MY159395A - Device and method for conditioning and monitoring of a saw blade - Google Patents

Device and method for conditioning and monitoring of a saw blade

Info

Publication number
MY159395A
MY159395A MYPI20051922A MYPI20051922A MY159395A MY 159395 A MY159395 A MY 159395A MY PI20051922 A MYPI20051922 A MY PI20051922A MY PI20051922 A MYPI20051922 A MY PI20051922A MY 159395 A MY159395 A MY 159395A
Authority
MY
Malaysia
Prior art keywords
saw blade
carrier
conditioning
monitoring
dispenser
Prior art date
Application number
MYPI20051922A
Inventor
Sprang Wilhelmus Gijsbertus Leonardus Van
Veld Gerard Adriaan In't
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of MY159395A publication Critical patent/MY159395A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00Accessories specially designed for sawing machines or sawing devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00Accessories specially designed for sawing machines or sawing devices
    • B23D59/001Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Sawing (AREA)
  • Dicing (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

THE INVENTION RELATES TO A DEVICE FOR SEPARATING ELECTRONIC COMPONENTS (14) MOUNTED ON A CARRIER, COMPRISING: A ROTATABLE SAW BLADE (2) WITH A SUBSTANTIALLY CIRCULAR CUTTING EDGE (11), AT LEAST ONE SENSOR (12) FOR DETECTING THE SUBSTANTIALLY CIRCULAR CUTTING EDGE (11), AND A DISPENSER FOR A MEDIUM, WHEREIN THE SENSOR (12) AND THE DISPENSER ARE ASSEMBLED ON A JOINT CARRIER, WHICH JOINT CARRIER IS DISPLACEABLE ALONG A GUIDE (5) RELATIVE TO THE SAW BLADE (2). THE INVENTION ALSO RELATES TO A METHOD FOR SEPARATING ELECTRONIC COMPONENTS (14) MOUNTED ON A CARRIER.
MYPI20051922A 2004-04-29 2005-04-29 Device and method for conditioning and monitoring of a saw blade MY159395A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1026080A NL1026080C2 (en) 2004-04-29 2004-04-29 Device and method for conditioning and monitoring a saw blade.

Publications (1)

Publication Number Publication Date
MY159395A true MY159395A (en) 2016-12-30

Family

ID=34967353

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20051922A MY159395A (en) 2004-04-29 2005-04-29 Device and method for conditioning and monitoring of a saw blade

Country Status (7)

Country Link
JP (1) JP2007534511A (en)
KR (1) KR101255692B1 (en)
CN (1) CN1956814B (en)
MY (1) MY159395A (en)
NL (1) NL1026080C2 (en)
TW (1) TWI346596B (en)
WO (1) WO2005105354A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548500B (en) * 2014-02-10 2016-09-11 The cutting knife position sensing means

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69205786T2 (en) * 1991-08-21 1996-03-28 Tokyo Seimitsu Co Ltd Sheet position detection device.
JP2967618B2 (en) * 1991-08-21 1999-10-25 株式会社東京精密 Blade position detector
JP3344733B2 (en) * 1991-10-11 2002-11-18 株式会社アマダ Chip removal equipment for sawing machines
CN1055649C (en) * 1994-10-31 2000-08-23 株式会社阿马达 Sawdust removing apparatus for sae machine
JP2955936B2 (en) * 1998-03-06 1999-10-04 株式会社東京精密 Dicing equipment
DE19905751A1 (en) * 1999-02-11 2000-08-31 Wacker Siltronic Halbleitermat Inner hole saw and method for adjusting a nozzle and a sensor of an inner hole saw relative to a saw blade of the inner hole saw
JP4590058B2 (en) * 2000-04-12 2010-12-01 株式会社ディスコ Cutting blade detection mechanism of cutting equipment
JP2002217135A (en) * 2001-01-19 2002-08-02 Disco Abrasive Syst Ltd Dicing saw
JP2002343746A (en) * 2001-05-14 2002-11-29 Tokyo Seimitsu Co Ltd Dicing apparatus with interlock
JP2002343745A (en) * 2001-05-14 2002-11-29 Tokyo Seimitsu Co Ltd Dicing device

Also Published As

Publication number Publication date
KR20070015175A (en) 2007-02-01
TWI346596B (en) 2011-08-11
KR101255692B1 (en) 2013-04-17
TW200603938A (en) 2006-02-01
CN1956814A (en) 2007-05-02
NL1026080C2 (en) 2005-11-01
CN1956814B (en) 2011-09-07
WO2005105354A1 (en) 2005-11-10
JP2007534511A (en) 2007-11-29

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