TWI350009B - High efficient lighting system on led-basis with improved color rendition - Google Patents

High efficient lighting system on led-basis with improved color rendition

Info

Publication number
TWI350009B
TWI350009B TW093128944A TW93128944A TWI350009B TW I350009 B TWI350009 B TW I350009B TW 093128944 A TW093128944 A TW 093128944A TW 93128944 A TW93128944 A TW 93128944A TW I350009 B TWI350009 B TW I350009B
Authority
TW
Taiwan
Prior art keywords
led
basis
lighting system
high efficient
improved color
Prior art date
Application number
TW093128944A
Other languages
English (en)
Chinese (zh)
Other versions
TW200518366A (en
Inventor
Herbert Brunner
Tim Fiedler
Frank Jermann
Martin Zachau
Original Assignee
Osram Gmbh
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh, Osram Opto Semiconductors Gmbh filed Critical Osram Gmbh
Publication of TW200518366A publication Critical patent/TW200518366A/zh
Application granted granted Critical
Publication of TWI350009B publication Critical patent/TWI350009B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
TW093128944A 2003-09-24 2004-09-24 High efficient lighting system on led-basis with improved color rendition TWI350009B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10344332 2003-09-24

Publications (2)

Publication Number Publication Date
TW200518366A TW200518366A (en) 2005-06-01
TWI350009B true TWI350009B (en) 2011-10-01

Family

ID=34384255

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093128944A TWI350009B (en) 2003-09-24 2004-09-24 High efficient lighting system on led-basis with improved color rendition

Country Status (7)

Country Link
US (1) US7825574B2 (enExample)
EP (1) EP1670875B1 (enExample)
JP (1) JP4457110B2 (enExample)
KR (1) KR101131648B1 (enExample)
CN (1) CN1886483B (enExample)
TW (1) TWI350009B (enExample)
WO (1) WO2005030903A1 (enExample)

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KR100828891B1 (ko) 2006-02-23 2008-05-09 엘지이노텍 주식회사 Ｌｅｄ 패키지
DK176593B1 (da) 2006-06-12 2008-10-13 Akj Inv S V Allan Krogh Jensen Intelligent LED baseret lyskilde til erstatning af lysstofrör
CN101106856B (zh) * 2006-07-10 2012-01-25 东芝照明技术株式会社 照明装置
EP2087530A1 (en) * 2006-11-10 2009-08-12 Philips Intellectual Property & Standards GmbH Illumination system comprising monolithic ceramic luminescence converter
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WO2009117148A2 (en) * 2008-03-21 2009-09-24 Nanogram Corporation Metal silicon nitride or metal silicon oxynitride submicron phosphor particles and methods for synthesizing these phosphors
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JP5308773B2 (ja) * 2008-10-30 2013-10-09 スタンレー電気株式会社 半導体発光装置
JP5342867B2 (ja) * 2008-12-19 2013-11-13 スタンレー電気株式会社 半導体発光装置及び駆動方法
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WO2011044931A1 (de) * 2009-10-14 2011-04-21 Osram Gesellschaft mit beschränkter Haftung LEUCHTVORRICHTUNG ZUR ERZEUGUNG EINES WEIßEN MISCHLICHTS
US8395312B2 (en) * 2010-04-19 2013-03-12 Bridgelux, Inc. Phosphor converted light source having an additional LED to provide long wavelength light
TW201202391A (en) * 2010-07-14 2012-01-16 Forward Electronics Co Ltd Phosphor composition for AC LED and AC LED manufactured by using the same
KR101225002B1 (ko) * 2010-09-27 2013-01-22 삼성전자주식회사 형광체 및 이의 제조방법
US8912554B2 (en) 2011-06-08 2014-12-16 Micron Technology, Inc. Long wavelength light emitting device with photoluminescence emission and high quantum efficiency
KR101772588B1 (ko) * 2011-08-22 2017-09-13 한국전자통신연구원 클리어 컴파운드 에폭시로 몰딩한 ｍｉｔ 소자 및 그것을 포함하는 화재 감지 장치
US8919975B2 (en) * 2011-11-09 2014-12-30 Cree, Inc. Lighting device providing improved color rendering
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Also Published As

Publication number Publication date
EP1670875B1 (de) 2019-08-14
US7825574B2 (en) 2010-11-02
TW200518366A (en) 2005-06-01
CN1886483A (zh) 2006-12-27
CN1886483B (zh) 2010-06-16
US20070069643A1 (en) 2007-03-29
JP4457110B2 (ja) 2010-04-28
KR20060115731A (ko) 2006-11-09
EP1670875A1 (de) 2006-06-21
KR101131648B1 (ko) 2012-03-28
WO2005030903A1 (de) 2005-04-07
JP2007507065A (ja) 2007-03-22

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