TWI353031B - - Google Patents
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- Publication number
- TWI353031B TWI353031B TW96120184A TW96120184A TWI353031B TW I353031 B TWI353031 B TW I353031B TW 96120184 A TW96120184 A TW 96120184A TW 96120184 A TW96120184 A TW 96120184A TW I353031 B TWI353031 B TW I353031B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- test
- signal
- circuit layer
- probes
- Prior art date
Links
- 238000012360 testing method Methods 0.000 claims description 114
- 239000000523 sample Substances 0.000 claims description 113
- 239000010410 layer Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 10
- 239000002356 single layer Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 3
- 230000005611 electricity Effects 0.000 claims 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 230000035939 shock Effects 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000237536 Mytilus edulis Species 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 235000020638 mussel Nutrition 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96120184A TW200849437A (en) | 2007-06-05 | 2007-06-05 | High-speed testing device |
| US12/133,249 US7782070B2 (en) | 2007-06-05 | 2008-06-04 | Probing device |
| KR1020080052519A KR100965923B1 (ko) | 2007-06-05 | 2008-06-04 | 프로브 테스트 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96120184A TW200849437A (en) | 2007-06-05 | 2007-06-05 | High-speed testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200849437A TW200849437A (en) | 2008-12-16 |
| TWI353031B true TWI353031B (enExample) | 2011-11-21 |
Family
ID=44824156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96120184A TW200849437A (en) | 2007-06-05 | 2007-06-05 | High-speed testing device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200849437A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI415204B (zh) * | 2010-04-28 | 2013-11-11 | Wen Chyimr Chen | 測試板 |
-
2007
- 2007-06-05 TW TW96120184A patent/TW200849437A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200849437A (en) | 2008-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |