TWI348748B - Semiconductor device and method of fabricating the same - Google Patents

Semiconductor device and method of fabricating the same

Info

Publication number
TWI348748B
TWI348748B TW093130083A TW93130083A TWI348748B TW I348748 B TWI348748 B TW I348748B TW 093130083 A TW093130083 A TW 093130083A TW 93130083 A TW93130083 A TW 93130083A TW I348748 B TWI348748 B TW I348748B
Authority
TW
Taiwan
Prior art keywords
fabricating
same
semiconductor device
semiconductor
Prior art date
Application number
TW093130083A
Other languages
English (en)
Other versions
TW200522289A (en
Inventor
Yasumasa Kasuya
Hirotaka Nakano
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003348749A external-priority patent/JP2005116760A/ja
Priority claimed from JP2003350972A external-priority patent/JP2005116886A/ja
Priority claimed from JP2003422353A external-priority patent/JP3907002B2/ja
Priority claimed from JP2004061740A external-priority patent/JP4386763B2/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200522289A publication Critical patent/TW200522289A/zh
Application granted granted Critical
Publication of TWI348748B publication Critical patent/TWI348748B/zh

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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW093130083A 2003-10-07 2004-10-05 Semiconductor device and method of fabricating the same TWI348748B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003348749A JP2005116760A (ja) 2003-10-07 2003-10-07 半導体装置及びその製造方法
JP2003350972A JP2005116886A (ja) 2003-10-09 2003-10-09 半導体装置の製造方法
JP2003422353A JP3907002B2 (ja) 2003-12-19 2003-12-19 半導体装置
JP2004061740A JP4386763B2 (ja) 2004-03-05 2004-03-05 半導体装置

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SG111935A1 (en) 2002-03-04 2005-06-29 Micron Technology Inc Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
US7528073B2 (en) * 2004-11-04 2009-05-05 Sumitomo Electric Industries, Ltd. Dry etching method and diffractive optical element
CN100447997C (zh) * 2005-09-28 2008-12-31 王忠诚 一种电子装置
JP2008034567A (ja) * 2006-07-27 2008-02-14 Fujitsu Ltd 半導体装置及びその製造方法
JP4919761B2 (ja) * 2006-10-27 2012-04-18 日東電工株式会社 配線回路基板および電子部品装置
US8592986B2 (en) * 2010-11-09 2013-11-26 Rohm Co., Ltd. High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device
US8513806B2 (en) * 2011-06-30 2013-08-20 Rohm Co., Ltd. Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device
EP2541593B1 (en) * 2011-06-30 2019-04-17 Rohm Co., Ltd. Laminated high melting point soldering layer
CN103021880B (zh) * 2011-09-22 2015-07-08 株式会社东芝 半导体装置的制造方法
JP5999041B2 (ja) * 2013-07-23 2016-09-28 株式会社デンソー 電子装置
US9756726B2 (en) * 2013-11-04 2017-09-05 Infineon Technologies Ag Electronic device and method of fabricating an electronic device
TW201613052A (en) * 2014-09-30 2016-04-01 Lingsen Precision Ind Ltd Packaging structure and packaging method without planar leads in all directions
KR102496483B1 (ko) * 2017-11-23 2023-02-06 삼성전자주식회사 아발란치 광검출기 및 이를 포함하는 이미지 센서
JP6950496B2 (ja) * 2017-11-28 2021-10-13 株式会社オートネットワーク技術研究所 回路基板及び回路基板の製造方法

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JP3437369B2 (ja) * 1996-03-19 2003-08-18 松下電器産業株式会社 チップキャリアおよびこれを用いた半導体装置
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CN1606152A (zh) 2005-04-13
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US20050073039A1 (en) 2005-04-07
US20060118940A1 (en) 2006-06-08

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