TWI369407B - Flexible metal clad laminate and method for manufacturing the same - Google Patents

Flexible metal clad laminate and method for manufacturing the same

Info

Publication number
TWI369407B
TWI369407B TW096102402A TW96102402A TWI369407B TW I369407 B TWI369407 B TW I369407B TW 096102402 A TW096102402 A TW 096102402A TW 96102402 A TW96102402 A TW 96102402A TW I369407 B TWI369407 B TW I369407B
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
clad laminate
flexible metal
metal clad
Prior art date
Application number
TW096102402A
Other languages
English (en)
Chinese (zh)
Other versions
TW200734472A (en
Inventor
Sang-Hyun Jun
Joong-Kyu An
pan-seok Kim
Kyung-Kak Kim
Original Assignee
Ls Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ls Cable Ltd filed Critical Ls Cable Ltd
Publication of TW200734472A publication Critical patent/TW200734472A/zh
Application granted granted Critical
Publication of TWI369407B publication Critical patent/TWI369407B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/246—Vapour deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
TW096102402A 2006-02-02 2007-01-23 Flexible metal clad laminate and method for manufacturing the same TWI369407B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060010192A KR100727716B1 (ko) 2006-02-02 2006-02-02 연성금속 적층판 및 그 제조방법

Publications (2)

Publication Number Publication Date
TW200734472A TW200734472A (en) 2007-09-16
TWI369407B true TWI369407B (en) 2012-08-01

Family

ID=38359231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102402A TWI369407B (en) 2006-02-02 2007-01-23 Flexible metal clad laminate and method for manufacturing the same

Country Status (4)

Country Link
JP (1) JP2007223312A (ja)
KR (1) KR100727716B1 (ja)
CN (1) CN100559918C (ja)
TW (1) TWI369407B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008284869A (ja) * 2007-05-15 2008-11-27 Ls Cable Ltd 可視光線透過度が高い軟性金属積層板
KR20090067744A (ko) 2007-12-21 2009-06-25 엘지전자 주식회사 연성 필름
KR100896439B1 (ko) * 2007-12-26 2009-05-14 엘지전자 주식회사 연성 필름
KR100947608B1 (ko) 2007-12-28 2010-03-15 엘지전자 주식회사 연성 필름
KR20090093133A (ko) * 2008-02-28 2009-09-02 엘에스엠트론 주식회사 치수변화율이 안정적인 연성금속 적층판 및 그 제조방법
KR101269816B1 (ko) * 2008-12-26 2013-05-30 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 플렉시블 라미네이트 및 그 라미네이트를 사용하여 형성한 플렉시블 전자 회로 기판
CN102469700B (zh) * 2010-11-12 2014-07-09 北大方正集团有限公司 制作电路板的方法及电路板
KR102003880B1 (ko) * 2012-12-06 2019-07-26 도레이케미칼 주식회사 연성동박적층필름 및 이의 제조방법
KR102492818B1 (ko) * 2015-10-12 2023-01-30 에스케이넥실리스 주식회사 연성동박적층필름 및 그 제조방법
KR101810524B1 (ko) 2016-05-16 2017-12-19 도레이첨단소재 주식회사 초경박 폴리이미드 필름을 적용한 세미 애디티브 연성 구리박막 적층 필름의 제조방법 및 그로부터 제조된 세미 애디티브 연성 구리박막 적층 필름

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2682101B2 (ja) * 1989-01-24 1997-11-26 凸版印刷株式会社 レトルト耐性を有する透明バリアー複合フィルム
JPH0983134A (ja) * 1995-09-07 1997-03-28 Gunze Ltd フレキシブルプリント回路用基板
JPH1065316A (ja) 1996-08-23 1998-03-06 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板の製造方法
JPH11111466A (ja) * 1997-10-06 1999-04-23 Tdk Corp 有機ｅｌ素子の電極
US6268070B1 (en) * 1999-03-12 2001-07-31 Gould Electronics Inc. Laminate for multi-layer printed circuit
JP2002252257A (ja) * 2000-12-18 2002-09-06 Mitsui Mining & Smelting Co Ltd 半導体キャリア用フィルム及びその製造方法
JP2003094589A (ja) * 2001-09-27 2003-04-03 Hitachi Metals Ltd 積層材の製造方法及び積層材の製造装置
JP2003332702A (ja) * 2002-05-09 2003-11-21 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板
JP2004031588A (ja) * 2002-06-25 2004-01-29 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板
JP2004303863A (ja) * 2003-03-31 2004-10-28 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板
JP4257583B2 (ja) * 2003-08-27 2009-04-22 東洋紡績株式会社 金属化ポリイミドフィルム及びその製造方法
JP2005219259A (ja) 2004-02-04 2005-08-18 Mitsubishi Shindoh Co Ltd 金属化ポリイミドフィルム
JP2005262707A (ja) * 2004-03-19 2005-09-29 Toray Ind Inc 銅張り積層フィルムおよびフレキシブル回路基板用材料
KR20060081118A (ko) * 2005-01-07 2006-07-12 윈텍 주식회사 연성의 얇은 적층기판

Also Published As

Publication number Publication date
TW200734472A (en) 2007-09-16
CN100559918C (zh) 2009-11-11
JP2007223312A (ja) 2007-09-06
CN101014231A (zh) 2007-08-08
KR100727716B1 (ko) 2007-06-13

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