TWI371590B - Method and apparatus for testing semiconductor wafers by means of a temperature-regulated chuck device - Google Patents

Method and apparatus for testing semiconductor wafers by means of a temperature-regulated chuck device

Info

Publication number
TWI371590B
TWI371590B TW095100240A TW95100240A TWI371590B TW I371590 B TWI371590 B TW I371590B TW 095100240 A TW095100240 A TW 095100240A TW 95100240 A TW95100240 A TW 95100240A TW I371590 B TWI371590 B TW I371590B
Authority
TW
Taiwan
Prior art keywords
temperature
semiconductor wafers
chuck device
testing semiconductor
regulated
Prior art date
Application number
TW095100240A
Other languages
English (en)
Other versions
TW200628818A (en
Inventor
Reitinger Erich
Original Assignee
Ers Electronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36274039&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI371590(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ers Electronic Gmbh filed Critical Ers Electronic Gmbh
Publication of TW200628818A publication Critical patent/TW200628818A/zh
Application granted granted Critical
Publication of TWI371590B publication Critical patent/TWI371590B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095100240A 2005-01-10 2006-01-03 Method and apparatus for testing semiconductor wafers by means of a temperature-regulated chuck device TWI371590B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005001163A DE102005001163B3 (de) 2005-01-10 2005-01-10 Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung

Publications (2)

Publication Number Publication Date
TW200628818A TW200628818A (en) 2006-08-16
TWI371590B true TWI371590B (en) 2012-09-01

Family

ID=36274039

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100240A TWI371590B (en) 2005-01-10 2006-01-03 Method and apparatus for testing semiconductor wafers by means of a temperature-regulated chuck device

Country Status (10)

Country Link
US (1) US7271604B2 (zh)
EP (1) EP1844342B1 (zh)
JP (1) JP4825812B2 (zh)
KR (1) KR101185536B1 (zh)
CN (1) CN101137911B (zh)
DE (1) DE102005001163B3 (zh)
ES (1) ES2821736T3 (zh)
RU (1) RU2407023C2 (zh)
TW (1) TWI371590B (zh)
WO (1) WO2006072598A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI827329B (zh) * 2021-10-29 2023-12-21 致茂電子股份有限公司 探針冷卻系統、冷卻方法及具備該系統之電子元件測試設備

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002263A (en) * 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6951846B2 (en) * 2002-03-07 2005-10-04 The United States Of America As Represented By The Secretary Of The Army Artemisinins with improved stability and bioavailability for therapeutic drug development and application
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
US6861856B2 (en) * 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US20070294047A1 (en) * 2005-06-11 2007-12-20 Leonard Hayden Calibration system
JP2007088203A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
JP4525571B2 (ja) * 2005-11-24 2010-08-18 住友電気工業株式会社 ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ
DE102006038457B4 (de) * 2006-08-16 2014-05-22 Cascade Microtech, Inc. Verfahren und Vorrichtung zum Temperieren elektronischer Bauelemente
DE112008002615B4 (de) * 2007-10-10 2015-02-19 Cascade Microtech, Inc. Verfahren zur Prüfung eines Testsubstrats unter definierten thermischen Bedingungen und thermisch konditionierbarer Prober
DE102008041250A1 (de) * 2008-08-13 2010-02-25 Ers Electronic Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
KR101015600B1 (ko) * 2008-12-19 2011-02-17 세크론 주식회사 프로브 스테이션용 스테이지 유닛 및 이를 포함하는 웨이퍼검사 장치
JP5640894B2 (ja) * 2011-05-26 2014-12-17 東京エレクトロン株式会社 温度測定装置、温度測定方法、記憶媒体及び熱処理装置
US8814424B1 (en) * 2011-09-30 2014-08-26 Emc Corporation Power measurement transducer
US8814425B1 (en) * 2011-09-30 2014-08-26 Emc Corporation Power measurement transducer
US8602641B2 (en) * 2011-10-26 2013-12-10 Temptronic Corporation Environmental test system and method with in-situ temperature sensing of device under test (DUT)
KR101942027B1 (ko) 2012-03-28 2019-04-11 삼성전자 주식회사 디바이스의 온도 예측 방법
CN103645350B (zh) * 2013-12-09 2017-01-11 致茂电子(苏州)有限公司 具有扇形转盘传输设备的检测机台
CN110780133B (zh) * 2014-11-28 2022-01-04 泰克元有限公司 用于测试电子部件的分选机
KR102433967B1 (ko) * 2014-11-28 2022-08-22 (주)테크윙 전자부품 테스트용 핸들러
JP7078838B2 (ja) * 2017-12-01 2022-06-01 東京エレクトロン株式会社 プローバ
TWI684014B (zh) * 2018-01-18 2020-02-01 謝德風 模組化多點測試裝置
KR20190116037A (ko) * 2018-04-03 2019-10-14 에스케이하이닉스 주식회사 웨이퍼 척킹 장치 및 이를 포함하는 웨이퍼 테스트 장비
DE102019005093A1 (de) * 2019-07-22 2021-01-28 Att Advanced Temperature Test Systems Gmbh Verfahren zur temperatursteuerung bzw. -regelung eines chucks für einen wafer, eine temperiereinrichtung zum temperieren eines chucks sowie ein wafertestsystem zum testen eines wafers
CN113075429A (zh) * 2020-01-03 2021-07-06 迪科特测试科技(苏州)有限公司 探测卡、探测系统及探测方法
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
CN112345119B (zh) * 2020-09-25 2023-07-21 华东光电集成器件研究所 一种半导体晶圆温度标定系统
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US20220155364A1 (en) 2020-11-19 2022-05-19 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11754619B2 (en) * 2021-01-11 2023-09-12 Star Technologies, Inc. Probing apparatus with temperature-adjusting mechanism
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
RU2756337C1 (ru) * 2021-03-19 2021-09-29 Общество с ограниченной ответственностью «Остек-Электро» Устройство температурно-вакуумного воздействия
KR20220146304A (ko) 2021-04-23 2022-11-01 삼성전자주식회사 전원변환부를 갖는 프로브 카드 및 이를 포함하는 테스트 시스템
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4791364A (en) * 1985-08-20 1988-12-13 Thermonics Incorporated Thermal fixture for testing integrated circuits
DE3536098A1 (de) 1985-10-09 1987-04-09 Siemens Ag Einrichtung zum ueberwachen der temperatur eines elektrischen bauelements
US4845426A (en) * 1987-05-20 1989-07-04 Signatone Corporation Temperature conditioner for tests of unpackaged semiconductors
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
JPH03184355A (ja) * 1989-12-13 1991-08-12 Mitsubishi Electric Corp ウエハプローバ
US5001423A (en) * 1990-01-24 1991-03-19 International Business Machines Corporation Dry interface thermal chuck temperature control system for semiconductor wafer testing
US5124639A (en) * 1990-11-20 1992-06-23 Motorola, Inc. Probe card apparatus having a heating element and process for using the same
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US5166607A (en) * 1991-05-31 1992-11-24 Vlsi Technology, Inc. Method and apparatus to heat the surface of a semiconductor die in a device during burn-in while withdrawing heat from device leads
US5775416A (en) * 1995-11-17 1998-07-07 Cvc Products, Inc. Temperature controlled chuck for vacuum processing
US5977785A (en) * 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
US6476627B1 (en) * 1996-10-21 2002-11-05 Delta Design, Inc. Method and apparatus for temperature control of a device during testing
DE69818468T2 (de) * 1997-04-04 2004-07-22 Unisys Corp. Temperatur-Regelungssystem für eine elektronische Schaltung bei welcher die Temperatur über die Temperaturen einer Wärmequelle und einer Wärmesenke geschätzt wird
US6366105B1 (en) * 1997-04-21 2002-04-02 Taiwan Semiconductor Manufacturing Company Electrical test apparatus with gas purge
US6111421A (en) * 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object
JP2970628B2 (ja) 1997-11-07 1999-11-02 日本電気株式会社 高低温プローバおよびウエハ測定方法
US6091060A (en) * 1997-12-31 2000-07-18 Temptronic Corporation Power and control system for a workpiece chuck
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6866094B2 (en) * 1997-12-31 2005-03-15 Temptronic Corporation Temperature-controlled chuck with recovery of circulating temperature control fluid
KR100755295B1 (ko) 1998-07-14 2007-09-05 델타 디자인, 인코포레이티드 전력 종속 피드백을 사용한 전자소자 제어
JP2000180502A (ja) 1998-12-10 2000-06-30 Advantest Corp 電子部品試験装置
US6583638B2 (en) * 1999-01-26 2003-06-24 Trio-Tech International Temperature-controlled semiconductor wafer chuck system
DE60010890T2 (de) 1999-07-15 2005-05-19 Delta Design, Inc., Poway Gerät und verfahren zur temperaturkontrolle von integrierten schaltungen während der prüfung
US6552561B2 (en) * 2000-07-10 2003-04-22 Temptronic Corporation Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode
JP2002043381A (ja) 2000-07-19 2002-02-08 Tokyo Electron Ltd ウエハ温度制御装置
US6798223B2 (en) * 2000-07-28 2004-09-28 Hei, Inc. Test methods, systems, and probes for high-frequency wireless-communications devices
US6636062B2 (en) * 2001-04-10 2003-10-21 Delta Design, Inc. Temperature control device for an electronic component
WO2003027686A2 (en) 2001-09-27 2003-04-03 Advanced Micro Devices, Inc. Method and apparatus for temperature control of a device during testing
JP2005340719A (ja) * 2004-05-31 2005-12-08 Tokyo Seimitsu Co Ltd ステージ機構

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI827329B (zh) * 2021-10-29 2023-12-21 致茂電子股份有限公司 探針冷卻系統、冷卻方法及具備該系統之電子元件測試設備

Also Published As

Publication number Publication date
CN101137911B (zh) 2011-06-08
RU2407023C2 (ru) 2010-12-20
KR20070110840A (ko) 2007-11-20
ES2821736T3 (es) 2021-04-27
KR101185536B1 (ko) 2012-09-24
US7271604B2 (en) 2007-09-18
DE102005001163B3 (de) 2006-05-18
WO2006072598A1 (de) 2006-07-13
CN101137911A (zh) 2008-03-05
EP1844342B1 (de) 2020-07-01
TW200628818A (en) 2006-08-16
JP2008527701A (ja) 2008-07-24
RU2007125378A (ru) 2009-02-20
JP4825812B2 (ja) 2011-11-30
WO2006072598A8 (de) 2007-09-07
EP1844342A1 (de) 2007-10-17
US20060158207A1 (en) 2006-07-20

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