TWI352874B - Chucking system comprising an array of fluid chamb - Google Patents

Chucking system comprising an array of fluid chamb Download PDF

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Publication number
TWI352874B
TWI352874B TW096111034A TW96111034A TWI352874B TW I352874 B TWI352874 B TW I352874B TW 096111034 A TW096111034 A TW 096111034A TW 96111034 A TW96111034 A TW 96111034A TW I352874 B TWI352874 B TW I352874B
Authority
TW
Taiwan
Prior art keywords
fluid
chambers
chamber
substrate
fluid chamber
Prior art date
Application number
TW096111034A
Other languages
English (en)
Chinese (zh)
Other versions
TW200813619A (en
Inventor
Anshuman Cherala
Byung-Jin Choi
Pankaj B Lad
Steven C Shackleton
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of TW200813619A publication Critical patent/TW200813619A/zh
Application granted granted Critical
Publication of TWI352874B publication Critical patent/TWI352874B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW096111034A 2006-04-03 2007-03-29 Chucking system comprising an array of fluid chamb TWI352874B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78877706P 2006-04-03 2006-04-03

Publications (2)

Publication Number Publication Date
TW200813619A TW200813619A (en) 2008-03-16
TWI352874B true TWI352874B (en) 2011-11-21

Family

ID=38656006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096111034A TWI352874B (en) 2006-04-03 2007-03-29 Chucking system comprising an array of fluid chamb

Country Status (6)

Country Link
EP (1) EP2007566A4 (https=)
JP (2) JP4667524B2 (https=)
KR (1) KR20090004910A (https=)
CN (1) CN101415535A (https=)
TW (1) TWI352874B (https=)
WO (1) WO2007126767A2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4854383B2 (ja) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8652393B2 (en) * 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
US8913230B2 (en) * 2009-07-02 2014-12-16 Canon Nanotechnologies, Inc. Chucking system with recessed support feature
JP5875250B2 (ja) * 2011-04-28 2016-03-02 キヤノン株式会社 インプリント装置、インプリント方法及びデバイス製造方法
JP5893303B2 (ja) * 2011-09-07 2016-03-23 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
KR20160093674A (ko) * 2013-12-03 2016-08-08 가부시키가이샤 하모테크 유지 장치, 유지 시스템, 제어 방법 및 반송 장치
JP6333031B2 (ja) 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
US10620532B2 (en) 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP6647027B2 (ja) 2015-12-03 2020-02-14 キヤノン株式会社 インプリント装置および物品製造方法
JP6940944B2 (ja) * 2016-12-06 2021-09-29 キヤノン株式会社 インプリント装置、及び物品製造方法
JP7132739B2 (ja) 2018-04-06 2022-09-07 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7710350B2 (ja) 2021-09-28 2025-07-18 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244269A (ja) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法
JP2000195927A (ja) * 1998-12-28 2000-07-14 Sony Corp 真空チャック装置
JP2001127144A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
EP1077393A2 (en) * 1999-08-19 2001-02-21 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
JP2001127145A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
ATE438197T1 (de) * 2002-11-13 2009-08-15 Molecular Imprints Inc Ein halterungssystem und ein verfahren zum modulieren von substratformen

Also Published As

Publication number Publication date
JP2009532899A (ja) 2009-09-10
JP4667524B2 (ja) 2011-04-13
JP2011077529A (ja) 2011-04-14
WO2007126767A2 (en) 2007-11-08
EP2007566A2 (en) 2008-12-31
WO2007126767A3 (en) 2008-07-31
CN101415535A (zh) 2009-04-22
TW200813619A (en) 2008-03-16
KR20090004910A (ko) 2009-01-12
EP2007566A4 (en) 2010-10-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees