TWI370836B - Heat-peelable adhesive sheet and process method for adherend using the same - Google Patents

Heat-peelable adhesive sheet and process method for adherend using the same

Info

Publication number
TWI370836B
TWI370836B TW094105360A TW94105360A TWI370836B TW I370836 B TWI370836 B TW I370836B TW 094105360 A TW094105360 A TW 094105360A TW 94105360 A TW94105360 A TW 94105360A TW I370836 B TWI370836 B TW I370836B
Authority
TW
Taiwan
Prior art keywords
sensitive adhesive
heat
pressure
adhesive layer
adhesive sheet
Prior art date
Application number
TW094105360A
Other languages
English (en)
Other versions
TW200604308A (en
Inventor
Yukio Arimitsu
Daisuke Shimokawa
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200604308A publication Critical patent/TW200604308A/zh
Application granted granted Critical
Publication of TWI370836B publication Critical patent/TWI370836B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y10T428/249984—Adhesive or bonding component contains voids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW094105360A 2004-03-11 2005-02-23 Heat-peelable adhesive sheet and process method for adherend using the same TWI370836B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004068770 2004-03-11

Publications (2)

Publication Number Publication Date
TW200604308A TW200604308A (en) 2006-02-01
TWI370836B true TWI370836B (en) 2012-08-21

Family

ID=34975568

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105360A TWI370836B (en) 2004-03-11 2005-02-23 Heat-peelable adhesive sheet and process method for adherend using the same

Country Status (9)

Country Link
US (1) US7635516B2 (zh)
EP (1) EP1724320B1 (zh)
JP (1) JP4588022B2 (zh)
KR (1) KR20060126809A (zh)
CN (1) CN1930262B (zh)
AT (1) ATE474897T1 (zh)
DE (1) DE602005022414D1 (zh)
TW (1) TWI370836B (zh)
WO (1) WO2005087888A1 (zh)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005087887A1 (ja) * 2004-03-11 2005-09-22 Nitto Denko Corporation 加熱剥離型粘着シートおよび該加熱剥離型粘着シートを用いた被着体の加工方法
JP4776189B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 ウエハ加工用テープ
US8398306B2 (en) 2005-11-07 2013-03-19 Kraft Foods Global Brands Llc Flexible package with internal, resealable closure feature
JP5382995B2 (ja) * 2006-04-11 2014-01-08 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび配線回路基板
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
US7691225B2 (en) 2007-01-15 2010-04-06 Nitto Denko Corporation Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherend
KR100831081B1 (ko) * 2007-02-22 2008-05-20 (주)해은켐텍 상호반응성 공중합체를 이용한 발포시트용 점착수지 및 이를 이용한 발포시트
JP5089201B2 (ja) * 2007-03-12 2012-12-05 日東電工株式会社 アクリル系粘着テープ又はシート、およびその製造方法
JP2008297412A (ja) * 2007-05-30 2008-12-11 Nitto Denko Corp 熱剥離型粘着シート
US9232808B2 (en) 2007-06-29 2016-01-12 Kraft Foods Group Brands Llc Processed cheese without emulsifying salts
JP5289747B2 (ja) * 2007-10-10 2013-09-11 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび配線回路基板
JP5280034B2 (ja) * 2007-10-10 2013-09-04 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび配線回路基板
JP4717052B2 (ja) * 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717051B2 (ja) * 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
DE102008004388A1 (de) * 2008-01-14 2009-07-16 Tesa Ag Geschäumte, insbesondere druckempfindliche Klebemasse, Verfahren zur Herstellung sowie die Verwendung derselben
US8163599B2 (en) * 2008-04-18 2012-04-24 Panasonic Corporation Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
JP2010039472A (ja) * 2008-07-08 2010-02-18 Nitto Denko Corp 電子ペーパーの製造方法、及び電子ペーパー形成工程用両面粘着テープ
JP2010241967A (ja) * 2009-04-07 2010-10-28 Nitto Denko Corp 再剥離性粘着シート及びこれを用いた被着体の加工方法
RU2557614C2 (ru) 2010-02-26 2015-07-27 Интерконтинентал Грейт Брэндс ЛЛС Уф-отверждаемый самоклеющийся материал с низкой липкостью для повторно укупориваемых упаковок
WO2011106486A1 (en) 2010-02-26 2011-09-01 Kraft Foods Global Brands Llc Package having an adhesive-based reclosable fastener and methods therefor
JP5689336B2 (ja) * 2011-03-03 2015-03-25 日東電工株式会社 加熱剥離型粘着シート
US9868862B2 (en) 2011-05-25 2018-01-16 Diversey, Inc. Surface coating system and method of using surface coating system
US8859068B2 (en) 2011-08-04 2014-10-14 Apple Inc. Adhesive stack with a central shear layer
US8945335B2 (en) 2011-08-04 2015-02-03 Apple Inc. Adhesive stack with a central shear layer
JP5889611B2 (ja) * 2011-11-25 2016-03-22 ヘンケルジャパン株式会社 太陽電池バックシート用接着剤
US20130160931A1 (en) * 2011-12-21 2013-06-27 Francesco Sportelli Method of providing an air passage in a tire
CN104203765B (zh) * 2012-03-15 2016-04-06 韦世万 在上端的一面设有未粘结的把持部的封装体及其制备方法
JP5921927B2 (ja) * 2012-03-27 2016-05-24 日東電工株式会社 加熱剥離型粘着シート
JP5929419B2 (ja) * 2012-03-29 2016-06-08 日立化成株式会社 粘着剤組成物、フィルム状粘着剤及び被着体の剥離方法
CN104640954B (zh) * 2012-04-13 2017-05-17 3M创新有限公司 压敏粘合剂泡沫和由其制得的制品
US9785185B2 (en) 2012-09-11 2017-10-10 Apple Inc. Removable adhesive joint for computing device
WO2014067667A1 (en) 2012-11-02 2014-05-08 Nitto Europe N.V. Thermally debondable tape
US9787345B2 (en) 2014-03-31 2017-10-10 Apple Inc. Laser welding of transparent and opaque materials
CN104159418B (zh) * 2014-08-05 2017-09-15 上海蓝沛信泰光电科技有限公司 采用软性线路板制作近距离无线通讯器件的方法
US10200516B2 (en) 2014-08-28 2019-02-05 Apple Inc. Interlocking ceramic and optical members
JP6151679B2 (ja) * 2014-11-11 2017-06-21 日東電工株式会社 再剥離粘着剤組成物、粘着シート及びテープ
CN107075323A (zh) * 2014-11-13 2017-08-18 Dic株式会社 双面粘胶带、物品及分离方法
JP6448333B2 (ja) * 2014-12-02 2019-01-09 日東電工株式会社 粘着シート
TWI563055B (en) * 2015-07-06 2016-12-21 Shiny Chemical Ind Co Ltd Thermo-reversible adhesive, thermo- reversible adhesive film and producing method thereof
GB2603663B (en) * 2016-05-11 2023-01-25 Flexenable Ltd Carrier release
GB2607247B (en) * 2016-05-11 2023-03-22 Flexenable Ltd Carrier release
KR101693026B1 (ko) * 2016-07-06 2017-01-05 (주) 화인테크놀리지 적층 세라믹 콘덴서 제조용 가열박리형 점착시트
KR20190013128A (ko) * 2017-07-31 2019-02-11 다우 실리콘즈 코포레이션 임시 결합 접착제용 실리콘 조성물, 이의 경화체를 포함하는 전자 제품 및 그 제조방법
TWI648850B (zh) * 2017-10-16 2019-01-21 錼創顯示科技股份有限公司 微型發光元件結構
JP7224818B2 (ja) * 2018-09-06 2023-02-20 日東電工株式会社 粘着シート
WO2020153357A1 (ja) * 2019-01-22 2020-07-30 積水化学工業株式会社 粘着テープ、及びその製造方法
CN113613893B (zh) * 2019-03-15 2023-11-21 琳得科株式会社 粘合片及半导体装置的制造方法
CN114206998A (zh) * 2019-07-31 2022-03-18 洛德公司 用于降低粘合强度和相关拉脱应力的方法和系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013878A (zh) 1973-06-11 1975-02-13
JPS5124534A (en) 1974-08-23 1976-02-27 Seiko Instr & Electronics Tokeiyogaisobuhinno hyomenshorihoho
JPS5661468A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS5661469A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Hot-bonding adhesive
JPS60252681A (ja) 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JP2970963B2 (ja) * 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JP2898480B2 (ja) * 1992-09-14 1999-06-02 日東電工株式会社 加熱剥離性接着剤及び粘着部材
JP4107729B2 (ja) * 1998-09-16 2008-06-25 藤森工業株式会社 熱発泡型粘着剤及び粘着部材
JP2002069410A (ja) * 2000-08-28 2002-03-08 Fujimori Kogyo Co Ltd 熱剥離性粘着剤及びそれを用いた粘着部材
JP2002069422A (ja) * 2000-08-30 2002-03-08 Toyo Chem Co Ltd 熱発泡型粘着剤及びその粘着部材
JP4703833B2 (ja) 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP4703842B2 (ja) * 2000-11-30 2011-06-15 日東電工株式会社 堰材、及びこの堰材を用いた封止電子部品の製造方法
JP2002309222A (ja) * 2001-04-16 2002-10-23 Toyo Chem Co Ltd 加熱発泡粘着剤及び粘着テープ
JP4877689B2 (ja) 2001-08-30 2012-02-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法

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ATE474897T1 (de) 2010-08-15
EP1724320B1 (en) 2010-07-21
US20080160293A1 (en) 2008-07-03
WO2005087888A1 (ja) 2005-09-22
JPWO2005087888A1 (ja) 2008-01-24
EP1724320A4 (en) 2008-08-27
US7635516B2 (en) 2009-12-22
CN1930262A (zh) 2007-03-14
CN1930262B (zh) 2011-04-27
TW200604308A (en) 2006-02-01
DE602005022414D1 (de) 2010-09-02
EP1724320A1 (en) 2006-11-22
KR20060126809A (ko) 2006-12-08

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