TWI365161B - - Google Patents
Info
- Publication number
- TWI365161B TWI365161B TW094137918A TW94137918A TWI365161B TW I365161 B TWI365161 B TW I365161B TW 094137918 A TW094137918 A TW 094137918A TW 94137918 A TW94137918 A TW 94137918A TW I365161 B TWI365161 B TW I365161B
- Authority
- TW
- Taiwan
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004318451A JP5031186B2 (ja) | 2004-11-01 | 2004-11-01 | 基板処理方法、基板処理システム及び基板処理プログラム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200624360A TW200624360A (en) | 2006-07-16 |
TWI365161B true TWI365161B (ja) | 2012-06-01 |
Family
ID=36722907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094137918A TW200624360A (en) | 2004-11-01 | 2005-10-28 | Substrate treatment method, substrate treatment system, and substrate treatment program |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5031186B2 (ja) |
KR (1) | KR100735935B1 (ja) |
CN (1) | CN1779906A (ja) |
TW (1) | TW200624360A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI759942B (zh) * | 2019-11-27 | 2022-04-01 | 日商日立全球先端科技股份有限公司 | 帶電粒子線裝置 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100790824B1 (ko) * | 2006-05-30 | 2008-01-02 | 삼성전자주식회사 | 반도체 디바이스 제조설비에서의 웨이퍼 로딩 및 언로딩방법 |
US8113757B2 (en) | 2006-08-01 | 2012-02-14 | Tokyo Electron Limited | Intermediate transfer chamber, substrate processing system, and exhaust method for the intermediate transfer chamber |
JP4954728B2 (ja) * | 2007-01-26 | 2012-06-20 | 東京エレクトロン株式会社 | ゲートバルブの洗浄方法及び基板処理システム |
KR101480738B1 (ko) | 2007-04-27 | 2015-01-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 환형 배플 |
JP5436763B2 (ja) * | 2007-07-27 | 2014-03-05 | 東京エレクトロン株式会社 | 気密モジュール、及び該気密モジュールの排気方法 |
KR100851242B1 (ko) * | 2008-03-27 | 2008-08-08 | 비전세미콘 주식회사 | 반도체용 플라즈마 세정장치 |
JP2010093125A (ja) * | 2008-10-09 | 2010-04-22 | Toray Eng Co Ltd | 基板処理システムおよび基板処理方法 |
JP5295808B2 (ja) * | 2009-02-09 | 2013-09-18 | 東京エレクトロン株式会社 | パーティクル付着防止方法及び被処理基板の搬送方法 |
JP2011181631A (ja) * | 2010-02-26 | 2011-09-15 | Tokyo Electron Ltd | 表面活性化方法、プログラム、コンピュータ記憶媒体及び表面活性化装置 |
CN102269940A (zh) * | 2010-06-04 | 2011-12-07 | 中芯国际集成电路制造(上海)有限公司 | 一种光刻胶烘焙装置 |
CN103137412B (zh) * | 2011-11-30 | 2016-09-28 | 中国科学院微电子研究所 | 模块化离子注入机控制系统 |
CN103996634A (zh) * | 2013-02-19 | 2014-08-20 | 细美事有限公司 | 检测方法、包括该方法的基板处理方法及基板处理装置 |
TWI636518B (zh) | 2013-04-23 | 2018-09-21 | 荏原製作所股份有限公司 | 基板處理裝置及處理基板之製造方法 |
JP6122684B2 (ja) * | 2013-04-23 | 2017-04-26 | 株式会社荏原製作所 | 基板処理装置及び処理基板の製造方法 |
CN106611725B (zh) * | 2015-10-26 | 2019-07-19 | 北京北方华创微电子装备有限公司 | 一种刻蚀设备及结束其自动任务的处理方法和处理装置 |
JP6704008B2 (ja) * | 2018-03-26 | 2020-06-03 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法および記録媒体 |
CN109192696B (zh) * | 2018-08-10 | 2021-06-08 | 北京北方华创微电子装备有限公司 | 升降针系统、真空反应腔室以及半导体加工设备 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3174691B2 (ja) * | 1994-08-25 | 2001-06-11 | 大日本スクリーン製造株式会社 | 基板交換装置 |
JPH11288996A (ja) * | 1998-04-04 | 1999-10-19 | Tokyo Electron Ltd | 被処理体の搬送装置 |
JP2001319885A (ja) * | 2000-03-02 | 2001-11-16 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体製造方法 |
JP2003077782A (ja) * | 2001-08-31 | 2003-03-14 | Toshiba Corp | 半導体装置の製造方法 |
JP2003100605A (ja) * | 2001-09-25 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | 基板熱処理装置 |
JP2003347283A (ja) * | 2002-05-30 | 2003-12-05 | Tokyo Electron Ltd | 真空処理装置 |
JP4454243B2 (ja) * | 2003-03-31 | 2010-04-21 | キヤノンアネルバ株式会社 | 基板温度調整装置および基板温度調整方法 |
-
2004
- 2004-11-01 JP JP2004318451A patent/JP5031186B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-28 TW TW094137918A patent/TW200624360A/zh unknown
- 2005-10-31 KR KR1020050102738A patent/KR100735935B1/ko active IP Right Grant
- 2005-11-01 CN CNA2005101173189A patent/CN1779906A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI759942B (zh) * | 2019-11-27 | 2022-04-01 | 日商日立全球先端科技股份有限公司 | 帶電粒子線裝置 |
Also Published As
Publication number | Publication date |
---|---|
TW200624360A (en) | 2006-07-16 |
KR20060052347A (ko) | 2006-05-19 |
JP5031186B2 (ja) | 2012-09-19 |
JP2006128578A (ja) | 2006-05-18 |
KR100735935B1 (ko) | 2007-07-06 |
CN1779906A (zh) | 2006-05-31 |