TWI346596B - Device and method for conditioning and monitoring of a saw blade - Google Patents
Device and method for conditioning and monitoring of a saw bladeInfo
- Publication number
- TWI346596B TWI346596B TW094113840A TW94113840A TWI346596B TW I346596 B TWI346596 B TW I346596B TW 094113840 A TW094113840 A TW 094113840A TW 94113840 A TW94113840 A TW 94113840A TW I346596 B TWI346596 B TW I346596B
- Authority
- TW
- Taiwan
- Prior art keywords
- conditioning
- monitoring
- saw blade
- saw
- blade
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sawing (AREA)
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1026080A NL1026080C2 (en) | 2004-04-29 | 2004-04-29 | Device and method for conditioning and monitoring a saw blade. |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200603938A TW200603938A (en) | 2006-02-01 |
TWI346596B true TWI346596B (en) | 2011-08-11 |
Family
ID=34967353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094113840A TWI346596B (en) | 2004-04-29 | 2005-04-29 | Device and method for conditioning and monitoring of a saw blade |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP2007534511A (en) |
KR (1) | KR101255692B1 (en) |
CN (1) | CN1956814B (en) |
MY (1) | MY159395A (en) |
NL (1) | NL1026080C2 (en) |
TW (1) | TWI346596B (en) |
WO (1) | WO2005105354A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI548500B (en) * | 2014-02-10 | 2016-09-11 | The cutting knife position sensing means |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2967618B2 (en) * | 1991-08-21 | 1999-10-25 | 株式会社東京精密 | Blade position detector |
DE69205786T2 (en) * | 1991-08-21 | 1996-03-28 | Tokyo Seimitsu Co Ltd | Sheet position detection device. |
JP3344733B2 (en) * | 1991-10-11 | 2002-11-18 | 株式会社アマダ | Chip removal equipment for sawing machines |
CN1055649C (en) * | 1994-10-31 | 2000-08-23 | 株式会社阿马达 | Sawdust removing apparatus for sae machine |
JP2955936B2 (en) * | 1998-03-06 | 1999-10-04 | 株式会社東京精密 | Dicing equipment |
DE19905751A1 (en) * | 1999-02-11 | 2000-08-31 | Wacker Siltronic Halbleitermat | Inner hole saw and method for adjusting a nozzle and a sensor of an inner hole saw relative to a saw blade of the inner hole saw |
JP4590058B2 (en) * | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | Cutting blade detection mechanism of cutting equipment |
JP2002217135A (en) * | 2001-01-19 | 2002-08-02 | Disco Abrasive Syst Ltd | Dicing saw |
JP2002343746A (en) * | 2001-05-14 | 2002-11-29 | Tokyo Seimitsu Co Ltd | Dicing apparatus with interlock |
JP2002343745A (en) * | 2001-05-14 | 2002-11-29 | Tokyo Seimitsu Co Ltd | Dicing device |
-
2004
- 2004-04-29 NL NL1026080A patent/NL1026080C2/en not_active IP Right Cessation
-
2005
- 2005-04-28 JP JP2007510639A patent/JP2007534511A/en active Pending
- 2005-04-28 WO PCT/NL2005/000318 patent/WO2005105354A1/en active Application Filing
- 2005-04-28 KR KR1020067021830A patent/KR101255692B1/en active IP Right Grant
- 2005-04-28 CN CN2005800134128A patent/CN1956814B/en active Active
- 2005-04-29 MY MYPI20051922A patent/MY159395A/en unknown
- 2005-04-29 TW TW094113840A patent/TWI346596B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI548500B (en) * | 2014-02-10 | 2016-09-11 | The cutting knife position sensing means |
Also Published As
Publication number | Publication date |
---|---|
KR20070015175A (en) | 2007-02-01 |
KR101255692B1 (en) | 2013-04-17 |
CN1956814B (en) | 2011-09-07 |
NL1026080C2 (en) | 2005-11-01 |
CN1956814A (en) | 2007-05-02 |
MY159395A (en) | 2016-12-30 |
WO2005105354A1 (en) | 2005-11-10 |
TW200603938A (en) | 2006-02-01 |
JP2007534511A (en) | 2007-11-29 |
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