TWI357646B - - Google Patents
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- Publication number
- TWI357646B TWI357646B TW97102735A TW97102735A TWI357646B TW I357646 B TWI357646 B TW I357646B TW 97102735 A TW97102735 A TW 97102735A TW 97102735 A TW97102735 A TW 97102735A TW I357646 B TWI357646 B TW I357646B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- forming
- openings
- metal
- layers
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 93
- 239000002184 metal Substances 0.000 claims description 91
- 229910052751 metal Inorganic materials 0.000 claims description 91
- 238000000034 method Methods 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 238000005553 drilling Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000007772 electroless plating Methods 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- -1 polytetrafluoroethylene Polymers 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 2
- 229920002120 photoresistant polymer Polymers 0.000 claims 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 238000007907 direct compression Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 238000007639 printing Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 317
- 238000010586 diagram Methods 0.000 description 16
- 239000011162 core material Substances 0.000 description 15
- 239000012792 core layer Substances 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000002689 soil Substances 0.000 description 3
- 230000001568 sexual effect Effects 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US99668707P | 2007-11-30 | 2007-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200924128A TW200924128A (en) | 2009-06-01 |
| TWI357646B true TWI357646B (enrdf_load_stackoverflow) | 2012-02-01 |
Family
ID=46727676
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96150446A TW200924134A (en) | 2007-11-30 | 2007-12-27 | Method of manufacturing laminated wiring board |
| TW97102735A TW200924128A (en) | 2007-11-30 | 2008-01-24 | Method of manufacturing laminated wiring board |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96150446A TW200924134A (en) | 2007-11-30 | 2007-12-27 | Method of manufacturing laminated wiring board |
Country Status (1)
| Country | Link |
|---|---|
| TW (2) | TW200924134A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550531B (zh) * | 2018-05-15 | 2020-05-08 | 日月光半导体(上海)有限公司 | 封装基板的制造方法 |
-
2007
- 2007-12-27 TW TW96150446A patent/TW200924134A/zh not_active IP Right Cessation
-
2008
- 2008-01-24 TW TW97102735A patent/TW200924128A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI367554B (enrdf_load_stackoverflow) | 2012-07-01 |
| TW200924134A (en) | 2009-06-01 |
| TW200924128A (en) | 2009-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |