TWI350560B - Method for producing a semiconductor component having a metallic control electrode, and semiconductor component - Google Patents
Method for producing a semiconductor component having a metallic control electrode, and semiconductor componentInfo
- Publication number
- TWI350560B TWI350560B TW096108971A TW96108971A TWI350560B TW I350560 B TWI350560 B TW I350560B TW 096108971 A TW096108971 A TW 096108971A TW 96108971 A TW96108971 A TW 96108971A TW I350560 B TWI350560 B TW I350560B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor component
- layer
- producing
- control electrode
- metal
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28581—Deposition of Schottky electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28587—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
- H01L29/475—Schottky barrier electrodes on AIII-BV compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006012369A DE102006012369A1 (de) | 2006-03-17 | 2006-03-17 | Verfahren zur Herstellung eines Halbleiterbauelements mit einer metallischen Steuerelektrode und Halbleiterbauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200737318A TW200737318A (en) | 2007-10-01 |
TWI350560B true TWI350560B (en) | 2011-10-11 |
Family
ID=38162142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096108971A TWI350560B (en) | 2006-03-17 | 2007-03-15 | Method for producing a semiconductor component having a metallic control electrode, and semiconductor component |
Country Status (8)
Country | Link |
---|---|
US (1) | US7573122B2 (zh) |
EP (1) | EP1835528B1 (zh) |
JP (1) | JP5348847B2 (zh) |
CN (1) | CN101043003B (zh) |
AT (1) | ATE544177T1 (zh) |
CA (1) | CA2579325C (zh) |
DE (1) | DE102006012369A1 (zh) |
TW (1) | TWI350560B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8502272B2 (en) * | 2007-05-16 | 2013-08-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Metal-oxide-semiconductor high electron mobility transistors and methods of fabrication |
CN110326090A (zh) * | 2017-02-27 | 2019-10-11 | 三菱电机株式会社 | 半导体装置及其制造方法 |
CN113793803A (zh) * | 2021-08-19 | 2021-12-14 | 联芯集成电路制造(厦门)有限公司 | 铝金属栅极的制作方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119868A (ja) * | 1982-12-27 | 1984-07-11 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
US4679311A (en) | 1985-12-12 | 1987-07-14 | Allied Corporation | Method of fabricating self-aligned field-effect transistor having t-shaped gate electrode, sub-micron gate length and variable drain to gate spacing |
JPH05335348A (ja) * | 1992-05-29 | 1993-12-17 | Toshiba Corp | 半導体装置 |
JPH08139106A (ja) * | 1994-11-11 | 1996-05-31 | Hitachi Ltd | 電界効果型化合物半導体装置 |
JPH10107300A (ja) * | 1996-10-03 | 1998-04-24 | Hitachi Ltd | 半導体装置 |
JPH11154678A (ja) * | 1997-11-20 | 1999-06-08 | Nec Corp | 半導体装置およびその製造方法 |
JP3379062B2 (ja) | 1997-12-02 | 2003-02-17 | 富士通カンタムデバイス株式会社 | 半導体装置及びその製造方法 |
JP3416532B2 (ja) * | 1998-06-15 | 2003-06-16 | 富士通カンタムデバイス株式会社 | 化合物半導体装置及びその製造方法 |
JP4584379B2 (ja) * | 1999-07-16 | 2010-11-17 | 三菱電機株式会社 | 半導体装置の製造方法 |
US6686616B1 (en) * | 2000-05-10 | 2004-02-03 | Cree, Inc. | Silicon carbide metal-semiconductor field effect transistors |
US6906350B2 (en) * | 2001-10-24 | 2005-06-14 | Cree, Inc. | Delta doped silicon carbide metal-semiconductor field effect transistors having a gate disposed in a double recess structure |
WO2003071607A1 (fr) * | 2002-02-21 | 2003-08-28 | The Furukawa Electric Co., Ltd. | Transistor a effet de champ gan |
DE10304722A1 (de) | 2002-05-11 | 2004-08-19 | United Monolithic Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements |
JP2004055677A (ja) * | 2002-07-17 | 2004-02-19 | Communication Research Laboratory | 電界効果トランジスタのゲート電極とその作製方法 |
JP3960957B2 (ja) * | 2003-09-05 | 2007-08-15 | 古河電気工業株式会社 | 半導体電子デバイス |
US7129182B2 (en) * | 2003-11-06 | 2006-10-31 | Intel Corporation | Method for etching a thin metal layer |
US7253015B2 (en) * | 2004-02-17 | 2007-08-07 | Velox Semiconductor Corporation | Low doped layer for nitride-based semiconductor device |
-
2006
- 2006-03-17 DE DE102006012369A patent/DE102006012369A1/de not_active Withdrawn
- 2006-04-13 AT AT06007759T patent/ATE544177T1/de active
- 2006-04-13 EP EP06007759A patent/EP1835528B1/de active Active
- 2006-11-28 US US11/605,020 patent/US7573122B2/en active Active
-
2007
- 2007-02-20 CA CA 2579325 patent/CA2579325C/en active Active
- 2007-03-14 CN CN2007100886686A patent/CN101043003B/zh active Active
- 2007-03-15 TW TW096108971A patent/TWI350560B/zh active
- 2007-03-19 JP JP2007070894A patent/JP5348847B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP5348847B2 (ja) | 2013-11-20 |
US20070218642A1 (en) | 2007-09-20 |
DE102006012369A1 (de) | 2007-09-20 |
CN101043003A (zh) | 2007-09-26 |
EP1835528B1 (de) | 2012-02-01 |
CA2579325C (en) | 2015-04-28 |
JP2007251180A (ja) | 2007-09-27 |
EP1835528A3 (de) | 2009-10-21 |
CA2579325A1 (en) | 2007-09-17 |
ATE544177T1 (de) | 2012-02-15 |
EP1835528A2 (de) | 2007-09-19 |
US7573122B2 (en) | 2009-08-11 |
TW200737318A (en) | 2007-10-01 |
CN101043003B (zh) | 2011-09-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2175494A3 (en) | Compound semiconductor device and manufacturing method of the same | |
WO2009019837A1 (ja) | 炭化珪素半導体素子およびその製造方法 | |
WO2007140037A3 (en) | Method of forming a semiconductor device having an interlayer and structure thereof | |
TW200725709A (en) | Semiconductor apparatus and making method thereof | |
DE102005054872A1 (de) | Vertikales Leistungshalbleiterbauelement, Halbleiterbauteil und Verfahren zu deren Herstellung | |
TW200509391A (en) | A device having multiple silicide types and a method for its fabrication | |
TWI265550B (en) | Fabrication method, manufacturing method for semiconductor device, and fabrication device | |
TW200703574A (en) | Capacitorless DRAM on bulk silicon | |
GB2421834B (en) | TFT array substrate and the fabrication method thereof | |
EP1515378A3 (en) | Method of forming electrodes for field effect transistors | |
EP1681713A4 (en) | SURFACE PROTECTION FILM AND SEMICONDUCTOR WAFER LAPPING METHOD | |
TW200625468A (en) | A method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode | |
TW200731850A (en) | Organic light-emitting transistor element and method for manufacturing the same | |
WO2006054024A3 (fr) | Amincissement d'une plaquette semiconductrice | |
TW200705017A (en) | Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating the thin film transistor substrate | |
TW200603251A (en) | Semiconductor device and method for forming the same | |
TW200642081A (en) | Thin film transistor and process thereof | |
WO2006091290A3 (en) | Method of forming nanoclusters | |
TW200512801A (en) | Fabrication of semiconductor devices | |
EP2131399A3 (en) | Insulated gate semiconductor device and method of manufacturing the same | |
WO2009001780A1 (ja) | 半導体装置およびその製造方法 | |
TWI268550B (en) | Decreasing metal-silicide oxidation during wafer queue time description | |
TWI350560B (en) | Method for producing a semiconductor component having a metallic control electrode, and semiconductor component | |
TW200616083A (en) | Method for fabricating semiconductor with high-k dielectric layer thereof | |
TW200741863A (en) | Method and device for depositing a protective layer during an etching procedure |