TWI371808B - Au alloy bonding wire - Google Patents

Au alloy bonding wire

Info

Publication number
TWI371808B
TWI371808B TW094134343A TW94134343A TWI371808B TW I371808 B TWI371808 B TW I371808B TW 094134343 A TW094134343 A TW 094134343A TW 94134343 A TW94134343 A TW 94134343A TW I371808 B TWI371808 B TW I371808B
Authority
TW
Taiwan
Prior art keywords
bonding wire
alloy bonding
alloy
wire
bonding
Prior art date
Application number
TW094134343A
Other languages
English (en)
Other versions
TW200620510A (en
Inventor
Hiroshi Murai
Jun Chiba
Satoshi Teshima
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of TW200620510A publication Critical patent/TW200620510A/zh
Application granted granted Critical
Publication of TWI371808B publication Critical patent/TWI371808B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01203—3N purity grades, i.e. 99.9%
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    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01205—5N purity grades, i.e. 99.999%
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/1576—Iron [Fe] as principal constituent
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
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    • H01L2924/20751—Diameter ranges larger or equal to 10 microns less than 20 microns
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  • Engineering & Computer Science (AREA)
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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
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  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
TW094134343A 2004-09-30 2005-09-30 Au alloy bonding wire TWI371808B (en)

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WO2006035803A1 (ja) 2006-04-06
US20080050267A1 (en) 2008-02-28
KR100899322B1 (ko) 2009-05-27
TW200620510A (en) 2006-06-16
KR20070058681A (ko) 2007-06-08
CN100487883C (zh) 2009-05-13
EP1811555A1 (en) 2007-07-25
CN101040372A (zh) 2007-09-19
JP3969671B2 (ja) 2007-09-05
JPWO2006035803A1 (ja) 2008-05-15
EP1811555A4 (en) 2012-06-20

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