EP2007566A4 - ASSEMBLY SYSTEM WITH AN ARRANGEMENT FROM PRINT BOXES - Google Patents

ASSEMBLY SYSTEM WITH AN ARRANGEMENT FROM PRINT BOXES

Info

Publication number
EP2007566A4
EP2007566A4 EP07754062A EP07754062A EP2007566A4 EP 2007566 A4 EP2007566 A4 EP 2007566A4 EP 07754062 A EP07754062 A EP 07754062A EP 07754062 A EP07754062 A EP 07754062A EP 2007566 A4 EP2007566 A4 EP 2007566A4
Authority
EP
European Patent Office
Prior art keywords
network
fluid chambers
chuck system
chuck
chambers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07754062A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2007566A2 (en
Inventor
Anshuman Cherala
Byung-Jin Choi
Pankaj B Lad
Steven C Shackleton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Nanotechnologies Inc
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of EP2007566A2 publication Critical patent/EP2007566A2/en
Publication of EP2007566A4 publication Critical patent/EP2007566A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP07754062A 2006-04-03 2007-03-26 ASSEMBLY SYSTEM WITH AN ARRANGEMENT FROM PRINT BOXES Withdrawn EP2007566A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78877706P 2006-04-03 2006-04-03
PCT/US2007/007487 WO2007126767A2 (en) 2006-04-03 2007-03-26 Chucking system comprising an array of fluid chambers

Publications (2)

Publication Number Publication Date
EP2007566A2 EP2007566A2 (en) 2008-12-31
EP2007566A4 true EP2007566A4 (en) 2010-10-13

Family

ID=38656006

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07754062A Withdrawn EP2007566A4 (en) 2006-04-03 2007-03-26 ASSEMBLY SYSTEM WITH AN ARRANGEMENT FROM PRINT BOXES

Country Status (6)

Country Link
EP (1) EP2007566A4 (https=)
JP (2) JP4667524B2 (https=)
KR (1) KR20090004910A (https=)
CN (1) CN101415535A (https=)
TW (1) TWI352874B (https=)
WO (1) WO2007126767A2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4854383B2 (ja) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8652393B2 (en) * 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
US8913230B2 (en) * 2009-07-02 2014-12-16 Canon Nanotechnologies, Inc. Chucking system with recessed support feature
JP5875250B2 (ja) * 2011-04-28 2016-03-02 キヤノン株式会社 インプリント装置、インプリント方法及びデバイス製造方法
JP5893303B2 (ja) * 2011-09-07 2016-03-23 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
KR20160093674A (ko) * 2013-12-03 2016-08-08 가부시키가이샤 하모테크 유지 장치, 유지 시스템, 제어 방법 및 반송 장치
JP6333031B2 (ja) 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
US10620532B2 (en) 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP6647027B2 (ja) 2015-12-03 2020-02-14 キヤノン株式会社 インプリント装置および物品製造方法
JP6940944B2 (ja) * 2016-12-06 2021-09-29 キヤノン株式会社 インプリント装置、及び物品製造方法
JP7132739B2 (ja) 2018-04-06 2022-09-07 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7710350B2 (ja) 2021-09-28 2025-07-18 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534073A (en) * 1992-09-07 1996-07-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor producing apparatus comprising wafer vacuum chucking device
JP2000195927A (ja) * 1998-12-28 2000-07-14 Sony Corp 真空チャック装置
WO2004044651A1 (en) * 2002-11-13 2004-05-27 Molecular Imprints, Inc. A chucking system and method for modulating shapes of substrates
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127144A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
JP2001127145A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534073A (en) * 1992-09-07 1996-07-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor producing apparatus comprising wafer vacuum chucking device
JP2000195927A (ja) * 1998-12-28 2000-07-14 Sony Corp 真空チャック装置
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
WO2004044651A1 (en) * 2002-11-13 2004-05-27 Molecular Imprints, Inc. A chucking system and method for modulating shapes of substrates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007126767A2 *

Also Published As

Publication number Publication date
TWI352874B (en) 2011-11-21
JP2009532899A (ja) 2009-09-10
JP4667524B2 (ja) 2011-04-13
JP2011077529A (ja) 2011-04-14
WO2007126767A2 (en) 2007-11-08
EP2007566A2 (en) 2008-12-31
WO2007126767A3 (en) 2008-07-31
CN101415535A (zh) 2009-04-22
TW200813619A (en) 2008-03-16
KR20090004910A (ko) 2009-01-12

Similar Documents

Publication Publication Date Title
EP2007566A4 (en) ASSEMBLY SYSTEM WITH AN ARRANGEMENT FROM PRINT BOXES
EP2086573A4 (en) SYSTEM FOR CLEANING LIQUOR
EP2408526A4 (en) REHABILITATION SYSTEM WITH MULTIPLE FREEDOMS WITH INTELLIGENT MULTIMODAL FLUIDIC ACTUATOR
EP2162256A4 (en) EJEKTORBOHRSYSTEM
EP2142311A4 (en) liquid applicator
DK2208073T3 (da) Biokemiske markører til cvd-risikovurdering
DK2024499T3 (da) Oligonukleotidanaloger med kationiske intersubunit-koblinger
EP1612425A4 (en) TURBOMACHINE
EP2039743A4 (en) ELECTRORHEOLOGICAL FLUID OF THE POLAR MOLECULE TYPE
DK2520515T3 (da) Fluidafgivelsessystem
EP2000920A4 (en) NETWORK SYSTEM
EP2224854A4 (en) DISCRETE ADDRESSABLE FAR RANGE X-RAY SYSTEM
DE602007001091D1 (de) Getriebeflüssigkeiten
EP1868937A4 (en) LIQUID DISPENSER WITH LARGE VOLUME
EP2172403A4 (en) LIQUID COLLECTING BAG
EP2348989A4 (en) FLOW ASSESSMENT
EP2123915A4 (en) Scroll type fluid machine
EP1948753A4 (en) TRACTION FLUID FOR LEVEL TRANSMISSION
EP2007970A4 (en) DISPERSIVE, SEALLESS DRILLING LIQUID
EP1907090A4 (en) fluid separator
DE112006002455A5 (de) Sensoreinheit für Fluide
EP2003289A4 (en) FLUID MACHINE
BRPI1007065A2 (pt) método para reduzir a perda do filtrado dos fluidos de perfuração à base de óleo, redutor de filtrado, e, fluido de perfuração à base de óleo.
FR2887239B1 (fr) Distributeur de fluide
EP2074398A4 (en) MULTI-CHANNEL MANOMETER WITH INDEPENDENT LIQUID LEVEL SETTINGS

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20081103

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK RS

RIN1 Information on inventor provided before grant (corrected)

Inventor name: SHACKLETON, STEVEN, C.

Inventor name: LAD, PANKAJ, B.

Inventor name: CHOI, BYUNG-JIN

Inventor name: CHERALA, ANSHUMAN

A4 Supplementary search report drawn up and despatched

Effective date: 20100914

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/683 20060101AFI20100908BHEP

17Q First examination report despatched

Effective date: 20101111

DAX Request for extension of the european patent (deleted)
RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/67 20060101ALI20120716BHEP

Ipc: G03F 7/00 20060101ALI20120716BHEP

Ipc: B82Y 10/00 20110101ALI20120716BHEP

Ipc: H01L 21/683 20060101AFI20120716BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20121001