TW200603938A - Device and method for conditioning and monitoring of a saw blade - Google Patents

Device and method for conditioning and monitoring of a saw blade

Info

Publication number
TW200603938A
TW200603938A TW094113840A TW94113840A TW200603938A TW 200603938 A TW200603938 A TW 200603938A TW 094113840 A TW094113840 A TW 094113840A TW 94113840 A TW94113840 A TW 94113840A TW 200603938 A TW200603938 A TW 200603938A
Authority
TW
Taiwan
Prior art keywords
saw blade
carrier
conditioning
monitoring
dispenser
Prior art date
Application number
TW094113840A
Other languages
Chinese (zh)
Other versions
TWI346596B (en
Inventor
Sprang Wilhelmus Gijsbertus Leonardus Van
T Veld Gerard Adriaan In
Original Assignee
Besi Singulation B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Singulation B V filed Critical Besi Singulation B V
Publication of TW200603938A publication Critical patent/TW200603938A/en
Application granted granted Critical
Publication of TWI346596B publication Critical patent/TWI346596B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Abstract

The invention relates to a device for separating electronic components mounted on a carrier, comprising: a rotatable saw blade with a substantially circular cutting edge, at least one sensor for detecting the substantially circular cutting edge, and a dispenser for a medium, wherein the sensor and the dispenser are assembled on a joint carrier, which joint carrier is displaceable along a guide relative to the saw blade. The invention also relates to a method for separating electronic components mounted on a carrier.
TW094113840A 2004-04-29 2005-04-29 Device and method for conditioning and monitoring of a saw blade TWI346596B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1026080A NL1026080C2 (en) 2004-04-29 2004-04-29 Device and method for conditioning and monitoring a saw blade.

Publications (2)

Publication Number Publication Date
TW200603938A true TW200603938A (en) 2006-02-01
TWI346596B TWI346596B (en) 2011-08-11

Family

ID=34967353

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113840A TWI346596B (en) 2004-04-29 2005-04-29 Device and method for conditioning and monitoring of a saw blade

Country Status (7)

Country Link
JP (1) JP2007534511A (en)
KR (1) KR101255692B1 (en)
CN (1) CN1956814B (en)
MY (1) MY159395A (en)
NL (1) NL1026080C2 (en)
TW (1) TWI346596B (en)
WO (1) WO2005105354A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548500B (en) * 2014-02-10 2016-09-11 The cutting knife position sensing means

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2967618B2 (en) * 1991-08-21 1999-10-25 株式会社東京精密 Blade position detector
DE69205786T2 (en) * 1991-08-21 1996-03-28 Tokyo Seimitsu Co Ltd Sheet position detection device.
JP3344733B2 (en) * 1991-10-11 2002-11-18 株式会社アマダ Chip removal equipment for sawing machines
CN1055649C (en) * 1994-10-31 2000-08-23 株式会社阿马达 Sawdust removing apparatus for sae machine
JP2955936B2 (en) * 1998-03-06 1999-10-04 株式会社東京精密 Dicing equipment
DE19905751A1 (en) * 1999-02-11 2000-08-31 Wacker Siltronic Halbleitermat Inner hole saw and method for adjusting a nozzle and a sensor of an inner hole saw relative to a saw blade of the inner hole saw
JP4590058B2 (en) * 2000-04-12 2010-12-01 株式会社ディスコ Cutting blade detection mechanism of cutting equipment
JP2002217135A (en) * 2001-01-19 2002-08-02 Disco Abrasive Syst Ltd Dicing saw
JP2002343746A (en) * 2001-05-14 2002-11-29 Tokyo Seimitsu Co Ltd Dicing apparatus with interlock
JP2002343745A (en) * 2001-05-14 2002-11-29 Tokyo Seimitsu Co Ltd Dicing device

Also Published As

Publication number Publication date
KR20070015175A (en) 2007-02-01
CN1956814B (en) 2011-09-07
KR101255692B1 (en) 2013-04-17
MY159395A (en) 2016-12-30
CN1956814A (en) 2007-05-02
WO2005105354A1 (en) 2005-11-10
JP2007534511A (en) 2007-11-29
NL1026080C2 (en) 2005-11-01
TWI346596B (en) 2011-08-11

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