagram of an inspection apparatus of a first embodiment of the present invention;

2 is a schematic configuration diagram of a first scan stage;

3 is a diagram illustrating reflected light in a first scan stage.

4 is a schematic configuration diagram of a second scan stage;

5 is a diagram for explaining reflected light in a second scan stage;

6 is a view showing an example of an image obtained in a first scan stage and a second scan stage;

7 is a schematic configuration diagram of an inspection device of a second embodiment of the present invention;

8 is a schematic configuration diagram of a scan stage of a second embodiment.

FIG. 9 is a diagram for explaining reflected light in the scan stage of the second embodiment; FIG.

10 is a diagram illustrating an example of an image obtained at a scan stage of a second embodiment;

It is a figure which shows the modification of the scan stage of 2nd Embodiment.

[Description of Drawings]

10: inspection device 16: CSP tape

52: first scan stage 54: table

60: CCD line sensor 62: first irradiation device

64: second irradiator 66: second scan stage

74: CCD line sensor 76: third irradiation device

82: computer 100: inspection device

102: scan stage 110: CCD line sensor

112: R color light irradiation device 114: B color light irradiation device

Claims (6)

A plurality of irradiation means for irradiating light to the inspection object from different directions; Imaging means for imaging each image by each of the light reflected from the inspection object by being irradiated by the plurality of irradiation means; Detecting means for inspecting a three-dimensional defect of the inspection object from each image picked up by the imaging means, The research means, An inclined direction irradiating means comprising at least one of first and second irradiating means, and third irradiating means for irradiating light to the inspection object from an upward direction, The first irradiating means irradiates the inspection object with light from a first inclined direction, The second irradiating means irradiates the inspection object with light from a second inclined direction, The third irradiating means irradiates at a different timing than the inclined direction irradiating means, And a fourth irradiating means for irradiating light to the inspection object from the downward direction at the same timing as the third irradiating means. delete delete The method of claim 1, The detection means extracts an area outside the first preset range of the density level from the image picked up by the imaging means when light is irradiated by the inclined direction irradiating means, and extracts an area outside the first preset range extracted. And detecting a defect of a three-dimensional shape based on the above-described method, and extracting a region having a density level outside the second predetermined range from the image picked up by the imaging means when light is irradiated by the upward irradiation means. 2 An inspection apparatus for detecting a three-dimensional defect on the basis of an area outside a preset range. The method of claim 1, And said plurality of irradiating means irradiates light of different colors, respectively. The method of claim 5, When the detection means irradiates the light of the different colors, the detection means extracts an area in which each color appears from each image picked up by the imaging means, and the positional relationship of the extracted respective areas and the shape of each extracted area. An inspection apparatus for detecting a three-dimensional defect based on at least one of the.

Images