TWI366498B - - Google Patents

Info

Publication number
TWI366498B
TWI366498B TW098110572A TW98110572A TWI366498B TW I366498 B TWI366498 B TW I366498B TW 098110572 A TW098110572 A TW 098110572A TW 98110572 A TW98110572 A TW 98110572A TW I366498 B TWI366498 B TW I366498B
Authority
TW
Taiwan
Application number
TW098110572A
Other languages
Chinese (zh)
Other versions
TW200948526A (en
Inventor
Kenji Koike
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW200948526A publication Critical patent/TW200948526A/zh
Application granted granted Critical
Publication of TWI366498B publication Critical patent/TWI366498B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
TW098110572A 2008-03-31 2009-03-31 Tinned copper alloy bar with excellent abrasion resistance, insertion properties, and heat resistance TW200948526A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008093903 2008-03-31

Publications (2)

Publication Number Publication Date
TW200948526A TW200948526A (en) 2009-12-01
TWI366498B true TWI366498B (ja) 2012-06-21

Family

ID=41135518

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098110572A TW200948526A (en) 2008-03-31 2009-03-31 Tinned copper alloy bar with excellent abrasion resistance, insertion properties, and heat resistance

Country Status (5)

Country Link
JP (1) JPWO2009123144A1 (ja)
KR (1) KR101243454B1 (ja)
CN (1) CN101981234B (ja)
TW (1) TW200948526A (ja)
WO (1) WO2009123144A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009249716A (ja) * 2008-04-10 2009-10-29 Sumitomo Kinzoku Kozan Shindo Kk 錫めっき銅合金材
US8956735B2 (en) 2010-03-26 2015-02-17 Kabushiki Kaisha Kobe Seiko Sho Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same
CN102234827B (zh) * 2010-04-20 2014-01-08 Jx日矿日石金属株式会社 焊料润湿性、插拔性能优良的铜合金镀锡条
JP5140171B2 (ja) * 2011-03-18 2013-02-06 Ｊｘ日鉱日石金属株式会社 充電用電池タブ材に用いられる銅合金条
TW201311944A (zh) * 2011-08-12 2013-03-16 Mitsubishi Materials Corp 插拔性優異的鍍錫銅合金端子材及其製造方法
JP6103811B2 (ja) * 2012-03-30 2017-03-29 株式会社神戸製鋼所 接続部品用導電材料
JP5387742B2 (ja) 2012-04-06 2014-01-15 株式会社オートネットワーク技術研究所 めっき部材、コネクタ用めっき端子、めっき部材の製造方法、及びコネクタ用めっき端子の製造方法
US20150236439A1 (en) * 2012-08-31 2015-08-20 Autonetworks Technologies, Ltd. Plated terminal for connector, and terminal pair
JP6221695B2 (ja) * 2013-03-25 2017-11-01 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材
JP6100203B2 (ja) * 2014-05-19 2017-03-22 日新製鋼株式会社 接続部品用材料
JP6423383B2 (ja) * 2016-03-31 2018-11-14 日新製鋼株式会社 接続部品用材料
JP6662685B2 (ja) 2016-03-31 2020-03-11 Ｊｘ金属株式会社 めっき層を有するチタン銅箔
WO2018138928A1 (ja) * 2017-01-30 2018-08-02 Ｊｘ金属株式会社 表面処理めっき材、コネクタ端子、コネクタ、ｆｆｃ端子、ｆｆｃ、ｆｐｃ及び電子部品
JP7014695B2 (ja) * 2018-10-18 2022-02-01 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品
CN109267119B (zh) * 2018-11-05 2020-06-23 深圳和而泰智能控制股份有限公司 磷青铜工件及其制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3926355B2 (ja) * 2004-09-10 2007-06-06 株式会社神戸製鋼所 接続部品用導電材料及びその製造方法
JP2007063624A (ja) * 2005-08-31 2007-03-15 Nikko Kinzoku Kk 挿抜性及び耐熱性に優れる銅合金すずめっき条
JP4771970B2 (ja) 2006-02-27 2011-09-14 株式会社神戸製鋼所 接続部品用導電材料

Also Published As

Publication number Publication date
TW200948526A (en) 2009-12-01
KR20100118147A (ko) 2010-11-04
JPWO2009123144A1 (ja) 2011-07-28
CN101981234B (zh) 2013-06-12
WO2009123144A1 (ja) 2009-10-08
KR101243454B1 (ko) 2013-03-13
CN101981234A (zh) 2011-02-23

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