TWI334032B - - Google Patents
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- Publication number
- TWI334032B TWI334032B TW96134978A TW96134978A TWI334032B TW I334032 B TWI334032 B TW I334032B TW 96134978 A TW96134978 A TW 96134978A TW 96134978 A TW96134978 A TW 96134978A TW I334032 B TWI334032 B TW I334032B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- test
- probes
- board
- electrically connected
- Prior art date
Links
- 239000000523 sample Substances 0.000 claims description 102
- 238000012360 testing method Methods 0.000 claims description 69
- 239000010410 layer Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000009960 carding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 230000000399 orthopedic effect Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000026676 system process Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96134978A TW200914854A (en) | 2007-09-19 | 2007-09-19 | High speed testing device |
| US12/133,249 US7782070B2 (en) | 2007-06-05 | 2008-06-04 | Probing device |
| KR1020080052519A KR100965923B1 (ko) | 2007-06-05 | 2008-06-04 | 프로브 테스트 장치 |
| DE102008045726.4A DE102008045726B4 (de) | 2007-09-19 | 2008-09-04 | Prüfvorrichtung |
| SG200806872-8A SG151211A1 (en) | 2007-09-19 | 2008-09-17 | Probing device |
| FR0856318A FR2924816B1 (fr) | 2007-09-19 | 2008-09-19 | Dispositif de controle sous pointes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96134978A TW200914854A (en) | 2007-09-19 | 2007-09-19 | High speed testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200914854A TW200914854A (en) | 2009-04-01 |
| TWI334032B true TWI334032B (enExample) | 2010-12-01 |
Family
ID=44209684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96134978A TW200914854A (en) | 2007-06-05 | 2007-09-19 | High speed testing device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200914854A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI422846B (zh) * | 2012-01-03 | 2014-01-11 | Rato High Tech Corp | The circuit board of the test fixture structure improved |
-
2007
- 2007-09-19 TW TW96134978A patent/TW200914854A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200914854A (en) | 2009-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |