TWI366576B - Ultraviolet-curable composition - Google Patents

Ultraviolet-curable composition

Info

Publication number
TWI366576B
TWI366576B TW094106421A TW94106421A TWI366576B TW I366576 B TWI366576 B TW I366576B TW 094106421 A TW094106421 A TW 094106421A TW 94106421 A TW94106421 A TW 94106421A TW I366576 B TWI366576 B TW I366576B
Authority
TW
Taiwan
Prior art keywords
ultraviolet
curable composition
curable
composition
Prior art date
Application number
TW094106421A
Other languages
English (en)
Other versions
TW200609262A (en
Inventor
Kazumasa Inata
Nobuaki Koike
Original Assignee
Toagosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd filed Critical Toagosei Co Ltd
Publication of TW200609262A publication Critical patent/TW200609262A/zh
Application granted granted Critical
Publication of TWI366576B publication Critical patent/TWI366576B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
TW094106421A 2004-03-04 2005-03-03 Ultraviolet-curable composition TWI366576B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004060195 2004-03-04
JP2004060137 2004-03-04

Publications (2)

Publication Number Publication Date
TW200609262A TW200609262A (en) 2006-03-16
TWI366576B true TWI366576B (en) 2012-06-21

Family

ID=34921672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106421A TWI366576B (en) 2004-03-04 2005-03-03 Ultraviolet-curable composition

Country Status (4)

Country Link
JP (1) JP4548415B2 (zh)
KR (1) KR101111372B1 (zh)
TW (1) TWI366576B (zh)
WO (1) WO2005085317A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005336349A (ja) * 2004-05-27 2005-12-08 Toagosei Co Ltd カチオン重合型組成物
JP5258163B2 (ja) * 2005-12-26 2013-08-07 日東電工株式会社 光学シート、画像表示装置用基板、液晶表示装置、有機el表示装置および太陽電池
JP2008184563A (ja) * 2007-01-31 2008-08-14 Nikon Corp 高アスペクト比構造物用の樹脂組成物
JP5684460B2 (ja) * 2009-04-06 2015-03-11 株式会社ダイセル カチオン重合性樹脂組成物、及びその硬化物
WO2012020688A1 (ja) * 2010-08-12 2012-02-16 ダイセル化学工業株式会社 低透湿性樹脂組成物及びその硬化物
TW201249948A (en) * 2011-06-11 2012-12-16 Toagosei Co Ltd Active-energy-ray-curable adhesive composition for plastic film or sheet
JP5843508B2 (ja) * 2011-07-21 2016-01-13 Jsr株式会社 光学的立体造形用放射線硬化性液状樹脂組成物、及びそれを光硬化させて得られる光造形物
JP5383764B2 (ja) * 2011-09-29 2014-01-08 日東電工株式会社 光学シート、画像表示装置用基板、液晶表示装置、有機el表示装置および太陽電池
JP6418672B2 (ja) * 2014-03-31 2018-11-07 日東電工株式会社 光学部品用樹脂組成物およびそれを用いた光学部品
JP6418673B2 (ja) * 2014-03-31 2018-11-07 日東電工株式会社 光学部品用樹脂組成物およびそれを用いた光学部品
CN105384913B (zh) * 2015-12-04 2017-08-29 南昌大学 一种纯阳离子型3d打印立体光刻快速成型光敏树脂及制备方法和应用
KR102631774B1 (ko) * 2016-06-21 2024-01-30 가부시키가이샤 아데카 경화성 조성물, 경화물의 제조 방법, 및 그 경화물
JP6538774B2 (ja) * 2017-07-28 2019-07-03 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
KR102248518B1 (ko) 2017-12-27 2021-05-04 주식회사 엘지화학 베젤패턴 형성용 광중합성 조성물, 이를 이용한 베젤패턴의 형성방법 및 이에 의해 제조된 베젤패턴
WO2023132249A1 (ja) * 2022-01-04 2023-07-13 三井化学株式会社 レンズ用樹脂組成物、レンズ用硬化物及びレンズ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60184071A (ja) * 1984-02-29 1985-09-19 Dai Ichi Kogyo Seiyaku Co Ltd ヘキサブロモ−p−フエニルフエノ−ルのグリシジルエ−テル化物
JPH0497887A (ja) * 1990-08-16 1992-03-30 Oji Paper Co Ltd 感熱記録体
JP3508502B2 (ja) * 1997-09-30 2004-03-22 宇部興産株式会社 オキセタン環を有するビフェニル誘導体
JP4380043B2 (ja) * 2000-09-06 2009-12-09 東亞合成株式会社 オキセタン環を有するメチレンビスフェノール誘導体混合物
JP2002194056A (ja) * 2000-12-27 2002-07-10 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JP4395577B2 (ja) * 2001-10-31 2010-01-13 東亞合成株式会社 エネルギー線硬化性接着剤組成物
JP2003313271A (ja) * 2002-04-19 2003-11-06 Toagosei Co Ltd 活性エネルギー線硬化型樹脂組成物
JP2003335765A (ja) * 2002-05-20 2003-11-28 Nippon Kayaku Co Ltd フッ素原子含有多官能性オキセタン化合物、これを用いた樹脂組成物、光ファイバー用コーティング剤及び硬化物

Also Published As

Publication number Publication date
KR101111372B1 (ko) 2012-03-13
WO2005085317A1 (ja) 2005-09-15
TW200609262A (en) 2006-03-16
JPWO2005085317A1 (ja) 2008-01-17
KR20070012386A (ko) 2007-01-25
JP4548415B2 (ja) 2010-09-22

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees