TWI358465B - Etching agent compositions for copper-containing m - Google Patents

Etching agent compositions for copper-containing m Download PDF

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Publication number
TWI358465B
TWI358465B TW099119141A TW99119141A TWI358465B TW I358465 B TWI358465 B TW I358465B TW 099119141 A TW099119141 A TW 099119141A TW 99119141 A TW99119141 A TW 99119141A TW I358465 B TWI358465 B TW I358465B
Authority
TW
Taiwan
Prior art keywords
group
copper
mass
acid
composition
Prior art date
Application number
TW099119141A
Other languages
English (en)
Chinese (zh)
Other versions
TW201124562A (en
Inventor
Yusuke Nakamura
Yuichiro Kishi
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW201124562A publication Critical patent/TW201124562A/zh
Application granted granted Critical
Publication of TWI358465B publication Critical patent/TWI358465B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
TW099119141A 2009-07-09 2010-06-11 Etching agent compositions for copper-containing m TWI358465B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009162721A JP4685180B2 (ja) 2009-07-09 2009-07-09 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法

Publications (2)

Publication Number Publication Date
TW201124562A TW201124562A (en) 2011-07-16
TWI358465B true TWI358465B (en) 2012-02-21

Family

ID=43452636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099119141A TWI358465B (en) 2009-07-09 2010-06-11 Etching agent compositions for copper-containing m

Country Status (4)

Country Link
JP (1) JP4685180B2 (ja)
KR (1) KR101032204B1 (ja)
CN (1) CN101949014B (ja)
TW (1) TWI358465B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201250059A (en) * 2011-03-08 2012-12-16 Nagase Chemtex Corp Etching liquid
JP5971246B2 (ja) * 2011-07-04 2016-08-17 三菱瓦斯化学株式会社 銅または銅を主成分とする化合物のエッチング液
JP6070702B2 (ja) 2012-06-04 2017-02-01 日立金属株式会社 シールリングおよびシールリングの製造方法
CN102691063B (zh) * 2012-06-13 2013-11-13 南京大学 一种用于电化学蚀刻高精细线路的无机盐蚀刻液
KR102128061B1 (ko) * 2013-04-05 2020-06-29 해성디에스 주식회사 구리 함유 금속막 식각액 조성물 및 이를 이용한 식각 방법
CN104278272B (zh) * 2014-04-30 2017-09-08 天津普林电路股份有限公司 一种高密度互连电路板循环使用的酸性蚀刻液及其制备方法
JP6218000B2 (ja) 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6892785B2 (ja) * 2017-05-10 2021-06-23 株式会社Adeka エッチング液組成物及びエッチング方法
CN109280919B (zh) * 2017-07-20 2020-11-24 添鸿科技股份有限公司 含铜金属用的蚀刻剂组成物
CN109778190A (zh) * 2017-11-10 2019-05-21 深圳市华星光电技术有限公司 一种Cu-MoTi蚀刻液
JP7333755B2 (ja) * 2018-01-05 2023-08-25 株式会社Adeka エッチング液組成物及びエッチング方法
KR102223681B1 (ko) * 2018-05-30 2021-03-08 삼성디스플레이 주식회사 박막　식각액　조성물　및 이를 이용한 금속 패턴 형성 방법
CN112135927B (zh) * 2018-08-13 2022-06-24 株式会社Adeka 组合物和蚀刻方法
CN109954888B (zh) * 2019-04-10 2021-10-26 延边大学 一种三角片形状的单质铜纳米片及其制备方法
CN113122267A (zh) * 2019-12-31 2021-07-16 安集微电子科技（上海）股份有限公司 一种促进剂组合物在去除铜大马士革工艺中氮化钛的应用
JP7274221B2 (ja) * 2020-11-11 2023-05-16 メック株式会社 エッチング剤及び回路基板の製造方法
CN114990550B (zh) * 2022-08-05 2022-11-08 深圳市板明科技股份有限公司 一种线路板用铜面粗化溶液及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3387528B2 (ja) * 1992-08-07 2003-03-17 朝日化学工業株式会社 銅または銅合金のエッチング用組成物およびそのエッチング方法
US5560840A (en) * 1994-12-19 1996-10-01 International Business Machines Corporation Selective etching of nickle/iron alloys
JP2001181868A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk 銅及び銅合金用のマイクロエッチング剤
JP2001181867A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk マイクロエッチング剤
JP3962239B2 (ja) * 2001-10-30 2007-08-22 株式会社Ａｄｅｋａ エッチング剤組成物及びパターン形成方法
JP4018559B2 (ja) * 2003-02-27 2007-12-05 メック株式会社 電子基板の製造方法
TWI282377B (en) * 2003-07-25 2007-06-11 Mec Co Ltd Etchant, replenishment solution and method for producing copper wiring using the same
JP4224436B2 (ja) * 2003-07-25 2009-02-12 メック株式会社 エッチング剤と補給液及びこれを用いた銅配線の製造方法

Also Published As

Publication number Publication date
JP2011017054A (ja) 2011-01-27
KR20110005206A (ko) 2011-01-17
CN101949014B (zh) 2013-07-24
KR101032204B1 (ko) 2011-05-02
CN101949014A (zh) 2011-01-19
TW201124562A (en) 2011-07-16
JP4685180B2 (ja) 2011-05-18

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