TWI344190B - Apparatus of transferring semiconductor package - Google Patents

Apparatus of transferring semiconductor package Download PDF

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Publication number
TWI344190B
TWI344190B TW096145307A TW96145307A TWI344190B TW I344190 B TWI344190 B TW I344190B TW 096145307 A TW096145307 A TW 096145307A TW 96145307 A TW96145307 A TW 96145307A TW I344190 B TWI344190 B TW I344190B
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TW
Taiwan
Prior art keywords
shaft
cylinder
motor
semiconductor package
extractor
Prior art date
Application number
TW096145307A
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Chinese (zh)
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TW200834791A (en
Inventor
Ssang-Gun Lim
Sang-Yoon Lee
Seung-Gyu Ko
Sung-Yong Kang
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Intekplus Co Ltd
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Application filed by Intekplus Co Ltd filed Critical Intekplus Co Ltd
Publication of TW200834791A publication Critical patent/TW200834791A/en
Application granted granted Critical
Publication of TWI344190B publication Critical patent/TWI344190B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Description

1344190 九 、發明說明: 【發明所屬之技術領域】 本發明係有關-半導體封 體封裝結構輸钱置,其中該,導 提升裝置與-撿出ϋ旋魏置㈣卜撿出碰_一撿出器 導體封裝結構的撿出與旋轉,;為Γ體’以同時地執行半 以各種肢旋轉。 撿“可稭由-馬達的運作 【先前技術】1344190 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a semiconductor package package structure in which money is placed, wherein the guide lifting device and the 捡 ϋ 魏 魏 (4) 捡 捡 _ _ _ _ The ejection and rotation of the conductor package structure; is the Γ body' to simultaneously perform half-rotation of various limbs.捡 “The operation of the straw-motor” [Prior Art]

m導體封裝結翻製造基本上是由-晶圓f造 (fabrication,FAB)流程(以下辎Α , 圓表化 办占.rAQ & (下%為从8流程)與一組裝流程所 儿成。在FAB流財,龍電路係 斤The fabrication of the m-conductor package is basically made up of a wafer fabrication (FAB) process (hereinafter, round table processing, rAQ & (the lower % is from 8 processes) and an assembly process). In the FAB, the dragon circuit is

, ^^(JeadfJ;}^^J =體晶片,為了讓轉體W與導線架之間可以導電,會以 丁,接合一 bonding)或者是以焊接形成焊錫球,接著會使用 像,乳樹脂來進行製模運作(m〇lding 〇perati〇n),以取得 體帶(semiconductor strip)。 ’, ^^(JeadfJ;}^^J = body wafer, in order to make the rotating body W and the lead frame conductive, it will be bonded, or bond to form a solder ball, then use the image, milk resin To perform the molding operation (m〇lding 〇perati〇n) to obtain a semiconductor strip. ’

/斤取得料導體帶會由帶撿㈣啤pi*携送至 ^ ^構而由切割11將半導體帶切割為數個彼此駐的半導體封 半導體封裝結構會經由許多種測試來分類,並且進行封裝 流程(packing process)。半導體封裝結構的一個缺點是導線_ 焊錫球即使受龍微的外部縣也會輕易變形或損壞,在接下 來的電子檢财或者是在組設到基板上時容祕觸不良。為 7 此, 中, 此,有必要將半導顯裝結構置3 中’托盤具有適合放置導線的容器 的形狀與大小。 構置放在一個像是托盤(tray)的盒 6容器,以及如同半導體封裝結構 旦半導體封裝結構被存放在托盤令,/ / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / (packing process). One disadvantage of the semiconductor package structure is that the wire _ solder balls can be easily deformed or damaged even in the outer county of Longwei, and the electronic charge is not good when it is assembled on the substrate. For this, in the middle, it is necessary to place the semi-conductive display structure in the 'tray' with the shape and size of the container suitable for placing the wire. Constructed in a box 6 container like a tray, and as in a semiconductor package structure, the semiconductor package structure is stored in a tray order,

夕於ϋ ϋ ^來撿出與輸送半導體封裝結構的搬運機(h an d 1 er) 「’器她,已經揭示於韓國註冊專利第㈣·6號名為 上用以同。列輸送半導體裝置之軸向可旋轉氣動式撿出器,使用 该撿出器之撿出器模組及半導體儀器輸送之方法 (PIVOTALLY-ROTATABLE PNEUMATIC PICKER FOR IN LINE TRANSFER 〇F SEMICONDUCTOR DEVICE, PICKER MODULE USING THE PICKER, AND SEMICONDUCTOR DEVICE TRANSFER METHOD)」一案 第一圖所不為如韓國註冊專利第0580816號之一具有軸 向可旋轉的氣動式撿出器之撿出器模組的立體圖。第 二圖所示 為第一圖之軸向可旋轉的氣動式撿出器的立體圖,而第三圖所 示為沿著第二圖的A_A,線段之剖面圖。 參考圖表’傳統的撿出器模組包括複數個汽缸體10,該 等汽缸體1〇各具有一樞軸(pivot shaft)20、用以引導個別汽缸 體10垂直運動的汽缸導槽(cy丨丨nderguide)3〇、一模組主體4〇、 以及一伺服馬達50。該模組主體4〇的前表面具有複數個可水 1344190 • 平移動的垂直棒42。每一個汽缸導槽30係耦接至對應的垂直 棒42 °相鄰的垂直棒42之間的距離可由伺服馬達5〇加以調 . 整。 , 同樣地,軸向可旋轉的氣動式撿出器包括汽缸體10 ,樞 轴20 ’升>成於汽缸體1〇内的第一與第二抽向氣動皡丨丨、12, 用以引進壓縮空氣以提供柩軸20所用的旋轉驅動力,一第一 引導軸31垂直地穿透汽缸體丨〇並内含_第一氣動通道32 , 一第二引導軸33垂直地穿透該汽缸體10並内含一第二氣動 Φ 通道料’ 缸導槽30與第一引導軸31及第二引導軸33 辆接以引導忒A缸體10的垂直運動。具有上述的組態配置之 軸向可旋轉的氣動式撿出器,係經由第—及第二引導軸31、 33所構成的第-與第二通道32、34所輪送的壓縮空氣驅動 而垂直移動。 第三圖所示的樞軸20係位於一球體定位器丨3中。球體 定位器13具有-密封部份13a,以便分隔第一與第二抽向氣 ,腔11a、12a,以及一容納球體丨4的球體支撐孔]3b。球體 • 定位器〗3係由一球體直線導槽(ball rectilinear guide)15所圍 繞。球體直線導槽丨5具有直線引導溝槽15a,形成於球體直 線導槽15對應個別球體定位器13的球體支稽孔I%之位 置。第-與第二軸向氣動腔Ua、12a係分別連接第一與第二 軸向氣動i皐U、丨2 ’使得驗空氣可經由第—與第二轴向氣 動埠^、12送進第一與第二軸向氣動腔Ua、丨2a。拖軸如 的下端具有一吸取襯墊(suddng㈣22,用來吸取半導體封裳 9 1344190 結構60。 樞軸20的表面具有軸向引導溝槽(圖中未顯示)。被容 納於球體定位器13的球體支樓孔13b之球體14,係可根據 直線引導溝槽15a的引導而垂直地移動。 在上述的組態配置下,如果壓縮空氣被灌進汽缸體〗〇, 被容納於球體定位器13的球體支撐孔13b之球體14,玎沿 著直線引導溝槽丨5a的引導而垂直地移動,而球體14的垂直夕于ϋ ϋ ^To pick up and transport the semiconductor package structure of the carrier (h an d 1 er) "', she has been disclosed in the Korean registered patent (4) · 6 named the same as the same. Axial rotatable pneumatic extractor, use of the extractor module of the extractor and semiconductor instrument delivery method (PIVOTALLY-ROTATABLE PNEUMATIC PICKER FOR IN LINE TRANSFER 〇F SEMICONDUCTOR DEVICE, PICKER MODULE USING THE PICKER, AND The first picture of the SEMICONDUCTOR DEVICE TRANSFER METHOD) is not a perspective view of an extractor module having an axially rotatable pneumatic extractor as one of Korean registered patent No. 0580816. The second figure shows a perspective view of the axially rotatable pneumatic extractor of the first figure, and the third figure shows a section along the line A_A of the second figure. Reference to the chart 'The conventional extractor module includes a plurality of cylinder blocks 10 each having a pivot shaft 20 for guiding the vertical movement of the individual cylinder blocks 10 (cy丨)丨nderguide) 3〇, a module body 4〇, and a servo motor 50. The front surface of the module body 4 has a plurality of horizontally movable bars 42 that can be moved 1344190. The distance between each of the cylinder guides 30 coupled to the corresponding vertical rods 42 and the adjacent vertical rods 42 can be adjusted by the servo motor 5〇. Similarly, the axially rotatable pneumatic extractor comprises a cylinder block 10, the pivot 20' liters> first and second drawn pneumatic cymbals 12 formed in the cylinder block 1 , Compressed air is introduced to provide a rotational driving force for the boring shaft 20, a first guiding shaft 31 vertically penetrates the cylinder block and contains a first pneumatic passage 32, and a second guiding shaft 33 vertically penetrates the cylinder The body 10 includes a second pneumatic Φ channel material. The cylinder guide groove 30 is coupled to the first guide shaft 31 and the second guide shaft 33 to guide the vertical movement of the 忒A cylinder 10. An axially rotatable pneumatic extractor having the configuration configuration described above is driven by compressed air carried by the first and second passages 32, 34 of the first and second guide shafts 31, 33 Move vertically. The pivot 20 shown in the third figure is located in a ball positioner 丨3. The ball positioner 13 has a sealing portion 13a for partitioning the first and second suctioning air, the chambers 11a, 12a, and a ball supporting hole 3b for accommodating the ball 丨4. The sphere • positioner 3 is surrounded by a ball rectilinear guide 15. The spherical linear guide groove 5 has a linear guide groove 15a formed at a position where the spherical straight guide groove 15 corresponds to the spherical branch hole I% of the individual ball positioner 13. The first and second axial pneumatic chambers Ua, 12a are respectively connected to the first and second axial pneumatics 皋U, 丨2' so that the test air can be fed through the first and second axial pneumatic 埠, 12 And a second axial pneumatic chamber Ua, 丨 2a. The lower end of the trailing shaft has a suction pad (suddng (four) 22 for sucking the semiconductor seal 9 1344190 structure 60. The surface of the pivot 20 has an axial guiding groove (not shown). It is accommodated in the ball positioner 13 The ball 14 of the ball strut hole 13b is vertically movable according to the guidance of the linear guide groove 15a. In the above configuration configuration, if compressed air is poured into the cylinder block, it is accommodated in the ball positioner 13 The ball 14 of the spherical support hole 13b, the crucible moves vertically along the guide of the linear guide groove 丨5a, and the vertical of the sphere 14

運動會使得樞軸20在行經直線引導溝槽〗5a時,在適當的地 方旋轉。 ^上述前案的問題在於具有第一與第二氣動通道32、34之 第與第一引導軸31、33實質上必須位於汽缸體丨〇内,以 便將[縮工氣4進汽缸體⑴中’而垂直地移動汽缸體川, 如此來,汽缸體1〇就沒有辦法變得纖細。 考題是,她%的鋪驗是由配置在球體定位 :所:=體種支=舆球體-間的預設_The movement causes the pivot 20 to rotate in place as it travels through the linear guide groove 5a. The problem with the above premise is that the first and second guide shafts 31, 33 having the first and second pneumatic passages 32, 34 must substantially be located in the cylinder bore so as to [reducing the gas 4 into the cylinder block (1) 'When the cylinder block is moved vertically, there is no way for the cylinder block 1 to become slim. The test question is that her % of the test is arranged by the ball in the positioning::: = body branch = 舆 ball - between the presets _

置組態配置。 又口此上述刖案具有複雜的裝 緣是,本發明人有感上述缺失 計合理且纽料上频从 L ’耻料-種設 f發明内容】 本發明的―個目的是提供—種半導體封裝結構輸送裝 置,其中一 &山σσ . 由 a只出器(Pkker)係與一缸桿(cylinderrod)為一體,藉 ^虹桿的向上與向下運動而垂直地移動,同時藉由-馬達的 旋轉而㈣’纽該撿出11可由控制馬達的運作而以各種角度 置,的另—目的是提供—種半導體封裝結構輸送裝 _Γ.,檢出器的旋轉與垂直運動係利用緊密圍繞著撿出 ^ P er Shaft)的衝程線性軸襯(str〇ke丨inear bush)加以引 如需要使用前案中的氣動壓力導人間隙,因此可達到 扞梯二Γ5的裝置’而撿出11的旋轉錢直運動可同時執 仃,使得撿出器可以高速運作。 健上述以及其他目的可藉由提供—種半導體 出裝置來完成’其中該設備包含:複數個用以撿 體封料结構的撿出器模組’用以輸送該半導 體封虞結構,其中每—個撿出 附接至該垂直托架的—下m Μ 03 [1托木, σ之缸體,一穿透該缸體並具有一 :==,旱,藉由該缸桿的向上與向下運動以 地減^叫座域並無缸桿座一體 ,接之撿出器,以便根據該虹桿座的垂直運動而=二 -體地組設於該缸體的頂端 出器。 *曰由—馬達的運作以旋轉該撿 嫌該檢Λ器可包含:一檢出器轴’其具有一形成於其中之穿 孔__如),用以引進與排放空氣;以及一被組設於該=Set the configuration configuration. In addition, the inventor of the present invention has a complicated relationship, and the present inventors have sensed that the above-mentioned missing factor is reasonable and that the upper frequency of the material is from the L's shame-species. The invention aims to provide a semiconductor. The package structure conveying device, wherein a & mountain σσ. is integrated with a cylinder rod by a pkker system, and moves vertically by the upward and downward movement of the i-rod, and by means of - The rotation of the motor and (4) 'News' 11 can be set at various angles by controlling the operation of the motor, and the other purpose is to provide a semiconductor package structure transport device. The rotation and vertical motion of the detector are closely utilized. The stroke linear bushing (str〇ke丨inear bush) around the P Shaft) is used to introduce the pneumatic pressure guiding gap in the previous case, so that the device of the ladder 2 can be reached. The 11-rotating movement of the money can be performed at the same time, so that the extractor can operate at high speed. The above and other objects can be accomplished by providing a semiconductor device that includes: a plurality of device modules for a body seal structure for transporting the semiconductor package structure, wherein each - Attached to the vertical bracket - lower m Μ 03 [1 pallet, σ cylinder, one penetrates the cylinder and has a: ==, drought, by the upward and upward direction of the cylinder rod The lower movement is not integrated with the cylinder rod seat, and the extractor is connected to the top end of the cylinder according to the vertical movement of the rainbow rod seat. The operation of the motor to rotate the detector may include: a detector shaft 'having a perforation formed therein __, for example, for introducing and discharging air; and a set In the =

2器軸的上部之旋轉接頭(rotating joint),其中該旋轉裝置包 3 ’―作為該馬達的一驅動軸之馬達軸(motor shaft); —被配 置用以圍繞s亥馬達袖之旋轉軸’並被一組設於一馬達座上之車由 承所圍繞,從而在該馬達軸旋轉的同時一起旋轉;一被安裝以 雜轉軸的第一正時滑輪(timing puUey) ’從而在該旋轉軸 =轉的同時—起旋轉·,—被安裝以圍繞該撿出器㈣第二正時 $ ;,以及—與該第—正時·及鮮二正時滑輪連接之正時 從而在°亥第一正時滑輪旋轉的同時旋轉該第二正時滑 外可包含:—被置人該缸桿座並被配置用以圍繞 出Ί軸之第—旋轉軸承(__ beaHng),從而引導該檢 哭^ 紋轉,—被置入該馬達座並被配置用以圍繞該撿出 i田*之第—旋轉轴承,從而引導該撿出器軸的旋轉;一被配 體=圍繞該撿出器軸並透過她體的—下端而被置入該紅 向上及生:T引導該撿出器軸的同時旋轉與a rotating joint of an upper portion of the two shafts, wherein the rotating device package 3' is a motor shaft that serves as a drive shaft of the motor; - is configured to surround a rotating shaft of the s-motor sleeve And a set of vehicles disposed on a motor base is surrounded by the bearing to rotate together while the motor shaft rotates; a first timing pulley (timing puUey) is mounted on the rotating shaft so that the rotating shaft = at the same time - the rotation -, is installed around the second (4) second timing $;, and - the timing of the connection with the first - timing and fresh two timing pulley Rotating the second timing slip while rotating the timing pulley may include: - being placed on the cylinder rod seat and configured to surround the first rotating bearing (__ beaHng) of the exit shaft, thereby guiding the crying ^ 纹转,- is placed into the motor seat and configured to surround the first-rotating bearing of the i-field* to guide the rotation of the diverter shaft; a ligand = around the dipper shaft And is placed into the red upwards and through the lower end of her body: T guides the axis of the extractor Rotation with

引導該體的第二衝程線性軸觀,從而 /X出益軸的同時旋轉與向上及向下運動。 運動該垂直托架可包含—感測器,用以感測撿出ϋ的-向上 下有進:步瞭解本發明之特徵及技術内容,請參閱以 說明用,㈣之袖侧與附圖,然而所關式僅提供參考與 並非用來對本發明加以限制者。 12 1344190 【實施方式】 以下將參考附錄的圖表詳細說明本發明的較佳實施例。兑 中有關難實施例的敘述將詳細呈現,讓熟悉此技藝者可料 了解與貫現本發明。 第四圖所示為根據本發_半導體縣結構輸送楚置 -部分的立體圖,而第五騎示為根 梦 結構輸送裝置的撿出器模組主體之立體圖。々丰¥體封裝The second stroke linear axis of the body is guided so that the /X output shaft rotates simultaneously and upwards and downwards. Moving the vertical bracket may include a sensor for sensing the pop-up - up and down: step by step to understand the features and technical contents of the present invention, please refer to the sleeve, and (4) the sleeve side and the drawing. However, the disclosure is only for reference and is not intended to limit the invention. 12 1344190 [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings of the Appendix. The description of the difficult embodiments will be presented in detail, and it will be apparent to those skilled in the art. The fourth figure shows a perspective view of a portion of the semiconductor device according to the present invention, and the fifth ride is shown as a perspective view of the body of the extractor module of the root dream structure transport device. 々丰¥ body package

半導體封技構輸送裝置包括—撿出H模組主體100, =以撿出歧轉—半導體域結構,崎㈣水平輸送半導 體封裝結構。接著,彳;|數個ψ @ / q 机於柃4^ 複數個檢出綠組200係以相同間隔組 =撿出减組主體】〇〇之上。圓中可明顯地看^ 模組主體_進-步包括—咖調整 2 出器模組200之間的間隔。 ㈣雕撿 第六圖所示為第五圖中的撿出器模組的立體圖,第 為第六圖的純圖’而第八圖為第六圖之分解立體圖。㈤ 參考第六圖與第七圖,根據本發明的每—個檢 包括-垂直絲㈣ical bracket)21〇。同樣地出= 組綱包括—缸體勝—缸桿座230、-虹桿24(^ j 撿出器250組設於每一垂直托架2〗〇上。 該垂直托架2丨0係位於該撿出器模組主體⑽的表面, 而缸體220係附接於該垂直把架21〇的表面的下被。 該缸桿座230係連接至缸體22〇的下端 = 缸桿240及撿出器250 —體地搞接。 于压230與 該缸桿240穿透缸體220並具有一下端置入且固定於該 埠222 為了讓缸桿240上下運動,缸體22〇具有形成於缸體22〇 則表面之一第一氣動埠(pneumat丨c p〇rt)22i與一第二氣動 该撿出器250與缸桿座23〇及缸桿24〇 一體地搞接,藉 ^桿的上下運動而垂直地移動。因此,根據本發明的 撿出器模組跡需秘升裝置缝直軸撿丨器—, 且可具有纖細的組態設置。 為了藉由吸力來撿出半導體封裝結構3GG,該撿出器250 包括一撿出器軸251,其具有一形成於其中之穿孔 (through如re),用以引進與排放空氣,一祕至檢出器轴251 的上部之旋轉接頭252,以及耗接至撿出器軸251的下端並 用 =透過真空吸力撿出及放置半導體聽結構3⑻之一抽吸 官嘴(suction nozzle)253。撿出器軸251根據缸桿24〇的上下 運動,在缸體220内垂直地運動。 該旋轉接頭252係用來連接一空氣管(未顯示於圖中), 用以將空氣灌進撿出H軸251的穿孔,或者將空氣由撿出器 轴251中抽出來。為了減少空氣管(未顯示於圖中)扭曲的 問題’旋轉接頭252具有—固定上部與一可旋轉的下部。 就本發明的-特徵型態來說,藉由馬達26〇的運作來旋 轉撿出器250的-旋轉敦置27〇,係一體地組設於缸體22〇 的頂端。 1344190 . 儘管〉又有顯示於圖中,但是較佳地,馬達260容納一編 碼器,用以感測馬達260每分鐘的轉動次數。 旋轉裝置270包括一馬達軸27卜一旋轉軸272、一第一 正時滑輪273、一第二正時滑輪274以及一正時皮帶275。 該馬達軸271係作為馬達26〇的一旋轉軸272,並具有 修長的形狀。該旋轉軸272係用來圍繞修長的馬達軸271, 用以提供足夠的旋轉力給馬達軸271。該旋轉軸272係由組 設於一馬達座261上之軸承276所圍繞,也就是說,旋轉軸 • 272係用來加強馬達26〇的旋轉力。 έ亥第一正時滑輪273係被配置用以圍繞旋轉軸272,並 與旋轉軸272同時旋轉。 該第二正時滑輪274係被配置用以圍繞該撿出器軸 25卜第二正時滑輪274係藉由正時皮帶275與第一正時滑輪 273連接,並與第一正時滑輪273同時旋轉。 在上述的組態配置中,如果馬達軸271經由馬達26〇的 運作而旋轉,則旋轉軸272會同時旋轉。 _ If此,圍繞旋轉軸奶的第一正時滑輪π會與旋轉轴 272同時旋轉,而藉由正時皮帶2乃與第一正時滑輪連 接的第二正時滑輪274會與第一正時滑輪奶同時旋轉。因 此,被第二正時滑輪274圍繞的撿出器軸252會跟著旋轉。 a在本發明中,由於旋轉裝置270利用馬達26〇的運作來 碇轉撿出器軸251 ’因此撿出器25〇可具有各種旋轉角度。 如稍早的先别技術的章節所述,傳統撿出器軸係以氣動 於‘出度’在旋轉的角度上有限制。此外’由 較不具有精Ϊ度:齒2=轉’在旋轉位置的控制上 t 的運作加以控制,而撿出器-可以各種角度旋 為Β進-步包括—第—旋轉轴承2Μ、 255:=f性._以及-第二衝程 承255被置I馬^ 254被置入缸桿座230 ’而第二旋轉軸 圍繞撿出器㈣,以引導丄;: 該撿出器軸251係藉由第二正時滑輪274帶 =5; 承254與第二旋轉軸承255會支撐撿 出益轴251的重i ’以便引導撿出器軸251旋轉。 =第1程線性軸襯况與第二衝程線性軸襯257係被 =用以·撿㈣軸25丨,並用則丨導撿㈣軸251的上 :運^和撿出器轴251的旋轉。第—衝程線性軸襯况係透 220的下端被置入缸體220,而第二衝程線性軸襯257 透過缸體220的上端也被置入虹體22〇。 ,由使用第-衝程線性轴襯祝與第二衝程線性轴概 二時地引導撿出器軸251的直線運動和旋轉,撿出器 可達到更大的接觸面積,讓旋轉精確度也更為提升。 此外’該撿出减251在垂直移動的同時可以旋轉,使得撿 1344190 出器軸25丨可以高速運作。 此外,上述傳統氣動式旋 導入間隙,造成低旋轉精確度==轴需要有氣動勤 據本發明,利用圍繞撿出器輪⑸乂知设備尺寸。反之,根 以引導撿出器㈣】的上下運動和^程、=性軸襯256、257 也較先别技術的撿出器來得纖細與輕巧。戶斤製成的撿出器 同時,該垂直托架2】〇可 Φ 撿出器250的向上運動。 感挪器211,用以感測 接著將概要地敘述根據本發 置的運作。 體封裝結構輸送裝 錢’㈣要錄㈣半物峨 用該撿出器模、组主體⑽上的種類,利 移動至—半她胞構 2=^域⑽會被水平 接下來,控制壓縮空氣以灌進第一鱼 從,讓壓縮空氣在缸桿24〇内向勤,;乳動蜂221與 向下移動。 ,糟此讓虹桿座230 藉由緊密圍繞該撿出器軸25丨的卜 向下運動,雜嶋25丨細^==230的 撿出高度為止。 朗接觸到所需的 ,後,將空氣吸進撿出器轴251在向下移動時所 匕中,讓撿出器250可撿出半導體封裝結構3〇〇。y 同時’如果需要改變被撿出的半導體封裝結構3⑻的方 1344190 向,則可藉由控制馬達260 轉角度。 f賣輸送運作6屬習知技術,耻砰詳細說明。 送裝置出’本發明所揭示的半導體封裝結構輸 第了 ’根據本發明,撿出器25G係與—缸桿鳩一體地 而根據缸桿24G的上下運動而垂直地移動,同時藉The semiconductor package technology transport device comprises: a H module body 100, a semiconductor structure, and a semiconductor package structure. Then, 彳;|Several ψ @ / q machine in 柃4^ plural check out green group 200 series with the same interval group = 捡 减 减 减 主体 。 。 。 In the circle, it can be clearly seen that the module body _ step-by-step includes the interval between the two modules 200. (4) Engraving The sixth figure shows a perspective view of the extractor module in the fifth figure, the sixth figure is a pure figure ' and the eighth figure is an exploded perspective view of the sixth figure. (V) Referring to the sixth and seventh figures, each of the inspections according to the present invention includes an ical bracket 21 〇. Similarly, the group includes - the cylinder wins - the cylinder rod holder 230, and the rainbow rod 24 (the ^ j extractor 250 is set on each of the vertical brackets 2). The vertical bracket 2丨0 is located. The surface of the body of the dipper module (10), and the cylinder 220 is attached to the lower surface of the vertical frame 21A. The cylinder rod holder 230 is connected to the lower end of the cylinder block 22 = the cylinder rod 240 and The ejector 250 is integrally formed. The pressure cylinder 230 and the cylinder rod 240 penetrate the cylinder 220 and have a lower end inserted therein and fixed to the cymbal 222. In order to move the cylinder rod 240 up and down, the cylinder block 22 has a The cylinder body 22 has a first pneumatic 埠 (pneumat 丨 〇 〇 )) 22i and a second pneumatic plucking device 250 integrally connected with the cylinder rod holder 23 〇 and the cylinder rod 24 , The up and down movement moves vertically. Therefore, the extractor module trace according to the present invention requires a secret device to sew a straight axis device - and can have a slim configuration setting. In order to extract the semiconductor package by suction Structure 3GG, the extractor 250 includes a dipper shaft 251 having a through hole (through, such as re) formed therein for introducing and discharging air, The rotary joint 252 to the upper portion of the detector shaft 251, and the lower end of the output shaft 251, and the suction nozzle 253 are extracted by the vacuum suction force and the semiconductor listening structure 3 (8). The output shaft 251 moves vertically within the cylinder 220 according to the up and down movement of the cylinder rod 24〇. The rotary joint 252 is used to connect an air tube (not shown) for injecting air into the outlet H. The perforation of the shaft 251, or the extraction of air from the dipper shaft 251. To reduce the problem of distortion of the air tube (not shown), the rotary joint 252 has a fixed upper portion and a rotatable lower portion. In the case of the characteristic type, the rotation of the extractor 250 is rotated by the operation of the motor 26〇, and is integrally assembled on the top end of the cylinder block 22. 1344190. Although it is shown in In the drawings, but preferably, the motor 260 houses an encoder for sensing the number of revolutions per minute of the motor 260. The rotating device 270 includes a motor shaft 27, a rotating shaft 272, a first timing pulley 273, and a Second timing pulley 274 and a timing belt 275. The motor shaft 271 is a rotating shaft 272 of the motor 26A and has a slender shape. The rotating shaft 272 is used to surround the slender motor shaft 271 for providing sufficient rotational force to the motor shaft 271. The rotating shaft 272 is surrounded by a bearing 276 assembled on a motor base 261. That is, the rotating shaft 272 is used to reinforce the rotational force of the motor 26 。. The first timing pulley 273 is configured. The second timing pulley 274 is configured to surround the diverter shaft 25 and the second timing pulley 274 is coupled to the first timing belt 275 by the timing belt 275. The timing pulley 273 is coupled and rotates simultaneously with the first timing pulley 273. In the above configuration configuration, if the motor shaft 271 is rotated by the operation of the motor 26, the rotary shaft 272 is simultaneously rotated. _ If this, the first timing pulley π around the rotating shaft milk will rotate simultaneously with the rotating shaft 272, and the second timing pulley 274 connected to the first timing pulley by the timing belt 2 will be the first positive When the pulley milk rotates at the same time. Therefore, the dipper shaft 252 surrounded by the second timing pulley 274 will follow. a In the present invention, since the rotating device 270 utilizes the operation of the motor 26'' to sway the diverter shaft 251', the dipper 25' can have various rotation angles. As described earlier in the prior art section, the conventional dipper shafting is limited in its angle of rotation by aerodynamic 'outdegrees'. In addition, 'there is no precision: tooth 2 = turn' is controlled by the operation of t in the position of the rotary position, and the extractor - can be rotated at various angles - step includes - first - rotary bearing 2 Μ, 255 :=f sex._ and - the second stroke bearing 255 is placed into the cylinder rod holder 230' and the second rotating shaft surrounds the dipper (four) to guide the crucible;: the diceper shaft 251 With the second timing pulley 274 belt = 5; the bearing 254 and the second rotating bearing 255 will support the weight i' of the yoke shaft 251 to guide the ejector shaft 251 to rotate. = The 1st linear axis condition and the second stroke linear bushing 257 are used for the 捡 (4) axis 25 丨, and the 丨 (4) axis 251 is used for the rotation of the upper and lower shafts 251. The lower end of the first stroke linear shaft bushing 220 is placed in the cylinder 220, and the second stroke linear bushing 257 is also inserted into the rainbow body 22 through the upper end of the cylinder 220. By using the first-stroke linear bushing and the second stroke linear axis to guide the linear motion and rotation of the dipper shaft 251, the dipper can achieve a larger contact area, and the rotation accuracy is also more Upgrade. In addition, the 减 减 251 can be rotated while moving vertically, so that the 344 1344190 ejector shaft 25 丨 can operate at high speed. In addition, the above-described conventional pneumatic screw is introduced into the gap, resulting in low rotational accuracy == the shaft needs to be pneumatically operated according to the present invention, and the size of the device is known around the extractor wheel (5). On the contrary, the roots are used to guide the upper and lower movements of the extractor (4), and the φ, 257 and 257 bushings are also slim and lighter than those of the prior art. The ejector made by the caliper At the same time, the vertical bracket 2 〇 Φ the upward movement of the ejector 250. The sensor 211 for sensing will then briefly describe the operation according to the present invention. The body package structure transports the money '(4) to record (4) the half object, use the type of the extractor mold, the group body (10), and move to - half her cell structure 2 = ^ domain (10) will be leveled next, control compressed air In order to pour in the first fish, let the compressed air move into the cylinder rod 24; the milk bee 221 moves downward. So, the rainbow rod holder 230 is moved downward by the closeness of the crucible shaft 25丨, and the height of the crucible is 25丨^==230. After the contact is reached, the air is sucked into the ejector shaft 251 as it moves downward, allowing the ejector 250 to pull out the semiconductor package structure. y At the same time, if it is necessary to change the square 1344190 direction of the semiconductor package structure 3 (8) to be removed, the angle of the motor 260 can be controlled. f sells transport operations 6 is a well-known technology, shame detailed description. The present invention discloses a semiconductor package structure according to the present invention. According to the present invention, the ejector 25G is vertically moved integrally with the cylinder rod 而 according to the up and down movement of the cylinder rod 24G, while borrowing

^達施的運作而旋轉。因此,控制馬達260的運作,可 瓖撿出器250以各種角度旋轉。 第二’根據本發明,緊密圍繞撿出器軸25】的衝程線性 抽1見256、257係用來引導撿出器250的旋轉與垂直運動,而 不需要像傳統方式__來提供氣動壓力。這麼作可使得 裂置比先前麟的魏細_巧。此外,纟 同時旋轉與垂直運動,因此撿出器25〇可達到高速運作。^ Da Shi's operation and rotation. Thus, controlling the operation of motor 260, the extractor 250 can be rotated at various angles. Secondly, in accordance with the present invention, the stroke of the scooping shaft 25 is closely spaced 1 to 256, 257 is used to guide the rotation and vertical movement of the diverter 250 without the need to provide pneumatic pressure as in the conventional manner. . This can make the splitting more delicate than the previous one. In addition, 纟 simultaneous rotation and vertical movement, so the ejector 25 〇 can achieve high speed operation.

的運作’控制撿出器軸251的旋 第三’在利用雙衝程線性轴襯256、257引導檢出器25〇 的垂直運動與旋轉時,由於撿出器軸251與雙衝程線性轴概 256、257之間的近接觸面積增加,使得撿出^ 25〇的旋轉精 確度可以提升。 儘管本發明已經透過較佳實施例加以說明,熟悉此技藝 者應可I解’在不悖離所附專利中請範圍所界定之本發明的 精神與範的情況下,可對本發明進行各種的肢、新增或 刪減。 【圖式簡單說明】 :二圖係輊國5主冊專利第0580816號之-且右“ ,動式撿出器之撿出器模組的立體圖。〃向可熒轉的 ί:=;Γ=旋轉的氣動式撿出器的立體圖。 ⑽〜者第_ _ Α_Α,線段之剖_。 口 弟四圖係本發明半導體 圖。 衣罝之—部分的立體 的撿出器模組主體 第五圖係本發明轉體縣結構輸送裝置 之立體圖。 第六圖係第五圖中的撿㈣模_立體圖。 第七圖係第六圖的前視圖。 第八圖係第六圖之分解立體圖。 【主要元件符號說明】 [習知] 汽缸體 11第—軸向氣動埠 1 ^a 第一軸向氣動腔 12 第二軸向氣動埠 12a 第二軸向氣動腔 13球體定位器 13a 密封部份 13b 球體支撐孔 球體 14 1344190 15 球體直線導槽 15a 直線引導溝槽 20 極軸 22 吸取襯墊 30 汽缸導槽 31 第一 引導軸 32 第一 氣動通道 33 第二 引導軸 34 第二 氣動通道 40 模組主體 42 垂直棒 50 伺服馬達 60 半導體封裝結構 [本發明] 100 撿出器模組主體 110 間隔調整裝置 200 撿出器模組 210 垂直托架 211 感測器 220 缸體 221 第一氣動埠 222 第二氣動埠 230 缸桿座 20 240 250 缸桿 撿出器 251 撿出器軸 252 旋轉接頭 253 抽吸管嘴 254 第一旋轉軸承 255 第二旋轉軸承 256 第一衝程線性軸襯 257 第二衝程線性軸襯 馬達 261 馬達座 旋轉裝 置 271 馬達軸 272 旋轉軸 273 第一正時滑輪 274 第二正時滑輪 275 正時皮帶 276 軸承 1344190 260 270 300 半導體封裝結構The operation 'controls the third rotation of the dipper shaft 251' when the vertical motion and rotation of the detector 25 引导 is guided by the two-stroke linear bushings 256, 257, since the dipper shaft 251 and the two-stroke linear axis are 256 The near contact area between 257 and 257 increases, so that the rotation accuracy of the ^ 25 25 可以 can be improved. While the invention has been described by the preferred embodiments of the present invention, it is understood that the invention may be practiced otherwise without departing from the spirit and scope of the invention as defined by the appended claims. Limbs, new or deleted. [Simple description of the map]: The second picture is the three-part series of the patent of the 5th book of the country, and the right one, the perspective view of the extractor module of the movable type extractor. = Stereo view of the rotating pneumatic extractor. (10) ~ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The figure is a perspective view of the structure transfer device of the swivel county of the present invention. The sixth figure is the 捡(four) mode_stereograph of the fifth figure. The seventh figure is the front view of the sixth figure. The eighth figure is the exploded perspective view of the sixth figure. [Main component symbol description] [Practical] Cylinder block 11 - Axial pneumatic 埠 1 ^ a First axial pneumatic cavity 12 Second axial pneumatic 埠 12a Second axial pneumatic cavity 13 Sphere locator 13a Sealing part 13b Sphere support hole ball 14 1344190 15 Sphere linear guide groove 15a Linear guide groove 20 Polar axis 22 Suction pad 30 Cylinder guide groove 31 First guide shaft 32 First pneumatic passage 33 Second guide shaft 34 Second pneumatic passage 40 Mode Group body 42 vertical rod 50 servo motor 60 semiconductor package junction [Invention] 100 ejector module body 110 interval adjusting device 200 ejector module 210 vertical bracket 211 sensor 220 cylinder 221 first pneumatic 埠 222 second pneumatic 埠 230 cylinder rod holder 20 240 250 Cylinder stem 251 ejector shaft 252 rotary joint 253 suction nozzle 254 first rotary bearing 255 second rotary bearing 256 first stroke linear bushing 257 second stroke linear bushing motor 261 motor seat rotating device 271 motor Axis 272 Rotary shaft 273 First timing pulley 274 Second timing pulley 275 Timing belt 276 Bearing 1344190 260 270 300 Semiconductor package structure

Claims (1)

1344190 十、申請專利範圍: 卜一種半導體封裝結構輸送裝置,包含: 複數個用以撿出與反轉該半導體封裝結 以輸送該半導體封裝結構; 的撿出器模組,用 其中該等撿出器模組各包含: 一垂直托架; 一附接至該垂直托架的下端之缸體; -穿透該缸體並具有_下端置人— 桿的向上與向下運動以垂直地移動該缸桿座;错由該缸 ▲ H級體並與該&桿座—體軸接 該缸桿座的垂直運動番 。,以便根據 褒結構;運動㈣直地鶴’㈣撿出鱗轉該半導體封 ,、中,—%轉裝置係一體地组設於該缸體 達的運作以旋轉該撿出器。 員而,糟由一馬 其中細帛丨撕敎料體雜結_送聚置’ 空氣器轴’其具有一形成於其令之穿孔,用以引進與梆玫 苴又於5亥撿出器轴的上部之旋轉接頭,以及 八中该旋轉裝置包含: 作為该馬達的一驅動軸之馬達軸; 座上之用以31繞該馬達軸之旋轉轴,並被—組設於一馬達 之轴承所圍繞,從而在該馬達軸旋轉的同時一起旋轉;達 22 丄夕呼仔 旋轉的同時^起旋=蝴軸的第—正時滑輪’從而在該旋轉轴 撿出器軸的第二正時滑輪;以及 而在該二時滑=及該第二正時滑輪連接之正時皮帶,從 3ή 疋轉的同時旋轉該第二正時滑輪。 其中該如ΐίΓ卿2項陳半_聰構輪物, _=;==^_撿_之第-旋 錢^被置人該馬達座並被配置用明繞該撿出雜之第寸 轉車承’從而引導該撿出器軸的旋轉; —疋 置入;=以出器軸並透體的-下端而被 Μ缸體的第-衝程線性軸襯,從而引導該撿 轉與向上及向下勒;以及 ⑽的同日4疋 一被配置用以圍繞該撿出器軸並透過該缸體的—上端而被 置入該缸體的第二衝程線性軸襯,從而引導該撿出器轴的; 轉與向上及向下運動。 4、如申請專利範圍第卜2或3項之半導體封装处構輪 置,其中該垂直托架包含一感測器,用以感測該撿出^的」向f 運動。 。上 231344190 X. Patent Application Range: A semiconductor package structure conveying device comprising: a plurality of extractor modules for extracting and inverting the semiconductor package to transport the semiconductor package structure; Each of the modules includes: a vertical bracket; a cylinder attached to the lower end of the vertical bracket; - penetrating the cylinder and having an upward and downward movement of the lower end to move the rod vertically Cylinder stem; wrong with the cylinder ▲ H-class body and the & pole-body shaft connected to the vertical movement of the cylinder rod seat. According to the 褒 structure; the movement (4) straight cranes (4) 鳞 鳞 该 该 该 该 该 该 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体And the mess is made up of a horse, which is thin and torn, and the material is mixed. The air shaft is formed by a perforation formed in the order to introduce it with the 梆 苴 苴 and 5 捡 器a rotary joint of the upper portion of the shaft, and the rotary device of the eighth portion includes: a motor shaft as a drive shaft of the motor; a rotary shaft for the motor shaft 31 on the seat, and is assembled to a bearing of the motor Surrounded so as to rotate together while the motor shaft rotates; at the same time as 22 丄 呼 旋转 ^ ^ = = = 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 蝴 从而 从而 从而 从而 从而 从而 从而 从而 从而a pulley; and a timing belt that is coupled to the second timing pulley and the second timing pulley, rotates the second timing pulley from 3 turns. Among them, such as ΐίΓqing 2 items Chen _ _ 灵 轮, _=; == ^ _ _ _ _ _ _ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Guided to thereby guide the rotation of the diverter shaft; - 疋 placed; = linearly lining the first stroke of the cylinder with the output shaft and the lower end of the body, thereby guiding the tumbling and upward and upward And the same day (10) is configured to be placed around the extractor shaft and through the upper end of the cylinder to be placed into the second stroke linear bushing of the cylinder, thereby guiding the extractor shaft Turn; move up and down. 4. The semiconductor package structure wheel of claim 2, wherein the vertical bracket includes a sensor for sensing the "f" motion of the output. . Above 23
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Publication number Priority date Publication date Assignee Title
KR100992112B1 (en) * 2008-02-19 2010-11-05 (주) 티피씨 메카트로닉스 Pick-up cylinder
KR101315889B1 (en) * 2008-04-17 2013-10-15 한미반도체 주식회사 Method for Controlling Semiconductor Package Transfer
KR101000775B1 (en) * 2008-05-26 2010-12-13 세크론 주식회사 Apparatus for picking up a semiconductor device
TWI472466B (en) * 2009-11-04 2015-02-11 System General Corp A pick-and-place device for ics
WO2012117315A1 (en) * 2011-03-03 2012-09-07 Somont Gmbh System and methods for picking and transporting photovoltaic components
KR101339010B1 (en) * 2011-10-05 2013-12-09 삼익정공(주) Picker actuator with polygonal type guide
US9451736B2 (en) 2011-10-05 2016-09-20 Samick Precision Ind. Co., Ltd. High load and high precision polygonal guide
KR101305486B1 (en) 2012-06-29 2013-09-06 주식회사 에어텍이엔지 Pickup cylinder provided with a flexible vacuum tube
KR101261779B1 (en) * 2012-10-05 2013-05-07 주식회사 세라텍 Pick and place apparatus
KR102571765B1 (en) * 2021-12-06 2023-08-28 주식회사 인터원 PCB alignment device for LED module inline unmanned automation system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
KR0168083B1 (en) * 1993-09-25 1999-02-01 김광호 Absorption head of chip
JP3262683B2 (en) * 1995-01-20 2002-03-04 松下電器産業株式会社 Semiconductor mounting equipment
KR19980014310U (en) * 1998-03-05 1998-06-05 배종섭 Pickup device for semiconductor assembly
KR100580816B1 (en) * 2005-04-20 2006-05-16 (주)제이티 Air pressure pivoting picker for in-line transferring semiconductor devices, picker module comprising the same, and the method for transferring semiconductor device

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