TWI366077B - Apparatus for and method of processing substrate subjected to exposure process - Google Patents

Apparatus for and method of processing substrate subjected to exposure process

Info

Publication number
TWI366077B
TWI366077B TW095129430A TW95129430A TWI366077B TW I366077 B TWI366077 B TW I366077B TW 095129430 A TW095129430 A TW 095129430A TW 95129430 A TW95129430 A TW 95129430A TW I366077 B TWI366077 B TW I366077B
Authority
TW
Taiwan
Prior art keywords
exposure process
processing substrate
substrate subjected
subjected
processing
Prior art date
Application number
TW095129430A
Other languages
English (en)
Other versions
TW200719090A (en
Inventor
Tetsuya Hamada
Original Assignee
Sokudo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sokudo Co Ltd filed Critical Sokudo Co Ltd
Publication of TW200719090A publication Critical patent/TW200719090A/zh
Application granted granted Critical
Publication of TWI366077B publication Critical patent/TWI366077B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW095129430A 2005-09-14 2006-08-10 Apparatus for and method of processing substrate subjected to exposure process TWI366077B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005266888A JP4937559B2 (ja) 2005-09-14 2005-09-14 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
TW200719090A TW200719090A (en) 2007-05-16
TWI366077B true TWI366077B (en) 2012-06-11

Family

ID=37854709

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129430A TWI366077B (en) 2005-09-14 2006-08-10 Apparatus for and method of processing substrate subjected to exposure process

Country Status (4)

Country Link
US (2) US20070058147A1 (zh)
JP (1) JP4937559B2 (zh)
CN (1) CN100433252C (zh)
TW (1) TWI366077B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4937559B2 (ja) * 2005-09-14 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4781834B2 (ja) * 2006-02-07 2011-09-28 大日本スクリーン製造株式会社 現像装置および現像方法
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
KR100904392B1 (ko) 2007-06-18 2009-06-26 세메스 주식회사 기판 처리 장치
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) * 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
US20100192844A1 (en) * 2009-01-30 2010-08-05 Semes Co., Ltd. Apparatus and method for treating substrate
JP5181306B2 (ja) * 2009-01-30 2013-04-10 セメス株式会社 基板処理システム、露光前後処理ユニット及び基板処理方法
CN102103333B (zh) * 2009-12-17 2013-08-14 上海微电子装备有限公司 一种烘烤光刻胶的方法及使用该方法的装置
JP7112220B2 (ja) * 2017-05-12 2022-08-03 キヤノン株式会社 方法、装置、システム、および物品の製造方法
US11520226B2 (en) 2017-05-12 2022-12-06 Canon Kabushiki Kaisha Imprint method, imprint apparatus, imprint system, and method of manufacturing article

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
JP2638668B2 (ja) * 1990-09-03 1997-08-06 大日本スクリーン製造株式会社 基板搬送方法および基板搬送装置
JPH05268138A (ja) * 1992-03-19 1993-10-15 Nec Corp 携帯電話機
TW357406B (en) * 1996-10-07 1999-05-01 Tokyo Electron Ltd Method and apparatus for cleaning and drying a substrate
US6168672B1 (en) * 1998-03-06 2001-01-02 Applied Materials Inc. Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
JP2000150815A (ja) * 1998-09-04 2000-05-30 Kokusai Electric Co Ltd 半導体装置の製造方法及び半導体製造装置
JP2001005189A (ja) * 1999-06-23 2001-01-12 Nec Corp 現像方法、及び、現像装置
JP2001176833A (ja) * 1999-12-14 2001-06-29 Tokyo Electron Ltd 基板処理装置
JP3593496B2 (ja) 2000-07-24 2004-11-24 東京エレクトロン株式会社 塗布現像処理装置
JP2002134402A (ja) * 2000-08-15 2002-05-10 Tokyo Electron Ltd 基板処理方法及び基板処理装置
JP2003007587A (ja) 2001-06-20 2003-01-10 Tokyo Electron Ltd 基板処理装置
JP4342147B2 (ja) * 2002-05-01 2009-10-14 大日本スクリーン製造株式会社 基板処理装置
WO2003098676A1 (en) * 2002-05-17 2003-11-27 Ebara Corporation Substrate processing apparatus and substrate processing method
KR100974141B1 (ko) 2002-11-28 2010-08-04 도쿄엘렉트론가부시키가이샤 기판 처리 장치
JP4087328B2 (ja) * 2002-11-28 2008-05-21 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法
JP4525062B2 (ja) * 2002-12-10 2010-08-18 株式会社ニコン 露光装置及びデバイス製造方法、露光システム
WO2004053952A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
JP2004342654A (ja) 2003-05-13 2004-12-02 Dainippon Screen Mfg Co Ltd 基板処理装置
US20050077182A1 (en) * 2003-10-10 2005-04-14 Applied Materials, Inc. Volume measurement apparatus and method
JP4106017B2 (ja) * 2003-12-19 2008-06-25 東京エレクトロン株式会社 現像装置及び現像方法
JP4194495B2 (ja) 2004-01-07 2008-12-10 東京エレクトロン株式会社 塗布・現像装置
JP4535489B2 (ja) 2004-03-31 2010-09-01 東京エレクトロン株式会社 塗布・現像装置
JP4937559B2 (ja) 2005-09-14 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2007081117A (ja) 2007-03-29
CN1933100A (zh) 2007-03-21
US20070058147A1 (en) 2007-03-15
US8460476B2 (en) 2013-06-11
CN100433252C (zh) 2008-11-12
JP4937559B2 (ja) 2012-05-23
US20100126527A1 (en) 2010-05-27
TW200719090A (en) 2007-05-16

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