TWI367930B - - Google Patents

Info

Publication number
TWI367930B
TWI367930B TW096112733A TW96112733A TWI367930B TW I367930 B TWI367930 B TW I367930B TW 096112733 A TW096112733 A TW 096112733A TW 96112733 A TW96112733 A TW 96112733A TW I367930 B TWI367930 B TW I367930B
Authority
TW
Taiwan
Application number
TW096112733A
Other versions
TW200745308A (en
Inventor
Yukihisa Hirosawa
Tadamitsu Iimura
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200745308A publication Critical patent/TW200745308A/zh
Application granted granted Critical
Publication of TWI367930B publication Critical patent/TWI367930B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
TW096112733A 2006-04-12 2007-04-11 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method TW200745308A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006109690 2006-04-12
JP2006213444 2006-08-04

Publications (2)

Publication Number Publication Date
TW200745308A TW200745308A (en) 2007-12-16
TWI367930B true TWI367930B (zh) 2012-07-11

Family

ID=38624909

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096112733A TW200745308A (en) 2006-04-12 2007-04-11 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

Country Status (5)

Country Link
JP (1) JP4775377B2 (zh)
KR (2) KR101150116B1 (zh)
CN (3) CN101901972B (zh)
TW (1) TW200745308A (zh)
WO (1) WO2007123003A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5186157B2 (ja) * 2007-08-24 2013-04-17 デクセリアルズ株式会社 異方性導電フィルム及びそれを用いた接続構造体の製造方法
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP2010241993A (ja) * 2009-04-08 2010-10-28 Canon Chemicals Inc 導電性接着剤
JP5543968B2 (ja) * 2009-07-01 2014-07-09 日本化薬株式会社 液晶滴下工法用液晶シール剤及びそれを用いた液晶表示セル
KR101351617B1 (ko) * 2010-12-23 2014-01-15 제일모직주식회사 이방 도전성 필름
KR20120076187A (ko) * 2010-12-29 2012-07-09 제일모직주식회사 이방 도전성 필름
JP5972844B2 (ja) * 2012-09-18 2016-08-17 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法
CN103596379A (zh) * 2013-10-26 2014-02-19 溧阳市东大技术转移中心有限公司 一种双层柔性电路板的制造方法
JP6408759B2 (ja) * 2013-11-08 2018-10-17 デクセリアルズ株式会社 接着剤組成物、及びフィルム巻装体
WO2016189829A1 (ja) * 2015-05-28 2016-12-01 タツタ電線株式会社 実装用導電性ペースト
TWI741973B (zh) * 2015-12-22 2021-10-11 美商英特爾股份有限公司 層積體之製造方法，層積體及多層電路基板
CN108603078A (zh) * 2016-01-29 2018-09-28 日立化成株式会社 粘接剂膜及其制造方法、粘接剂带以及粘接剂膜用卷轴
CN108040425B (zh) * 2017-12-14 2019-09-20 广东长盈精密技术有限公司 电子设备及其电路板
KR102254467B1 (ko) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) 이방도전성 접착필름의 제조방법
KR102254470B1 (ko) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) 도전입자의 이격거리가 제어된 이방도전성 접착필름의 제조방법
CN110875101A (zh) * 2018-08-31 2020-03-10 玮锋科技股份有限公司 异方性导电膜结构及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195179A (ja) * 1985-02-25 1986-08-29 Matsushita Electric Ind Co Ltd 異方導電性接着シ−ト
JPH01236588A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd 異方導電性接着体
JPH0636327B2 (ja) * 1988-07-06 1994-05-11 日東電工株式会社 導電性接着テープ
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
JPH03107888A (ja) * 1989-09-21 1991-05-08 Sharp Corp 回路基板の接続構造
JPH04366630A (ja) * 1991-06-13 1992-12-18 Sharp Corp 異方性導電接着テープ
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
JPH07230840A (ja) * 1994-02-17 1995-08-29 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造
JP3656768B2 (ja) * 1995-02-07 2005-06-08 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
US5718789A (en) * 1995-06-07 1998-02-17 The Dexter Corporation Method for making a debossed conductive film composite
JP3914606B2 (ja) * 1997-04-25 2007-05-16 松下電器産業株式会社 接着層の製造装置、両面基板の製造装置および多層基板の製造装置
EP1045437A3 (en) * 1999-04-13 2004-09-01 Matsushita Electric Industrial Co., Ltd. Mounting structure for electronic component, method of producing the same, and electrically conductive adhesive used therein
JP2002076607A (ja) * 2000-08-25 2002-03-15 Sekisui Chem Co Ltd 微粒子の転写・配置方法、微粒子配置フィルム、導電接続フィルム、及び、導電接続構造体
KR100559937B1 (ko) * 2003-01-08 2006-03-13 엘에스전선 주식회사 미세회로의 접속방법 및 그에 의한 접속 구조체

Also Published As

Publication number Publication date
KR101090561B1 (ko) 2011-12-08
TW200745308A (en) 2007-12-16
KR101150116B1 (ko) 2012-06-08
JPWO2007123003A1 (ja) 2009-09-03
CN101901972B (zh) 2012-07-04
CN101901971B (zh) 2012-07-04
KR20080108615A (ko) 2008-12-15
CN101421886A (zh) 2009-04-29
WO2007123003A1 (ja) 2007-11-01
JP4775377B2 (ja) 2011-09-21
CN101421886B (zh) 2010-12-15
CN101901972A (zh) 2010-12-01
CN101901971A (zh) 2010-12-01
KR20110063586A (ko) 2011-06-10

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