EP2034055A4 - Metal composite film and process for producing the same - Google Patents
Metal composite film and process for producing the sameInfo
- Publication number
- EP2034055A4 EP2034055A4 EP06746516A EP06746516A EP2034055A4 EP 2034055 A4 EP2034055 A4 EP 2034055A4 EP 06746516 A EP06746516 A EP 06746516A EP 06746516 A EP06746516 A EP 06746516A EP 2034055 A4 EP2034055 A4 EP 2034055A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- producing
- same
- composite film
- metal composite
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2274/00—Thermoplastic elastomer material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/309813 WO2007132529A1 (en) | 2006-05-17 | 2006-05-17 | Metal composite film and process for producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2034055A1 EP2034055A1 (en) | 2009-03-11 |
EP2034055A4 true EP2034055A4 (en) | 2012-05-02 |
Family
ID=38693632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06746516A Withdrawn EP2034055A4 (en) | 2006-05-17 | 2006-05-17 | Metal composite film and process for producing the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US8771496B2 (en) |
EP (1) | EP2034055A4 (en) |
JP (1) | JPWO2007132529A1 (en) |
KR (1) | KR101277602B1 (en) |
CN (1) | CN101437984A (en) |
WO (1) | WO2007132529A1 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090067744A (en) | 2007-12-21 | 2009-06-25 | 엘지전자 주식회사 | Flexible film |
KR100896439B1 (en) * | 2007-12-26 | 2009-05-14 | 엘지전자 주식회사 | Flexible film |
KR100939550B1 (en) * | 2007-12-27 | 2010-01-29 | 엘지전자 주식회사 | Flexible Film |
KR101054433B1 (en) * | 2007-12-27 | 2011-08-04 | 엘지전자 주식회사 | Flexible film and display device comprising the same |
KR100889002B1 (en) * | 2007-12-27 | 2009-03-19 | 엘지전자 주식회사 | Flexible film |
KR100947607B1 (en) * | 2007-12-27 | 2010-03-15 | 엘지전자 주식회사 | Flexible Film |
KR100947608B1 (en) | 2007-12-28 | 2010-03-15 | 엘지전자 주식회사 | Flexible Film |
KR101444694B1 (en) * | 2009-05-25 | 2014-10-01 | 에스케이이노베이션 주식회사 | Flexible metal-clad laminate manufacturing method thereof |
US20120141758A1 (en) * | 2010-12-07 | 2012-06-07 | E.I. Du Pont De Nemours And Company | Filled polyimide films and coverlays comprising such films |
US20140011089A1 (en) * | 2011-03-25 | 2014-01-09 | National Institute Of Advanced Industrial Science And Technology | Polyimide precursor solution, polyimide precursor, polyimide resin, mixture slurry, electrode, mixture slurry production method, and electrode formation method |
TWI495562B (en) * | 2012-07-11 | 2015-08-11 | Lg Chemical Ltd | Flexible metal laminate |
TWI510672B (en) * | 2012-09-30 | 2015-12-01 | 羅門哈斯電子材料有限公司 | A method for electroless metallization |
KR101962986B1 (en) * | 2014-11-18 | 2019-03-27 | 셍기 테크놀로지 코. 엘티디. | Flexible metal laminate |
JP6111453B2 (en) | 2015-02-26 | 2017-04-12 | 株式会社アイ.エス.テイ | Polyimide coating active material particles, slurry for electrode material, negative electrode, battery, and method for producing polyimide coating active material particles |
KR102591838B1 (en) * | 2017-01-26 | 2023-10-24 | 주식회사 아모그린텍 | Flexible printed circuit board, manufacturing method therefor, and cladding sensor module thereof |
JP7268595B2 (en) * | 2017-03-03 | 2023-05-08 | 日産化学株式会社 | Coating film-forming composition for removing foreign matter |
KR102329838B1 (en) * | 2019-04-30 | 2021-11-22 | 도레이첨단소재 주식회사 | Flexible metal clad laminate film, article including the same and method of preparing the film |
JP7453857B2 (en) | 2020-06-01 | 2024-03-21 | ピップ株式会社 | Magnetic therapy device and its manufacturing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005088465A (en) * | 2003-09-19 | 2005-04-07 | Matsushita Electric Works Ltd | Manufacturing method for conductor-coated polyimide film and conductor-coated polyimide film |
WO2005053368A1 (en) * | 2003-11-27 | 2005-06-09 | Fuji Photo Film Co., Ltd. | Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same |
EP1640150A1 (en) * | 2004-09-14 | 2006-03-29 | Mitsubishi Gas Chemical Company, Inc. | Polyimide/metal film laminates and process for the production of printed wiring board using the laminate |
US20060073315A1 (en) * | 2004-09-30 | 2006-04-06 | Ajinomoto Co., Inc | Metallized polyamideimide film for substrate and production method thereof |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3573973A (en) * | 1967-11-13 | 1971-04-06 | Ibm | High speed additive circuit process |
US5322976A (en) * | 1987-02-24 | 1994-06-21 | Polyonics Corporation | Process for forming polyimide-metal laminates |
US4992144A (en) * | 1987-02-24 | 1991-02-12 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from polyimide film |
JP2832395B2 (en) | 1990-10-08 | 1998-12-09 | 鐘淵化学工業株式会社 | Manufacturing method of flexible printed circuit board |
JPH04207094A (en) | 1990-11-30 | 1992-07-29 | Kanegafuchi Chem Ind Co Ltd | Flexible printed-circuit board and its manufacture |
JPH1081747A (en) | 1996-07-18 | 1998-03-31 | Reitetsuku Kk | Production of polyimides, composition and its product |
JP4009918B2 (en) * | 1997-07-18 | 2007-11-21 | 東レ・デュポン株式会社 | Polyimide film, method for producing the same, and metal laminate using the same |
JP4547087B2 (en) | 1997-10-13 | 2010-09-22 | 株式会社ピーアイ技術研究所 | Positive photosensitive polyimide composition |
JP2000080165A (en) | 1998-09-02 | 2000-03-21 | Du Pont Toray Co Ltd | Copolyimide film, preparation thereof and metallic wiring board using same as substrate material |
JP2000167980A (en) | 1998-12-08 | 2000-06-20 | Mitsui Chemicals Inc | Metal laminated board employing low boiling point solvent varnish as precursor of adhesive |
JP2000202970A (en) * | 1999-01-13 | 2000-07-25 | Pi Gijutsu Kenkyusho:Kk | Polyimide-coated film |
JP4493114B2 (en) | 1999-03-05 | 2010-06-30 | 大日本印刷株式会社 | Conductor laminate using solvent-soluble polyimide and its production method |
JP2002363284A (en) | 2001-06-07 | 2002-12-18 | Kanegafuchi Chem Ind Co Ltd | Novel thermoplastic polyimide resin |
JP2003031924A (en) * | 2001-07-16 | 2003-01-31 | Toray Eng Co Ltd | Metal circuit forming method |
JP4190770B2 (en) | 2002-02-05 | 2008-12-03 | 三井化学株式会社 | Metal laminate having thermoplastic polyimide resin layer |
JP4106929B2 (en) | 2002-03-05 | 2008-06-25 | 東レ・デュポン株式会社 | Metal laminated film |
JP2003306649A (en) | 2002-04-12 | 2003-10-31 | Kanegafuchi Chem Ind Co Ltd | Adhesive sheet and printed wiring board |
JP2004130748A (en) | 2002-10-15 | 2004-04-30 | Mitsui Chemicals Inc | Laminated body |
JP2004189981A (en) | 2002-12-13 | 2004-07-08 | Kanegafuchi Chem Ind Co Ltd | Thermoplastic polyimide resin material and laminated body, and manufacturing method of printed wiring board |
JP2004322578A (en) | 2003-04-28 | 2004-11-18 | Matsushita Electric Works Ltd | Method for production of conductor-carrying polyimide substrate, and the conductor-carrying polyimide substrate |
JP4765284B2 (en) * | 2004-09-01 | 2011-09-07 | 東レ株式会社 | Multilayer polyimide film and laminated film with metal layer using the same |
JP3664255B2 (en) | 2004-09-09 | 2005-06-22 | 株式会社ピーアイ技術研究所 | Adhesive polyimide |
KR100845534B1 (en) * | 2004-12-31 | 2008-07-10 | 엘지전자 주식회사 | Conductive metal plated polyimide substrate and process for manufacturing the same |
JP4925619B2 (en) | 2005-07-28 | 2012-05-09 | 株式会社巴川製紙所 | Polyimide resin and film with conductor using the same |
-
2006
- 2006-05-17 EP EP06746516A patent/EP2034055A4/en not_active Withdrawn
- 2006-05-17 JP JP2008515415A patent/JPWO2007132529A1/en active Pending
- 2006-05-17 CN CNA2006800545948A patent/CN101437984A/en active Pending
- 2006-05-17 WO PCT/JP2006/309813 patent/WO2007132529A1/en active Application Filing
- 2006-05-17 KR KR1020087028490A patent/KR101277602B1/en active IP Right Grant
- 2006-05-17 US US12/227,330 patent/US8771496B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005088465A (en) * | 2003-09-19 | 2005-04-07 | Matsushita Electric Works Ltd | Manufacturing method for conductor-coated polyimide film and conductor-coated polyimide film |
WO2005053368A1 (en) * | 2003-11-27 | 2005-06-09 | Fuji Photo Film Co., Ltd. | Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same |
EP1640150A1 (en) * | 2004-09-14 | 2006-03-29 | Mitsubishi Gas Chemical Company, Inc. | Polyimide/metal film laminates and process for the production of printed wiring board using the laminate |
US20060073315A1 (en) * | 2004-09-30 | 2006-04-06 | Ajinomoto Co., Inc | Metallized polyamideimide film for substrate and production method thereof |
Non-Patent Citations (1)
Title |
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See also references of WO2007132529A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20090311519A1 (en) | 2009-12-17 |
EP2034055A1 (en) | 2009-03-11 |
CN101437984A (en) | 2009-05-20 |
KR20090018061A (en) | 2009-02-19 |
WO2007132529A1 (en) | 2007-11-22 |
KR101277602B1 (en) | 2013-06-21 |
US8771496B2 (en) | 2014-07-08 |
JPWO2007132529A1 (en) | 2009-09-17 |
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