TWI350139B - Heat sink, electric pump, and electronic component cooling apparatus comprising the same - Google Patents
Heat sink, electric pump, and electronic component cooling apparatus comprising the sameInfo
- Publication number
- TWI350139B TWI350139B TW094103056A TW94103056A TWI350139B TW I350139 B TWI350139 B TW I350139B TW 094103056 A TW094103056 A TW 094103056A TW 94103056 A TW94103056 A TW 94103056A TW I350139 B TWI350139 B TW I350139B
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- electronic component
- heat sink
- cooling apparatus
- electric pump
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
- F28D1/05366—Assemblies of conduits connected to common headers, e.g. core type radiators
- F28D1/05375—Assemblies of conduits connected to common headers, e.g. core type radiators with particular pattern of flow, e.g. change of flow direction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004027312A JP4409976B2 (ja) | 2004-02-03 | 2004-02-03 | 電子部品冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200538025A TW200538025A (en) | 2005-11-16 |
TWI350139B true TWI350139B (en) | 2011-10-01 |
Family
ID=34805872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094103056A TWI350139B (en) | 2004-02-03 | 2005-02-01 | Heat sink, electric pump, and electronic component cooling apparatus comprising the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US7527085B2 (zh) |
JP (1) | JP4409976B2 (zh) |
CN (2) | CN101400245B (zh) |
TW (1) | TWI350139B (zh) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4549759B2 (ja) * | 2004-07-08 | 2010-09-22 | 富士通株式会社 | 冷却モジュール |
CN100371854C (zh) * | 2004-12-24 | 2008-02-27 | 富准精密工业(深圳)有限公司 | 液冷式散热装置 |
US20060185931A1 (en) * | 2005-02-04 | 2006-08-24 | Kawar Maher S | Acoustic noise reduction apparatus for personal computers and electronics |
TWI264989B (en) * | 2005-02-25 | 2006-10-21 | Delta Electronics Inc | Liquid-cooling type heat-dissipation module |
JP3847320B1 (ja) * | 2005-09-01 | 2006-11-22 | シャープ株式会社 | 光源装置、ランプユニット、及び投影型画像表示装置 |
US7312995B2 (en) * | 2005-11-05 | 2007-12-25 | Modine Manufacturing Company | Cooling system for computer electronics |
US7626815B2 (en) * | 2005-11-14 | 2009-12-01 | Nvidia Corporation | Drive bay heat exchanger |
US20080121384A1 (en) * | 2006-11-29 | 2008-05-29 | Po-Yung Tseng | Liquid cooled heat dissipator |
JP4579269B2 (ja) * | 2007-05-25 | 2010-11-10 | トヨタ自動車株式会社 | 冷却装置 |
US8272428B2 (en) | 2007-07-04 | 2012-09-25 | Denso Corporation | Cooling apparatus using brine |
US9453691B2 (en) * | 2007-08-09 | 2016-09-27 | Coolit Systems, Inc. | Fluid heat exchange systems |
US8746330B2 (en) * | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
US20090090489A1 (en) * | 2007-10-05 | 2009-04-09 | Asia Vital Components Co., Ltd. | Water-cooling heat-dissipating module of electronic apparatus |
CN101527173B (zh) * | 2008-03-04 | 2011-10-19 | 华硕电脑股份有限公司 | 散热系统运行方法 |
KR100956358B1 (ko) | 2008-03-12 | 2010-05-06 | 한국생산기술연구원 | 저장 탱크와 팬의 일체형 구조를 갖는 수냉식 컴퓨터 냉각시스템 |
US10048008B1 (en) * | 2009-12-15 | 2018-08-14 | Rouchon Industries, Inc. | Radiator with integrated pump for actively cooling electronic devices |
US9927181B2 (en) | 2009-12-15 | 2018-03-27 | Rouchon Industries, Inc. | Radiator with integrated pump for actively cooling electronic devices |
US9869505B2 (en) * | 2010-12-16 | 2018-01-16 | Heatcraft Refrigeration Products, Llc | Evaporator with replaceable fan venturi ring |
WO2012142737A1 (en) | 2011-04-18 | 2012-10-26 | Empire Technology Development Llc | Dissipation utilizing flow of refreigerant |
WO2014141162A1 (en) | 2013-03-15 | 2014-09-18 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US9089076B2 (en) | 2012-07-06 | 2015-07-21 | International Business Machines Corporation | Cooling system for electronics |
US9068784B2 (en) | 2012-11-15 | 2015-06-30 | International Business Machines Corporation | Cooling system for electronics |
WO2014190478A1 (en) | 2013-05-28 | 2014-12-04 | Empire Technology Development Llc | Evaporation-condensation systems and methods of manufacturing and using the same |
US10065130B2 (en) | 2013-05-28 | 2018-09-04 | Empire Technology Development Llc | Thin film systems and methods for using same |
DE102013015985B4 (de) * | 2013-09-25 | 2016-08-18 | Stego-Holding Gmbh | Lüftereinrichtung |
US11085450B2 (en) | 2013-10-18 | 2021-08-10 | Regal Beloit America, Inc. | Pump having a housing with internal and external planar surfaces defining a cavity with an axial flux motor driven impeller secured therein |
US10087938B2 (en) | 2013-10-18 | 2018-10-02 | Regal Beloit America, Inc. | Pump, associated electric machine and associated method |
TWI575212B (zh) * | 2014-09-24 | 2017-03-21 | 台達電子工業股份有限公司 | 可翻轉使用之液冷散熱裝置及其翻轉配置方法 |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US9818671B2 (en) * | 2015-02-10 | 2017-11-14 | Dynatron Corporation | Liquid-cooled heat sink for electronic devices |
CN104837321A (zh) * | 2015-05-11 | 2015-08-12 | 周桂林 | 一种通过排风扇加速散热的供电设备及其使用方法 |
US20170115708A1 (en) * | 2015-07-24 | 2017-04-27 | Niko Tivadar | Computer liquid cooling system and method of use |
TWM512730U (zh) * | 2015-08-20 | 2015-11-21 | Cooler Master Co Ltd | 水冷式散熱裝置 |
TWI593344B (zh) * | 2016-01-14 | 2017-07-21 | 訊凱國際股份有限公司 | 液冷系統 |
CA3021959C (en) | 2016-05-11 | 2019-05-21 | Hypertechnologie Ciara Inc | Cpu cooling system with direct spray cooling |
JP6625956B2 (ja) * | 2016-10-27 | 2019-12-25 | ファナック株式会社 | ファンの取り付け構造およびファン |
CN206413335U (zh) * | 2016-12-28 | 2017-08-15 | 讯凯国际股份有限公司 | 液冷系统 |
US10416685B2 (en) | 2017-03-16 | 2019-09-17 | Regal Beloit America, Inc. | Information collection system, pump system and associated method |
US10543036B2 (en) * | 2017-06-13 | 2020-01-28 | Covidien Lp | Systems and methods of cooling surgical instruments |
KR102244138B1 (ko) * | 2017-07-11 | 2021-04-22 | 주식회사 엘지화학 | 배터리 모듈 및 이를 포함하는 배터리 팩 |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
CN107577316B (zh) * | 2017-10-18 | 2023-04-25 | 宝鸡文理学院 | 一种内置式计算机多重散热装置 |
US11466190B2 (en) * | 2018-06-25 | 2022-10-11 | Abb Schweiz Ag | Forced air cooling system with phase change material |
DE102018006646A1 (de) * | 2018-08-23 | 2020-02-27 | Alphacool International Gmbh | Kompakte Flüssigkeitskühlteileinheit (FKT) für elektrische und elektronische Bauteile |
JP7247517B2 (ja) * | 2018-10-24 | 2023-03-29 | 日本電産株式会社 | 冷却装置 |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
CN110430738B (zh) * | 2019-08-28 | 2024-04-12 | 国能神福(晋江)热电有限公司 | 冷却装置 |
CN113376499A (zh) * | 2020-02-25 | 2021-09-10 | 5Dots科技有限公司 | 一种用于ic器件测试的冷却系统及其制造方法和使用方法 |
CN111366020A (zh) * | 2020-03-30 | 2020-07-03 | 厦门大学 | 一种扩展水冷式热管散热器 |
US11395443B2 (en) | 2020-05-11 | 2022-07-19 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
CN114449830A (zh) * | 2020-10-31 | 2022-05-06 | 华为技术有限公司 | 冷却装置及电子设备 |
US11729950B2 (en) | 2021-04-01 | 2023-08-15 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
CA3153037A1 (en) | 2021-04-01 | 2022-10-01 | Ovh | Hybrid immersion cooling system for rack-mounted electronic assemblies |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
TW202248586A (zh) | 2021-06-09 | 2022-12-16 | 冠鼎科技有限公司 | 水冷式散熱系統 |
CN113701975B (zh) * | 2021-10-08 | 2024-04-09 | 苏州苏试试验集团股份有限公司 | 柔性动态导水装置及振动离心试验台 |
CN116271935B (zh) * | 2023-03-16 | 2024-02-23 | 福建省德旭新材料有限公司 | 一种六氟磷酸钠制备用冷却器 |
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JP2003318341A (ja) * | 2002-04-25 | 2003-11-07 | Matsushita Electric Ind Co Ltd | 半導体素子の冷却装置 |
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US6702002B2 (en) * | 2002-06-03 | 2004-03-09 | Chin-Wen Wang | Hydronic pump type heat radiator |
US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
US6809928B2 (en) * | 2002-12-27 | 2004-10-26 | Intel Corporation | Sealed and pressurized liquid cooling system for microprocessor |
TW200503608A (en) * | 2003-07-15 | 2005-01-16 | Ind Tech Res Inst | Cooling plate having vortices generator |
-
2004
- 2004-02-03 JP JP2004027312A patent/JP4409976B2/ja not_active Expired - Lifetime
-
2005
- 2005-01-26 CN CN200810170898.1A patent/CN101400245B/zh not_active Expired - Fee Related
- 2005-01-26 CN CN200510006304.XA patent/CN100561722C/zh not_active Expired - Fee Related
- 2005-02-01 TW TW094103056A patent/TWI350139B/zh not_active IP Right Cessation
- 2005-02-02 US US11/049,353 patent/US7527085B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW200538025A (en) | 2005-11-16 |
CN1652328A (zh) | 2005-08-10 |
CN100561722C (zh) | 2009-11-18 |
US20050168939A1 (en) | 2005-08-04 |
JP2005223024A (ja) | 2005-08-18 |
CN101400245A (zh) | 2009-04-01 |
US7527085B2 (en) | 2009-05-05 |
CN101400245B (zh) | 2012-12-12 |
JP4409976B2 (ja) | 2010-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |