TWI348498B - - Google Patents
Info
- Publication number
- TWI348498B TWI348498B TW098120053A TW98120053A TWI348498B TW I348498 B TWI348498 B TW I348498B TW 098120053 A TW098120053 A TW 098120053A TW 98120053 A TW98120053 A TW 98120053A TW I348498 B TWI348498 B TW I348498B
- Authority
- TW
- Taiwan
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008157879 | 2008-06-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201009101A TW201009101A (en) | 2010-03-01 |
TWI348498B true TWI348498B (zh) | 2011-09-11 |
Family
ID=41434112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098120053A TW201009101A (en) | 2008-06-17 | 2009-06-16 | Bias sputtering apparatus |
Country Status (8)
Country | Link |
---|---|
US (1) | US20110100806A1 (zh) |
EP (1) | EP2302092B1 (zh) |
JP (1) | JP4503702B2 (zh) |
KR (1) | KR101036426B1 (zh) |
CN (1) | CN102066602B (zh) |
HK (1) | HK1153242A1 (zh) |
TW (1) | TW201009101A (zh) |
WO (1) | WO2009154196A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013147677A (ja) * | 2010-04-28 | 2013-08-01 | Ulvac Japan Ltd | 成膜装置 |
US10077207B2 (en) * | 2011-11-30 | 2018-09-18 | Corning Incorporated | Optical coating method, apparatus and product |
JP5939147B2 (ja) * | 2012-12-14 | 2016-06-22 | 東京エレクトロン株式会社 | 成膜装置、基板処理装置及び成膜方法 |
JP5727073B1 (ja) * | 2014-06-03 | 2015-06-03 | 株式会社シンクロン | 可搬型回転装置及び成膜装置 |
JP6019310B1 (ja) * | 2015-04-16 | 2016-11-02 | ナルックス株式会社 | 蒸着装置及び蒸着装置による成膜工程を含む製造方法 |
JP6533511B2 (ja) * | 2015-06-17 | 2019-06-19 | 株式会社シンクロン | 成膜方法及び成膜装置 |
CN110857464A (zh) * | 2018-08-24 | 2020-03-03 | 安徽纯源镀膜科技有限公司 | 一种新的真空镀膜设备的偏压系统 |
JP6845877B2 (ja) * | 2019-02-14 | 2021-03-24 | Towa株式会社 | ワーク保持部回転ユニット及び真空処理装置 |
EP3987079A4 (en) | 2019-06-24 | 2023-03-01 | TRUMPF Huettinger Sp. Z o. o. | PROCEDURE FOR ADJUSTING THE POWER OUTPUT OF A POWER SUPPLY FOR A PLASMA, PLASMA DEVICE AND POWER SUPPLY |
JP7111380B2 (ja) * | 2020-04-01 | 2022-08-02 | 株式会社シンクロン | スパッタ装置及びこれを用いた成膜方法 |
WO2022259368A1 (ja) * | 2021-06-08 | 2022-12-15 | 株式会社シンクロン | バイアス印加装置 |
CN117626201A (zh) * | 2023-12-01 | 2024-03-01 | 科廷表面科技(浙江)有限公司 | 一种dlc溅射等离子涂层工艺及涂层装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4893019A (en) * | 1987-05-27 | 1990-01-09 | Mitsubishi Denki Kabushiki Kaisha | Ion current generator system for thin film formation, ion implantation, etching and sputtering |
JPH0791645B2 (ja) * | 1989-04-28 | 1995-10-04 | 株式会社日立製作所 | 薄膜形成装置 |
JPH04305081A (ja) * | 1991-04-02 | 1992-10-28 | Hitachi Metals Ltd | セラミックス材料のメタライズ処理装置 |
JP3378043B2 (ja) * | 1993-03-05 | 2003-02-17 | 同和鉱業株式会社 | スパッタリング装置 |
JP3745790B2 (ja) * | 1995-05-15 | 2006-02-15 | 株式会社デンソー | 光情報記録媒体の製造装置及び製造方法 |
JP2002293427A (ja) | 2001-03-29 | 2002-10-09 | Sumitomo Electric Ind Ltd | 回転台車 |
EP1419285A4 (en) * | 2001-08-24 | 2009-08-19 | Nanonexus Inc | METHOD AND DEVICE FOR GENERATING UNIFORM ISOTROPIC VOLTAGES IN A SPOTTED FILM |
JP2007051337A (ja) * | 2005-08-18 | 2007-03-01 | Ulvac Japan Ltd | スパッタ電極及びスパッタ電極を備えたスパッタリング装置 |
CN100477147C (zh) * | 2006-03-16 | 2009-04-08 | 东京毅力科创株式会社 | 基板载置台及基板处理装置 |
-
2009
- 2009-06-16 CN CN2009801223663A patent/CN102066602B/zh not_active Expired - Fee Related
- 2009-06-16 JP JP2009546606A patent/JP4503702B2/ja active Active
- 2009-06-16 WO PCT/JP2009/060936 patent/WO2009154196A1/ja active Application Filing
- 2009-06-16 EP EP09766644.0A patent/EP2302092B1/en active Active
- 2009-06-16 TW TW098120053A patent/TW201009101A/zh unknown
- 2009-06-16 US US12/999,425 patent/US20110100806A1/en not_active Abandoned
- 2009-06-16 KR KR1020107028578A patent/KR101036426B1/ko active IP Right Grant
-
2011
- 2011-07-13 HK HK11107303.4A patent/HK1153242A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4503702B2 (ja) | 2010-07-14 |
CN102066602B (zh) | 2012-10-31 |
KR101036426B1 (ko) | 2011-05-23 |
KR20110014657A (ko) | 2011-02-11 |
EP2302092A4 (en) | 2014-05-14 |
WO2009154196A1 (ja) | 2009-12-23 |
EP2302092B1 (en) | 2015-12-23 |
TW201009101A (en) | 2010-03-01 |
HK1153242A1 (en) | 2012-03-23 |
CN102066602A (zh) | 2011-05-18 |
US20110100806A1 (en) | 2011-05-05 |
JPWO2009154196A1 (ja) | 2011-12-01 |
EP2302092A1 (en) | 2011-03-30 |