1376982. 九、發明說明 【發明所屬之技術領域】 本發明是關於在製造彩色濾光片或有機 EL( Electroluminescent:電激發光）顯示裝置等之製造中， 藉由噴墨在基板上塗佈塗佈液之塗佈方法及使用此之圖案 形成方法。 【先前技術】 例如，在彩色濾光片之製造中，係將紅、綠、藍之3 色或是該些加上黑之4色的彩色光阻塗佈成特定圖案，最 近則硏究出噴墨塗佈以作爲將如此之複數材料塗佈於相同 基板之技術（例如專利文獻1、2、3)。噴墨塗佈是將於 彩色印刷廣泛所使用之噴墨印刷之原理應用於彩色濾光片 等之塗佈，由於每噴嘴噴出不同顔色之彩色光阻液，故有 可以同時執行形成3色或4色之彩色濾光薄膜的優點。 於使用噴墨塗佈而塗佈複數顏色之彩色光阻液之時， 有產生如塗佈於某區域之彩色光阻流出至鄰接之區域之問 題，爲了解決如此之問題，採用設置用以區隔不同區域之 被稱爲堤壁的區隔構件，將彩色光阻液塗佈至堤壁所包圍 之區域之手法（專利文獻4)。 然而，原理上噴墨塗佈無法以充分良好精度噴出彩色 光阻液至所欲之位置上。因此，由將彩色光阻液正確供給 至堤壁所包圍之區域之觀點來看，提案有於藉由CF4氣體 所產生之電漿處理，使全面施予撥水處理之後，藉由〇2 -5- 1376982 氣體電漿使基板面施予親水處理而選擇性僅使堤壁表面施 予撥水性處理，補正彩色光阻液之滴下位置的技術（專利 文獻5)。 但是，即使藉由如此之撥水處理也無法充分補正彩色 光阻液之滴下位置，當將彩色光阻液塡充於堤壁所包圍之 區域全體之時，則產生如彩色光阻液體越過堤壁而流出至 鄰接之區域的不當事態。再者，當藉由撥液處理使堤壁側 面成爲撥水性時，彩色光阻被彈起而無法充分塡充彩色光 阻，有產生漏光之虞。 〔專利文獻1〕日本特開平1-217302號公報 〔專利文獻2〕日本特開平7-72325號公報 〔專利文獻3〕曰本特開平7-146406號公報 〔專利文獻4〕日本特開平ι〇·133194號公報 〔專利文獻5〕日本特開2002-372921號公報 【發明內容】 〔發明所欲解決之課題〕 本發明是鑒於如此之事態所創作出者，其目的在於提 供藉由噴墨塗佈精度佳使塗佈膜塡充於形成在基板上之堤 壁內之塗佈方法及圖案形成方法。 〔用以解決課題之手段〕 爲了解決上述課題，在本發明之第1觀點中，提供一 種塗佈方法，其特徵爲：藉由噴墨方式供給塗佈液至基板 -6- 1376982 上堤壁所包圍之區域而形成塗佈膜，之後使其塗佈膜軟化 而予以流動，依此使該塗佈膜塡充於上述堤壁所包圍之區 域。 ' 在上述第1觀點中，即使藉由上述噴墨方式供給塗佈 液之後使塗佈膜固化亦可。再者，可以使上述堤壁表面施 有撥液處理，藉由噴墨供給塗佈液至上述堤壁所包圍之區 域之後，使塗佈膜軟化、流動之前，上述堤壁表面被執行 ^ 親液處理。並且，上述塗佈膜之軟化是藉由將上述塗佈膜 曝露於有機溶劑氛圍而執行爲佳。並且，上述堤壁所包圍 之區域，可以複數被形成在應形成複數彩色塗佈膜之各個 的位置上。此時，上述塗佈液可以設爲彩色光阻液，上述 塗佈膜可以設爲成爲彩色濾光片層之彩色光阻薄膜或是成 爲有機電激發光層之彩色光阻薄膜。又，可以將上述塗佈 膜適用於各種有機膜或是無機膜》 上述回流處理爲補正偏向上述堤壁所包圍之區域而形 φ 成的塗佈膜之位置者即可，再者，於在上述堤壁所包圍之 區域具有角部之時，即使上述塗佈膜遍及其角部亦可，又 . 於上述塗佈液爲高黏度之時，即使塗佈膜遍及上述堤壁所 包圍之區域之外周部亦可。 在本發明之第2觀點中，提供一種圖案形成方法，在 基板上形成藉由塗佈膜所產生之薄膜圖案，其特徵爲：具 有在基板上以包圍薄膜形成預定區域之方式形成堤壁之工 程；藉由噴墨供給塗佈液至上述堤壁所包圍之薄膜形成預 定區域，形成由塗佈膜所構成之薄膜之工程；和藉由使上 1376982 述薄膜軟化而予以流動，使該薄膜塡充於上述堤壁所包圍 之區域之工程。 在上述第2觀點中，即使又具有形成由上述塗佈膜所 構成之薄膜之後，使薄膜固化之工程亦可。再者，可以使 上述堤壁表面施有撥液處理，藉由噴墨供給塗佈液至上述 堤壁所包圍之薄膜形成預定區域之後，使薄膜軟化、流動 之前，上述堤壁表面被執行親液處理。又，上述薄膜之軟 化是藉由將上述薄膜曝露於有機溶劑氛圍而執行爲佳。再 者，上述堤壁所包圍之薄膜形成預定區域，可以複數被形 成在應形成複數彩色薄膜之各個的位置上。此時，上述塗 佈液可以爲彩色光阻液，上述薄膜可以爲彩色光阻薄膜， 依此形成彩色濾光片層之圖案或有機電激發光層之圖案。 再者，可以使上述塗佈膜適用於有機膜或是無機膜。 上述回流處理爲補正偏向上述堤壁所包圍之薄膜形成 預定區域而形成的薄膜之位置者即可。再者，於在上述堤 壁所包圍之薄膜形成預定區域具有角部之時，即使上述薄 膜遍及其角部亦可，又於上述塗佈液爲高黏度之時，即使 薄膜遍及上述堤壁所包圍之薄膜形成預定區域之外周部亦 可〇 在本發明之第3觀點中，提供一種記億媒體，記憶有 在電腦上動作，並且控制處理系統之程式，其特徵爲：上 述程式於實行時是以執行第1觀點所記載之塗佈方法之方 式，使電腦控制上述處理系統。 在本發明之第4觀點中，提供一種記憶媒體，記億有 -8- 1376982 在電腦上動作，並且控制處理系統之程式，其特徵爲：上 述程式於實行時是以執行第2觀點所記載之圖案形成方法 之方式，使電腦控制上述處理系統。 〔發明效果〕 若藉由本發明，於藉由噴墨塗佈形成塗佈膜之後，因 藉由回流處理使塗佈膜擴散開，故可以精度佳使塗佈膜塡 ^ 充於堤壁內之區域。 【實施方式】 以下，一面參照附件圖面，一面針對本發明之實施形 態予以說明。 在此，舉例針對在液晶顯示裝置之彩色濾光片中塗佈 彩色光阻，形成彩色光阻圖案之方法予以說明。 第1圖爲表示本發明之一實施形態所涉及之彩色光阻 φ 圖案之形成方法的流程圖，第2圖爲用以說明各工程之工 程剖面圖。 . 首先，如第2圖（a)所示般，在玻璃基板1上藉由 光刻形成樹脂製之堤壁2，規定複數薄膜形成預定區域3 (步驟1)。該薄膜形成預定區域3是被形成在應形成紅 、綠、藍之3色或該些加上黑之4色的彩色光阻之薄膜之 各個的位置上。 接著，藉由使用例如CF4氣體般之含氟氣體的常壓電 漿，在玻璃基板1之全面施予對彩色光阻液體的撥液處理 -9- 1376982 (撥水處理），形成疏水面4(步驟2，第2圖（b))。 之後，藉由〇2氣體電漿，予以處理，使玻璃基板1表面 之氟飛散，予以親水化（步驟3，第2圖（c))。 在該狀態下，藉由噴墨塗佈，將當作塗佈液之特定顔 色的彩色光阻液自噴嘴噴出至薄膜形成預定區域3，形成 將成爲彩色濾光層之彩色光阻薄膜7(步驟4，第2圖（d ))如上述般，噴墨塗佈爲將彩色印刷廣泛使用之噴墨印 刷之原理應用於彩色濾光片等之塗佈者，使用不同噴嘴執 行噴出紅、綠、藍之3色或該些加上黒之4色彩色光阻， 鄰接之薄膜形成預定區域3則被滴下互相不同顏色之彩色 光阻液。依此，可以同時形成3色或4色之彩色濾光片層 〇 此時，因對堤壁2施予撥水處理，而形成疏水面4, 故藉由噴墨方式即使自噴嘴5噴出之彩色光阻液6之滴下 位置多少有偏移，亦傳達堤壁2之側面而位置補正至中心 位置。在此，以使彩色光阻液6之供給量不自薄膜形成預 定區域3溢流之方式，停止於少量。在該階段，由於在疏 水面4彈起等，使得彩色光阻液6不在薄膜形成預定區域 3之全面擴散開，形成有間隙》 接著，藉由在堤壁2表面塗佈親水化液，或施予UV 照射處理等，除去堤壁2表面之疏水部而使全面親水化（ 步驟5，第2圖（e))。 之後，因應所需以適當之方法使所形成之彩色光阻薄 膜7予以固化（步驟6,第2圖（f))。此時不管固化 -10- 1376982 之手法，即使執行不施加減壓乾燥等之熱的乾燥而予以固 化亦可，或即使加熱予以固化亦可。該固化工程於不造成 _ 搬運中之彩色薄膜7之變形等之問題時，不一定需要。 ' 在該狀態下，使彩色光阻薄膜7曝露於稀釋劑等之有 機溶劑之氛圍而使軟化，並使流動（回流）（步驟7,第 2圖（g))。依此，彩色光阻薄膜7在薄膜形成預定區 域3之全面擴散開，成爲平坦化，被埋入形成於薄膜形成 ^ 預定區域 3之間隙。該回流處理是如日本特開2002-334830號公報所揭示般，爲了省略用以光刻之圖案之形 成工程，開發有使光阻之形狀變化之技術。該回流處理是 在將玻璃基板1載置於腔室內之狀態下，可以藉由蒸發等 將溶劑蒸氣導入至腔室內而執行。 如此一來，於執行噴墨塗佈之後，於執行回流處理之 時，即使彩色光阻液之量少因亦可以在薄膜形成預定區域 3之全面擴散開，故可以減少噴墨塗佈之時之彩色光阻之 φ 供給量。此時，雖然彩色光阻薄膜7之膜厚變薄，但是可 以藉由將初期時之光阻濃度設定成高濃度，或增加色濃度 . 來對應。於回流處理之後，因應所需執行加熱處理。依此 ，形成由彩色光阻所形成之薄膜的所欲圖案。 如此一來，藉由組合噴墨塗佈和回流處理，可以取得 以下之極大優點。 (1)噴墨塗佈由於不一定可以充分對應於本質爲微 細之圖案，故如第3圖（a )所示般，彩色光阻液6之滴 下位置在薄膜形成預定區域3之中偏離，此時如第3圖（ -11 - 1376982 b)所示般，所形成之顔色光阻薄膜7之位置也偏離產生 顔色變淺之部份9(淺色部份）。再者，如第4圖（a) 所示般，又產生滴下位置偏離而一部份擱在堤壁2之情形 ，此時如第4圖（b)所示般，存在彩色光阻薄膜7之位 置又偏離，因退色之部份（退色部份）10而產生漏光之 部份。對此，藉由適用回流處理使彩色光阻薄膜7流動， 則可以將如第3圖（b)或第4圖（b)所示般之薄膜7之 偏離修正成第5圖（a) 、（b)而防止色薄部份或退色部 份之發生。 (2) 在以往之噴墨塗佈中，彩色光阻之滴下位置多 少偏離，因以彩色光阻遍及薄膜形成預定區域3之全面之 方式，而使得彩色光阻液之噴出量增加，故彩色光阻液超 越堤壁2而流出，有產生混色之虞，但是於使用回流處理 之時，於噴出時彩色光阻液不需要在薄膜形成預定區域3 之全面擴散開，因此可以減少彩色光阻液之噴出量難以產 生其流出。 (3) 噴墨塗佈因爲滴下液體而使液體塡充於堤壁2 所包圍之區域者，故容易藉由液體之表面張力噴出形狀成 爲圓形。因此，於堤壁2所包圍之區域之形狀爲存在有角 部之時，則如第6圖（a)所示般，彩色光阻液6不遍及 角部12，其部份容易成爲退色。對此，藉由適用回流處 理而使彩色光阻薄膜7流動，如第6圖（b)所示般，可 以使薄膜7遍及角部12，並可以成爲難以產生退色部份 -12- 1376982 (4)於使用高黏度光阻之時，因噴墨塗佈之時之光 阻噴出量少量即可，故可以刪減光阻使用量，抑制越過堤 • 壁2，雖然難以產生混色，但是高黏度光阻流動性少，並 且少量滴下，故彩色光阻難以遍及薄膜形成預定區域3之 外周部’如第7圖（a)所示般，容易產生外周部13之退 色。對此，藉由適用回流處理，即使於使用如此高黏度光 阻之時，亦可以使彩色光阻薄膜7流動，如第7圖（b ) φ 所示般，可以使薄膜7遍及薄膜形成預定區域3之外周部 而擴散於全體。 並且，不需要形成步驟2之形成疏水面4及步驟3之 玻.璃基板1表面之親水化處理。於不執行該些工程之時， 則也不需要步驟5之親水化處理。 步驟6之薄膜7之固化於執行步驟7之回流處理之時 ’可藉由於回流處理之前在回流處理腔室內執行減壓乾燥 ，或藉由埋設於載置台之加熱器等所執行之加熱乾燥來執 φ 行。但是，於設置於噴墨塗佈裝置和回流處理裝置分開之 位置之時，執行噴墨塗佈後玻璃基板被搬入至回流處理裝 - 置之腔室的玻璃基板搬運時，則有藉由噴墨塗佈所形成之 _ 薄膜圖案損壞之虞。此時，於執行噴墨塗佈之後，馬上藉 由個別設置之裝置，執行減壓乾燥或加熱乾燥而予以固化 爲佳。 由極力使藉由噴墨塗佈所形成薄膜圖案不損壞之觀點 來看，以執行噴墨塗佈之後迅速執行回流處理爲佳，由如 此之觀點來看，以使用噴墨塗佈裝置和回流裝置成爲一體 -13- 1376982 之裝置爲佳。作爲如此之裝置，即使爲在鄰接不同之腔室 內各執行噴墨塗佈和回流處理者，或在相同腔室執行噴墨 塗佈和回流處理者亦可。再者，於執行噴墨塗佈之後，至 執行回流處理之期間，即使執行加熱處理等，適當之其他 處理亦可。 接著，針對執行如此之圖案形成方法之處理系統及其 控制系統之例予以說明。 第8圖爲表示如此之處理系統之方塊圖。該處理系統 1 00是如上述般，具備有藉由例如光刻技術形成堤壁之堤 壁形成裝置1 0 1、執行例如CF4氣體之電漿而執行撥水處 理，藉由〇2氣體之電漿執行親水化處理之電漿處理裝置 102、自噴嘴供給彩色光阻而形成彩色光阻薄膜之噴墨塗 佈裝置103、藉由減壓乾燥或加熱乾燥等使噴墨塗佈後之 彩色光阻薄膜固化之固化裝置104、在執行撥水處理而成 爲疏水面之堤壁表面，執行親水液塗佈或UV照射之親水 化裝置105、對彩色光阻薄膜執行回流處理之回流處理裝 置106等，並且在該些之間搬運基板1之搬運機構107» 再者，具有由控制處理裝置101〜106及搬運機構107之 微處理器（電腦）所構成之製程控制器108»在製程控制 器108，操作者爲了管理處理系統100連接有執行指令之 輸入操作等之鍵盤，或由將電漿處理裝置之運轉狀況可視 化而予以顯示之顯示器等所構成之使用者介面109。 再者，於製程控制器108連接有記億部110，該記億 部儲存有用以在製程控制器108之控制下實現在處理系統 -14- 1376982 100所實行之各種處理之控制程式，或因應處理 使處理系統1〇〇之各構成裝置實行處理之程式艮[ 式。處理程式被記億於記憶部110之中之記億媒 ' 媒體即使爲硬碟或半導體記憶體亦可，即使爲 DVD、快閃記億體等之可搬運性者亦可。再者， 他裝置經由例如專用迴路而適當傳送處理程式亦 然後，因應所需，利用來自使用者介面109 0 自記憶部110叫出任意之處理程式而使製程控制 行，依此在製程控制器1 0 8之控制下，執行處理 之所欲處理。 構成處理系統100之各處理裝置即使爲全部 別裝置亦可，即使一部份或全部爲一體化者亦可 體化之例可以舉出將噴墨塗佈裝置103和固化裝 體化，將噴墨塗佈裝置103和固化裝置104和回 置106 —體化，將固化裝置104和回流處理裝置 φ 化等。 藉由上述之裝置構成，根據記憶於記憶媒體 . 式，使處理系統實行上述第1圖所示之工程，可 _ 色光阻之塗佈處理及彩色光阻薄膜圖案之形成。 並且，本發明並不限定於上述實施形態，可 形。例如’在上述實施形態中，雖然本發明適用 色光阻薄膜圖案，該彩色薄膜圖案爲使用於液晶 等所使用之彩色濾光片之濾光片層，但是亦可以 成使用有機半導體膜之EL元件用之彩色光阻薄 丨條件用以 I是處理程 :體。記億 CDROM、 即使自其 可。 之指示等 器108實 [系統100 獨立之各 。作爲一 置 104 — 流處理裝 106 -體 之處理程 以執行彩 作各種變 於形成彩 顯示裝置 適用於形 膜圖案， -15- 1376982 再者，亦可以適用於形成LED (發光二極體）元件等之顯 示裝置中的薄膜，還有形成各種有機膜或無機膜，例如形 成氧化銦錫（ITO)膜或絕緣膜等之薄膜。 再者，雖然回流處理以使用有機溶劑之例予以表示， 但是並不限定於此，若爲對所形成之薄膜賦予流動性者， 即使爲藉由熱所產生之處理等，或其他處理亦可。 【圖式簡單說明】 第1圖爲表示本發明之一實施形態所涉及之彩色光阻 圖案之形成方法之流程圖。 第2圖爲用以說.明本發明之一實施形態所涉及之彩色 光阻圖案之形成方法之各工程的工程剖面圖。 第3圖爲表示噴墨塗佈中之彩色光阻液之滴下位置及 所形成之薄膜之偏離的圖式。 第4圖爲表示噴墨塗佈中之彩色光阻液之滴下位置之 偏離及所形成之薄膜之偏離之圖式。 第5圖爲表示以回流處理補正噴墨塗佈中之薄膜偏離 之狀態的圖式》 第6圖爲表示以回流處理補正噴墨塗佈中之薄膜偏離 的狀態圖。 第7圖爲表示以噴墨塗佈在具有角部之區域形成薄膜 之狀態，和將藉由回流處理塗佈高黏度光阻而所形成之薄 膜遍及於薄膜形成預定區域之外周部的狀態圖。 第8圖爲表示執行本發明之一實施形態所涉及之圖案 1376982 形成方法之處理系統及其控制系統之例的方塊圖。 【主要元件符號說明】 1 :玻璃基板 2 :堤壁 3:薄膜形成預定區域 4 :疏水面 5 :噴嘴 6 :彩色光阻液 7 :彩色光阻薄膜 9 :淺色部份 10 :退色部份 12 :角部 1 3 :外周部 1 〇 〇 :處理系統 1 0 3 :噴墨塗佈裝置 1 〇 4 :固化裝置 106 :回流處理裝置 108 :製程控制器 1 1 〇 :記憶部 -17-1. Technical Field of the Invention The present invention relates to coating a substrate by inkjet in the manufacture of a color filter or an organic EL (electroluminescent) display device. A coating method of a cloth liquid and a pattern forming method using the same. [Prior Art] For example, in the manufacture of color filters, three colors of red, green, and blue or four color-colored photoresists of black are applied to a specific pattern, and recently, Inkjet coating is employed as a technique for applying such a plurality of materials to the same substrate (for example, Patent Documents 1, 2, and 3). Inkjet coating is applied to the application of color filters and the like in the principle of inkjet printing widely used in color printing. Since each nozzle emits color photoresist of different colors, it is possible to simultaneously form three colors or The advantages of a 4-color color filter film. When a color photoresist of a plurality of colors is applied by inkjet coating, there is a problem that a color resist applied to a certain region flows out to an adjacent region, and in order to solve such a problem, a setting region is used. A method of applying a color photoresist liquid to a region surrounded by a bank wall by a partition member called a bank wall in a different region (Patent Document 4). However, in principle, inkjet coating cannot eject a color photoresist liquid to a desired position with sufficient good precision. Therefore, from the viewpoint of correctly supplying the color photoresist liquid to the region surrounded by the bank wall, it is proposed to treat the plasma generated by the CF4 gas so that after the water treatment is fully applied, by 〇2- 5- 1376982 Gas plasma The technique of applying a hydrophilic treatment to the substrate surface and selectively applying a water repellency treatment to the surface of the bank to correct the dropping position of the color photoresist liquid (Patent Document 5). However, even if such a water repellent treatment is performed, the dropping position of the color photoresist liquid cannot be sufficiently corrected, and when the color photoresist liquid is filled on the entire area surrounded by the bank wall, a color resist liquid is generated over the bank. Improper events from the wall to the adjacent area. Further, when the side wall of the bank is water-repellent by the liquid-repellent treatment, the color resist is bounced and the color resist cannot be sufficiently filled, and light leakage occurs. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei 7-72325 (Patent Document 3) Japanese Patent Laid-Open No. Hei 7-72325 (Patent Document 3) [Patent Document 5] JP-A-2002-372921 SUMMARY OF INVENTION [Problem to be Solved by the Invention] The present invention has been made in view of such a situation, and its object is to provide inkjet coating. The coating method is excellent in the coating method and the pattern forming method in which the coating film is filled in the bank wall formed on the substrate. [Means for Solving the Problems] In order to solve the above problems, a first aspect of the present invention provides a coating method for supplying a coating liquid to a substrate -6 - 1376982 by an ink jet method. A coating film is formed in the surrounding area, and then the coating film is softened and flows, whereby the coating film is filled in a region surrounded by the bank wall. In the above first aspect, the coating film may be solidified even after the coating liquid is supplied by the above-described inkjet method. Further, the surface of the bank may be subjected to a liquid-repellent treatment, and after the coating liquid is supplied to the region surrounded by the bank by the inkjet, the surface of the bank is executed before the coating film is softened and flowed. Liquid treatment. Further, the softening of the coating film is preferably carried out by exposing the coating film to an organic solvent atmosphere. Further, the region surrounded by the bank may be formed at a plurality of positions at which the plurality of color coating films are to be formed. In this case, the coating liquid may be a color resist liquid, and the coating film may be a color resist film which is a color filter layer or a color resist film which is an organic electroluminescence layer. Further, the coating film may be applied to various organic films or inorganic films. The reflow treatment may be performed to correct the position of the coating film which is formed by arranging the region surrounded by the bank, and then When the region surrounded by the bank has a corner portion, even if the coating film is over the corner portion, when the coating liquid has a high viscosity, even if the coating film is spread over the region surrounded by the bank wall The outer perimeter is also available. According to a second aspect of the present invention, there is provided a pattern forming method for forming a thin film pattern produced by a coating film on a substrate, characterized by having a bank wall formed on a substrate so as to surround a film forming a predetermined region. Engineering for forming a film by coating a predetermined area on a film surrounded by the ink jet by a coating liquid, and forming a film composed of a coating film; and flowing the film by softening the upper 1377982 film to make the film The project of filling the area surrounded by the above-mentioned embankment. In the second aspect, even if the film formed of the coating film is formed, the film may be solidified. Further, the surface of the bank may be subjected to a liquid-repellent treatment, and the surface of the bank is subjected to pro-waxing before the film is softened and flowed by the inkjet supply of the coating liquid to a predetermined region of the film surrounded by the bank. Liquid treatment. Further, the softening of the film is preferably carried out by exposing the film to an organic solvent atmosphere. Further, the film surrounded by the bank walls is formed into a predetermined region, and may be formed in plural at positions where a plurality of color thin films should be formed. In this case, the coating liquid may be a color photoresist liquid, and the film may be a color photoresist film, thereby forming a pattern of a color filter layer or a pattern of an organic electroluminescent layer. Further, the coating film can be applied to an organic film or an inorganic film. The reflow treatment may be performed to correct the position of the film formed by forming a predetermined region of the film surrounded by the bank. Further, when the film forming peripheral region surrounded by the bank has a corner portion, even if the film is over the corner portion, even when the coating liquid has a high viscosity, even if the film is surrounded by the bank wall In addition to the third aspect of the present invention, a film-forming medium may be provided in the third aspect of the present invention, and a program for controlling the processing system is described, wherein the program is executed when the program is executed. The computer is controlled by the computer to execute the coating method described in the first aspect. According to a fourth aspect of the present invention, there is provided a memory medium, wherein the program operates on a computer and controls a program of the processing system, wherein the program is executed in accordance with the execution of the second viewpoint. The pattern forming method is such that the computer controls the above processing system. [Effect of the Invention] According to the present invention, after the coating film is formed by inkjet coating, the coating film is diffused by the reflow treatment, so that the coating film can be accurately filled in the bank wall. region. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to an attached drawing. Here, a method of applying a color resist to a color filter of a liquid crystal display device to form a color resist pattern will be described. Fig. 1 is a flow chart showing a method of forming a color resist φ pattern according to an embodiment of the present invention, and Fig. 2 is a cross-sectional view showing the construction of each project. First, as shown in Fig. 2(a), a resin-made bank 2 is formed on the glass substrate 1 by photolithography, and a predetermined film formation predetermined region 3 is defined (step 1). The film formation predetermined region 3 is formed at each position of a film which should form three colors of red, green, and blue or a color resist of four colors of black. Next, by using a normal piezoelectric slurry such as a CF4 gas as a fluorine-containing gas, the liquid-repellent treatment of the color photoresist liquid is completely applied to the glass substrate 1-9- 1376982 (water treatment) to form a hydrophobic surface 4 (Step 2, Figure 2 (b)). Thereafter, it is treated by 〇2 gas plasma, and the fluorine on the surface of the glass substrate 1 is scattered and hydrophilized (step 3, Fig. 2(c)). In this state, a color resist liquid of a specific color as a coating liquid is ejected from the nozzle to the film formation predetermined region 3 by inkjet coating to form a color resist film 7 to be a color filter layer ( Step 4, Fig. 2 (d)) As described above, inkjet coating is applied to a color filter or the like by a principle of inkjet printing which is widely used for color printing, and red and green are sprayed using different nozzles. The three colors of blue, or the four color-colored photoresists which are added with the enamel, and the adjacent film forming the predetermined region 3 are dropped with color resist liquids of different colors from each other. Accordingly, a color filter layer of three colors or four colors can be simultaneously formed. At this time, the water repellent treatment is applied to the bank 2 to form the hydrophobic surface 4, so that it is ejected from the nozzle 5 by the inkjet method. The position of the drop of the color photoresist 6 is somewhat offset, and the side of the bank 2 is also conveyed and the position is corrected to the center position. Here, the supply amount of the color resist liquid 6 is stopped in a small amount so as not to overflow from the film formation predetermined region 3. At this stage, the color resist liquid 6 does not spread over the entire film formation predetermined region 3 due to the bombing of the hydrophobic surface 4, etc., and a gap is formed. Next, by applying a hydrophilizing liquid on the surface of the bank 2, or By applying a UV irradiation treatment or the like, the hydrophobic portion on the surface of the bank 2 is removed to be fully hydrophilized (step 5, Fig. 2(e)). Thereafter, the formed color photoresist film 7 is cured in an appropriate manner in accordance with the necessity (step 6, Fig. 2 (f)). In this case, regardless of the method of curing -10- 1376982, it may be cured by drying without applying heat such as vacuum drying or the like, or may be cured by heating. This curing process is not necessarily required when it does not cause a problem such as deformation of the color film 7 during transportation. In this state, the color resist film 7 is exposed to an atmosphere of an organic solvent such as a diluent to soften and flow (reflow) (step 7, Fig. 2(g)). As a result, the color resist film 7 is diffused over the entire film formation predetermined region 3 to be flattened, and is buried in the gap formed in the predetermined region 3 of the film formation. This reflow process is a technique for changing the shape of a photoresist in order to omit the formation of a pattern for photolithography as disclosed in Japanese Laid-Open Patent Publication No. 2002-334830. This reflow treatment is carried out by introducing the solvent vapor into the chamber by evaporation or the like while the glass substrate 1 is placed in the chamber. In this way, after the ink-jet coating is performed, even when the amount of the color photoresist liquid is small, the total amount of the color photoresist liquid can be diffused in the film formation predetermined region 3, so that the ink-jet coating time can be reduced. The amount of φ supply of the color photoresist. At this time, although the film thickness of the color resist film 7 is thin, it can be determined by setting the initial photoresist concentration to a high concentration or increasing the color density. After the reflow treatment, heat treatment is performed as needed. Accordingly, a desired pattern of the film formed by the color resist is formed. As a result, by combining inkjet coating and reflow processing, the following great advantages can be obtained. (1) The inkjet coating does not necessarily correspond to a substantially fine pattern, and as shown in Fig. 3(a), the dropping position of the color resist liquid 6 deviates in the film formation predetermined region 3, At this time, as shown in Fig. 3 (-11 - 1376982 b), the position of the formed color resist film 7 is also deviated from the portion 9 (light portion) where the color is lightened. Further, as shown in Fig. 4(a), there is a case where the dropping position is deviated and a part is placed on the bank 2, and as shown in Fig. 4(b), the color resist film 7 is present. The position is further deviated, and the light leakage portion is generated due to the faded portion (fading portion) 10. On the other hand, by applying the reflow process to flow the color resist film 7, the deviation of the film 7 as shown in Fig. 3(b) or Fig. 4(b) can be corrected to Fig. 5(a). (b) Prevent the occurrence of a thin portion or a faded portion. (2) In the conventional inkjet coating, the position of the drop of the color resist is somewhat deviated, and the color resist is increased in the manner in which the color resist is formed over the entire area of the film forming the predetermined region 3, so that the color is increased. The photoresist liquid flows out beyond the bank 2, and there is a possibility of color mixing. However, when the reflow process is used, the color photoresist liquid does not need to be diffused in the film formation predetermined region 3 at the time of ejection, so that the color photoresist can be reduced. It is difficult for the discharge amount of the liquid to cause its outflow. (3) Since the ink is applied by dripping the liquid to fill the area surrounded by the bank 2, it is easy to form a circular shape by the surface tension of the liquid. Therefore, when the shape of the region surrounded by the bank 2 is such that the corner portion is present, as shown in Fig. 6(a), the color resist liquid 6 does not extend over the corner portion 12, and the portion thereof tends to be discolored. On the other hand, the color resist film 7 is caused to flow by applying a reflow process, and as shown in Fig. 6(b), the film 7 can be spread over the corner portion 12, and it becomes difficult to produce a fading portion -12 - 1376982 ( 4) When a high-viscosity photoresist is used, a small amount of photoresist can be ejected at the time of ink-jet coating, so that the amount of photoresist used can be reduced, and the crossing of the bank 2 can be suppressed, although it is difficult to produce color mixture, but it is high. Since the viscosity of the viscous photoresist is small and a small amount is dropped, it is difficult for the color resist to spread over the outer peripheral portion of the predetermined region 3 of the film formation. As shown in Fig. 7(a), the fading of the outer peripheral portion 13 is likely to occur. In this regard, by applying the reflow treatment, even when such a high-viscosity photoresist is used, the color resist film 7 can be made to flow, and as shown in Fig. 7(b) φ, the film 7 can be formed throughout the film. The outer periphery of the area 3 spreads over the whole. Further, it is not necessary to form the hydrophilization treatment of the surface of the glass substrate 1 in which the hydrophobic surface 4 and the step 3 are formed. The hydrophilization treatment of step 5 is also not required when the works are not performed. The curing of the film 7 of the step 6 is performed at the time of performing the reflow treatment of the step 7 by performing vacuum drying in the reflow processing chamber before the reflow treatment, or by heating and drying performed by a heater or the like embedded in the mounting table. Hold φ line. However, when the inkjet coating device and the reflow processing device are disposed at separate positions, when the glass substrate is loaded into the glass substrate of the reflow processing device after the inkjet coating is performed, there is a spray The film formed by the ink coating is damaged. At this time, it is preferable to perform vacuum drying or heat drying to perform curing immediately after the ink-jet coating is performed. From the viewpoint of minimizing damage to the film pattern formed by inkjet coating, it is preferred to perform reflow treatment immediately after performing inkjet coating, from such a viewpoint to use an inkjet coating device and reflow. It is preferred that the device be integrated into the device of-13-1376982. As such a device, even if inkjet coating and reflow processing are performed in each of the adjacent chambers, or inkjet coating and reflow processing are performed in the same chamber. Further, after the inkjet coating is performed, during the reflow treatment, even if the heat treatment or the like is performed, other appropriate treatments may be employed. Next, an example of a processing system and a control system for performing such a pattern forming method will be described. Figure 8 is a block diagram showing such a processing system. As described above, the processing system 100 is provided with a bank forming apparatus 110 that forms a bank by, for example, a photolithography technique, and performs a water repellent process by performing, for example, a plasma of CF4 gas. The plasma processing apparatus 102 that performs the hydrophilization treatment on the slurry, the inkjet coating apparatus 103 that supplies the color photoresist from the nozzle to form the color photoresist film, and the colored light after the inkjet coating by vacuum drying or heat drying The curing device 104 for curing the resist film, the hydrophilizing device 105 for performing hydrophilic liquid coating or UV irradiation, and the reflow processing device 106 for performing reflow treatment on the color resist film, etc., performing a water repellent treatment to form a surface of a bank surface of a hydrophobic surface And transporting the substrate 1 between the substrates 1 and further, the process controller 108 having the microprocessor (computer) controlled by the processing devices 101 to 106 and the transport mechanism 107 is at the process controller 108 In order to manage the processing system 100, the operator connects a keyboard such as an input operation for executing an instruction, or a display such as a display that visualizes the operation state of the plasma processing apparatus. User interface 109. Furthermore, the process controller 108 is connected to the unit 100, which stores a control program for implementing various processes performed by the processing system-14-1376982 100 under the control of the process controller 108, or The program for processing each of the constituent devices of the processing system 1 is processed. The processing program is recorded in the memory unit 110. The medium can be used as a hard disk or a semiconductor memory, even if it is a portable device such as a DVD or a flash memory. Furthermore, the device appropriately transmits the processing program via, for example, a dedicated circuit, and then, according to the user interface 109 0, the arbitrary processing program is called from the memory unit 110 to cause the process control line, thereby the process controller. Under the control of 1 0 8 , the processing is performed as desired. Each of the processing devices constituting the processing system 100 may be an integral device, and even if it is a part or all of the integrated device, the inkjet coating device 103 and the curing device may be packaged. The ink application device 103 and the curing device 104 and the rewinding device 106 are integrated, and the curing device 104 and the reflow processing device are φ. According to the above-described apparatus configuration, the processing system performs the above-described construction shown in Fig. 1 based on the memory medium, and can form the photoresist processing and the color resist film pattern. Further, the present invention is not limited to the above embodiment and can be shaped. For example, in the above embodiment, the present invention is applied to a color resist film pattern which is a filter layer used for a color filter used for a liquid crystal or the like, but may be an EL element using an organic semiconductor film. The color photoresist is used for the condition that I is the process: body. Remember the billion CDROM, even if it is available. The indicator 108 is implemented [the system 100 is independent of each other. As a process of 104-flow processing device 106-body to perform coloring, various color forming devices are suitable for forming a film pattern, -15- 1376982. Further, it can also be applied to form an LED (Light Emitting Diode). A thin film in a display device such as a device, or a film in which various organic films or inorganic films are formed, for example, an indium tin oxide (ITO) film or an insulating film is formed. In addition, although the reflow treatment is represented by an example using an organic solvent, the present invention is not limited thereto, and if the fluidity is imparted to the formed film, it may be treated by heat or the like, or other treatment may be used. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing a method of forming a color resist pattern according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing the construction of each of the methods for forming a color resist pattern according to an embodiment of the present invention. Fig. 3 is a view showing the dropping position of the color resist liquid in the ink-jet coating and the deviation of the formed film. Fig. 4 is a view showing the deviation of the dropping position of the color resist liquid in the ink-jet coating and the deviation of the formed film. Fig. 5 is a view showing a state in which the film in the inkjet coating is corrected by the reflow treatment. Fig. 6 is a view showing a state in which the film deviation in the inkjet coating is corrected by the reflow treatment. Fig. 7 is a view showing a state in which a film is formed by inkjet coating in a region having a corner portion, and a state in which a film formed by applying a high-viscosity resist by a reflow process is spread over a peripheral portion of a predetermined region of film formation. . Fig. 8 is a block diagram showing an example of a processing system and a control system for executing the pattern 1376982 forming method according to an embodiment of the present invention. [Description of main component symbols] 1 : Glass substrate 2 : Bank wall 3 : Film formation predetermined area 4 : Hydrophobic surface 5 : Nozzle 6 : Color photoresist liquid 7 : Color photoresist film 9 : Light color part 10 : Fading part 12: corner portion 1 3 : outer peripheral portion 1 〇〇: processing system 1 0 3 : inkjet coating device 1 〇 4 : curing device 106 : reflow processing device 108 : process controller 1 1 〇 : memory portion -17-