TWI346596B - Device and method for conditioning and monitoring of a saw blade - Google Patents

Device and method for conditioning and monitoring of a saw blade

Info

Publication number
TWI346596B
TWI346596B TW094113840A TW94113840A TWI346596B TW I346596 B TWI346596 B TW I346596B TW 094113840 A TW094113840 A TW 094113840A TW 94113840 A TW94113840 A TW 94113840A TW I346596 B TWI346596 B TW I346596B
Authority
TW
Taiwan
Prior art keywords
conditioning
monitoring
saw blade
saw
blade
Prior art date
Application number
TW094113840A
Other languages
Chinese (zh)
Other versions
TW200603938A (en
Inventor
Sprang Wilhelmus Gijsbertus Leonardus Van
T Veld Gerard Adriaan In
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of TW200603938A publication Critical patent/TW200603938A/en
Application granted granted Critical
Publication of TWI346596B publication Critical patent/TWI346596B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00Accessories specially designed for sawing machines or sawing devices
    • B23D59/001Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00Accessories specially designed for sawing machines or sawing devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Sawing (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
TW094113840A 2004-04-29 2005-04-29 Device and method for conditioning and monitoring of a saw blade TWI346596B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1026080A NL1026080C2 (en) 2004-04-29 2004-04-29 Device and method for conditioning and monitoring a saw blade.

Publications (2)

Publication Number Publication Date
TW200603938A TW200603938A (en) 2006-02-01
TWI346596B true TWI346596B (en) 2011-08-11

Family

ID=34967353

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113840A TWI346596B (en) 2004-04-29 2005-04-29 Device and method for conditioning and monitoring of a saw blade

Country Status (7)

Country Link
JP (1) JP2007534511A (en)
KR (1) KR101255692B1 (en)
CN (1) CN1956814B (en)
MY (1) MY159395A (en)
NL (1) NL1026080C2 (en)
TW (1) TWI346596B (en)
WO (1) WO2005105354A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548500B (en) * 2014-02-10 2016-09-11 The cutting knife position sensing means

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2967618B2 (en) * 1991-08-21 1999-10-25 株式会社東京精密 Blade position detector
DE69205786T2 (en) * 1991-08-21 1996-03-28 Tokyo Seimitsu Co Ltd Sheet position detection device.
JP3344733B2 (en) * 1991-10-11 2002-11-18 株式会社アマダ Chip removal equipment for sawing machines
CN1055649C (en) * 1994-10-31 2000-08-23 株式会社阿马达 Sawdust removing apparatus for sae machine
JP2955936B2 (en) * 1998-03-06 1999-10-04 株式会社東京精密 Dicing equipment
DE19905751A1 (en) * 1999-02-11 2000-08-31 Wacker Siltronic Halbleitermat Inner hole saw and method for adjusting a nozzle and a sensor of an inner hole saw relative to a saw blade of the inner hole saw
JP4590058B2 (en) * 2000-04-12 2010-12-01 株式会社ディスコ Cutting blade detection mechanism of cutting equipment
JP2002217135A (en) * 2001-01-19 2002-08-02 Disco Abrasive Syst Ltd Dicing saw
JP2002343746A (en) * 2001-05-14 2002-11-29 Tokyo Seimitsu Co Ltd Dicing apparatus with interlock
JP2002343745A (en) * 2001-05-14 2002-11-29 Tokyo Seimitsu Co Ltd Dicing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548500B (en) * 2014-02-10 2016-09-11 The cutting knife position sensing means

Also Published As

Publication number Publication date
KR20070015175A (en) 2007-02-01
KR101255692B1 (en) 2013-04-17
CN1956814B (en) 2011-09-07
NL1026080C2 (en) 2005-11-01
CN1956814A (en) 2007-05-02
MY159395A (en) 2016-12-30
WO2005105354A1 (en) 2005-11-10
TW200603938A (en) 2006-02-01
JP2007534511A (en) 2007-11-29

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