TWI472466B - A pick-and-place device for ics - Google Patents

Description

Integrated circuit chip pick-and-place device

The invention relates to a pick-and-place device, in particular to a pick-and-place device for an integrated circuit chip.

With the advancement of technology, various types of electronic products are becoming more and more popular, so the demand for integrated circuit (IC) chips in electronic products is increasing. The integrated circuit wafer must be subjected to a burning process before being placed in the electronic product. The programming process is to place the integrated circuit chip in a burning machine for burning, and burn a pre-defined program into the integrated circuit chip, so that the integrated circuit chip can have other components for controlling the electronic product. Features. In order to reduce the working time of integrated circuit chip burning, the current integrated circuit chip burning is generally completed by an automatic wafer burning machine, which can reduce the overall burning recording time of the integrated circuit chip, thereby increasing the integrated circuit. The production speed of the wafer.

In the program of the burning operation, the integrated circuit chip is taken from the stocking area to the burning machine via a pick-and-place device. After the integrated circuit chip is burned, the pick-and-place device places the burned integrated circuit chip into the next workstation, for example, placing the burned integrated circuit wafer through the pick-and-place device to the electronic product. The wafer slot, or the wafer slot placed on the test unit for testing the integrated circuit chip. Because the integrated circuit wafer is placed in the wafer slot, there is a directional limit. In the process of picking up and dropping the integrated circuit chip to the wafer slot of the burner, the electronic product or the test unit, most of the conditions require rotating the integrated circuit chip so as to correctly place the integrated circuit chip on the wafer. groove. However, the structure of the pick-and-place device that can rotate the integrated circuit chip is complicated and bulky, which makes maintenance difficult and costly, and affects the efficiency of processing the integrated circuit chip. And because of the large volume and occupying a large space, there are certain restrictions on the setting.

Therefore, the present invention provides a pick-and-place device for an integrated circuit chip, which has a simple structure, and can simultaneously pick up and rotate a plurality of integrated circuit chips, thereby increasing the convenience of picking up and dropping the integrated circuit chip, thereby increasing processing. The efficiency of integrated circuit chips.

One of the objects of the present invention is to provide a pick-and-place device for rotating a plurality of integrated circuit wafers during the process of picking up and placing integrated circuit chips to increase the convenience of picking up and dropping integrated circuit chips.

Another object of the present invention is to provide a pick-and-place device for an integrated circuit chip which is simple in structure and small in size, so that it is easy to maintain, reduce space occupation and reduce cost.

The pick-and-place device for an integrated circuit of the present invention comprises a base, a plurality of pick-and-place structures, a plurality of rotating structures, a transmission structure and a driving structure. The pick-and-place structures are disposed on the base and respectively have a nozzle, and each nozzle can be moved up and down respectively. The rotating structures are disposed on the base and drive the nozzles to rotate. The transmission structure is disposed on the rotating structures and drives the rotating structures to rotate. The driving structure is disposed on the base for driving the transmission structure, and drives the rotating structures to rotate, thereby driving the rotating structures to drive the nozzles to rotate. In this way, by rotating the nozzles by the rotating structures, the integrated circuit wafer can be rotated during the process of picking up and placing the integrated circuit wafers, thereby increasing the convenience of picking up and dropping the integrated circuit chips.

For a better understanding and understanding of the structural features and the efficacies of the present invention, please refer to the preferred embodiment and the detailed description, as explained below: please refer to Figure A and Figure 1 Figure 4 is a perspective view of a different viewing angle of the pick-and-place device of the integrated circuit of the preferred embodiment of the present invention. As shown in the figure, the pick-and-place device 10 of the integrated circuit of the present invention comprises a susceptor 12, a plurality of pick-and-place structures 14, a plurality of rotating structures 16, a transmission structure 17, and a driving structure 18. The susceptor 12 includes a substrate 122 and a back plate 123. The substrate 122 is disposed above the back plate 123. The pick-and-place structures 14 are disposed on the back plate 123 of the susceptor 12. The pick-and-place structures 14 each have a nozzle 142 for picking up and dropping the integrated circuit chip. The rotating structures 16 are disposed on the substrate 122 of the susceptor 12 . The rotating structure 16 is used to drive the nozzle 142 to rotate. The detailed structure of the rotating structure 16 is shown in the third figure and is described in detail later.

The transmission structure 17 is disposed on the rotating structure 16 and the driving structure 18. The transmission structure 17 is used to drive the rotating structures 16 to rotate. The driving structure 18 is disposed on the substrate 122 of the susceptor 12. The driving structure 18 is used to drive the transmission structure 17 to drive the rotating structures 16 to rotate. Further make the rotation The structure 16 drives the nozzles 142 to rotate. One embodiment of the drive structure 18 can be a positioning motor.

The present invention can only drive the nozzles 142 to rotate by the transmission structure 18 passing through the transmission structure 17 and the rotating structures 16. Therefore, the pick-and-place device 10 of the present invention has a simple structure and a small size, so that maintenance can be facilitated and space and cost can be reduced. In addition, the pick-and-place device 10 of the present invention can simultaneously take a plurality of integrated circuit chips, and can rotate the integrated circuit chips to the correct direction during the process of picking up and dropping the integrated circuit chips to be surely placed on the wafer. groove. This can increase the convenience of handling these integrated circuit chips.

Referring to the second figure together, the present invention further includes a plurality of hollow shaft tubes 20. Each hollow shaft tube 20 is respectively disposed in each of the rotating structures 16 and is connected to the suction nozzle 142. In order to facilitate the connection of the hollow shaft tubes 20 to one of the external vacuum devices, the present invention further includes a plurality of ports 22. The connecting ports 22 are respectively connected to the upper of the hollow shaft tubes 20. One embodiment of the port 22 is a quick connector, which allows the user to more easily attach the vacuum device to the hollow shaft tube 20. Each pick-and-place structure 14 of the present invention includes a suction nozzle 142, an actuator 144 and a drive shaft 146. The actuator 144 is disposed on the back plate 123 of the base 12. One embodiment of the actuator 144 is a pneumatic cylinder. The drive shaft 146 is disposed through the actuator 144 and is coupled to the suction nozzle 142. The drive shaft 146 is a hollow tubular member. The drive shaft 146 is in communication with the hollow shaft tube 20. The hollow shaft tube 20 is passed through the rotating structure 16 and connected to the transmission shaft 146, so that the hollow shaft tube 20 is connected to the suction nozzle 142. Each actuator 144 is used to drive each of the drive shafts 146 to move up and down, respectively, to control each nozzle 142 to move up and down to draw the integrated circuit wafer. The rotating structure 16 is used to drive the transmission shaft 146 to rotate to rotate the suction nozzle 142.

Referring to FIGS. 1A and 1B, the rotating structure 16 of the present invention includes at least one main rotating structure 162 and at least one subordinate rotating structure 164. The driving structure 18 drives the transmission structure 17 to drive the main rotating structure 162 to rotate. The main rotating structure 162 drives the slave rotating structure 164 to rotate. The transmission structure 17 includes a first transmission unit 172 (as shown in FIG. B) and a second transmission unit 174 (as shown in FIG. 1A). The first transmission unit 172 is disposed on the driving structure 18 and the main rotating structure 162. The drive structure 18 drives the first transmission unit 172 to drive the main rotating structure 162 to rotate. The second transmission unit 174 is disposed on the main rotating structure 162 and the slave rotating structure 164. When the main rotating structure 162 is controlled by the first transmission unit 172, the second transmission unit 174 will be driven by the main rotating structure 162 to drive the slave rotating structure 164 to rotate, so that the slave rotating structure 164 is rotated by the main. Structure 162 drives the rotation.

In response to the above, the first transmission unit 172 includes a drive wheel 1722, a plurality of first main drive wheels 1724, and a drive belt 1726. Drive wheel 1722 is provided to drive structure 18. The drive structure 18 drives the drive wheel 1722 to rotate. As shown in the first B and third figures, the first main drive wheel 1724 is disposed below the main rotating structure 162. The drive belt 1726 is disposed on the drive wheel 1722 and the first main drive wheel 1724. Thus, when the drive structure 18 drives the drive wheel 1722 to rotate, the drive wheel 1722 drives the drive belt 1726 to rotate, and drives the first main drive wheel 1724 to rotate. One of the above-described driving wheels 1722 and one of the first main transmission wheels 1724 is a pulley. One embodiment of the drive belt 1726 is a belt. The second transmission unit 174 includes a second main transmission wheel 1742, a slave transmission wheel 1744 and a transmission belt 1746. As shown in the first A and third figures, the second main drive wheel 1742 is disposed above the main rotating structure 162. The slave drive wheel 1744 is disposed above the slave rotation structure 164 as shown in the first A and second figures. The drive belt 1746 is disposed on the second main drive wheel 1742 and the slave drive wheel 1744. Thus, when the drive structure 18 drives the main rotating structure 162 to rotate, the second main drive wheel 1742 of the main rotating structure 162 will rotate. The second main drive wheel 1742 will rotate the drive belt 1746 to cause the slave drive wheel 1744 of the slave rotary structure 164 to be rotated. Therefore, the slave rotating structure 164 is rotated by the main rotating structure 162. The transmission belt 1726 of the first transmission unit 172 and the transmission belt 1746 of the second transmission unit 174 are only one embodiment of the transmission member.

Please refer to FIG. 3, FIG. 4A and FIG. 4B respectively, which are schematic structural diagrams of the rotating structure 16 of the preferred embodiment of the present invention, and the linear sleeve 166 is sleeved on the front view and the top view of the hollow shaft tube 20. . As shown, each of the rotating structures 16 of the present invention includes at least a linear sleeve 166 and a plurality of rotating bearings. The rotary bearing includes at least a first rotary bearing 1682 and a second rotary bearing 1684. The rotary bearing 168 may further include a third rotary bearing 1686 to increase the stability. Each of the rotary bearings has an outer ring and an inner ring, and the inner ring is rotatable. The linear sleeve 166 is sleeved on the hollow shaft tube 20. The rotary bearings 1682, 1684, and 1686 are respectively disposed on the base 12 (as shown in FIG. 5) by a plurality of bearing seats 124, 126, and 128. The rotary bearings 1682, 1684, and 1686 are respectively sleeved on the linear sleeve 166.

One embodiment of the linear sleeve 166 is a splined bearing sleeve, so as shown in FIG. 4B, the outer side of the hollow shaft tube 20 has a shape that matches the inner shape of the linear sleeve 166. Therefore linear sleeve 166 The sleeve is sleeved on the hollow shaft tube 20. When the linear sleeve 166 is rotated, the linear sleeve 166 will drive the hollow shaft tube 20 to rotate. In turn, the drive shaft 146 (shown in the second figure) connected to the hollow shaft tube 20 is rotated. Therefore, the suction nozzle 142 to which the transmission shaft 146 is connected is driven to rotate.

Referring to the fourth A diagram, one side of the linear sleeve 166 is provided with a groove 1662. One end of the cylinder 24 is disposed in the groove 1662. The shape of the groove 1662 must not necessarily be the elongated shape shown, and the illustration is only one embodiment of the present invention. The other end of the cylinder 24 is disposed on a side wall of the second main transmission wheel 1742 or/and the first main transmission wheel 1724 (as shown in the third figure). That is to say, the cylinder 24 is disposed on the linear sleeve 166 of the transmission structure 17 and the rotating structure 16. Thus, the linear sleeve 166 of the primary rotating structure 162 is secured to the second primary drive wheel 1742 or/and the first primary drive wheel 1724 of the transmission structure 17. Therefore, when the first main transmission wheel 1724 is controlled to rotate, the linear sleeve 166 in the main rotating structure 162 is driven to rotate, thereby driving the hollow shaft tube 20 passing through the main rotating structure 162 to rotate. Further, the suction nozzle 142 connected to the hollow shaft tube 20 and the second main transmission wheel 1742 provided in the main rotation structure 162 are also driven.

In addition, the linear sleeve 166 of the slave rotating structure 164 is secured to the sidewall of the slave drive wheel 1744 of the transmission structure 17 via the cylinder 24. The linear sleeve 166 of the slave rotating structure 164 is rotated by the slave drive wheel 1744. Therefore, when the slave drive wheel 1744 is controlled to rotate by the second main drive wheel 1742 and the drive belt 1746 in the main rotary structure 162, the hollow shaft tube 20 and the suction nozzle 142 that are passed through the linear sleeve 166 of the slave rotary structure 164 will be Drive the rotation.

Additionally, the present invention further includes at least one spacer ring 169 (as shown in the third figure). The spacer ring 169 is sleeved on the linear sleeve 166 and located between the second main transmission wheel 1742 and the first main transmission wheel 1724. The spacer ring 169 is configured to space the second main transmission wheel 1742 and the first rotary bearing 1682 and the first main transmission wheel 1724 and the second rotary bearing 1684 to avoid the first rotary bearing 1682, the second rotary bearing 1684 and the second main, respectively. The drive wheel 1742 and the first main drive wheel 1724 create friction. The spacer ring 169 is sleeved on the linear sleeve 166 and disposed on the inner ring of the rotary bearings 1682 and 1684. That is, the rotary bearings 1682 and 1684 are provided in the linear sleeve 166 through the spacer ring 169. When the linear sleeve 166 rotates, the inner rings of the rotary bearings 1682, 1684 are rotated by the spacer ring 169. In addition, when the rotating structure 16 further includes the third rotating bearing 1686, a spacer ring 169 may be additionally added to the inner ring of the third rotating bearing 1686 to avoid the first main driving wheel 1724. Friction is generated with the third rotary bearing 1686.

Referring to FIG. 5, a front view of a preferred embodiment of the pick-and-place device of the integrated circuit chip of the present invention is shown. As shown, the present invention includes a bearing housing that includes a first bearing block 124 and a second bearing block 126, and may further include a third bearing block 128. The bearing housings are respectively disposed on the base plate 122 of the base 12 . The first rotating bearing 1682, the second rotating bearing 1684 and the third rotating bearing 1686 outer ring of the rotating structure 16 (as shown in the third figure) are respectively disposed on the first bearing seat 124, the second bearing seat 126 and the third bearing Block 128. The second bearing block 126 is located below the first bearing block 124. The third bearing block 128 is located below the second bearing block 126. The second rotary bearing 1684 can be directly embedded in the substrate 122, so the substrate 122 is used as the second bearing housing 126.

Please refer to the sixth drawing, which is a perspective view of the pick-and-place device of the integrated circuit of the preferred embodiment of the present invention. As shown, the present invention further includes a mobile device 30. The mobile device 30 includes a horizontal moving structure 32 and a vertical moving structure 34. The base 12 of the pick-and-place device 10 is disposed on one of the mobile devices 30. The moving seat 322 is disposed on the horizontal moving structure 32. The horizontal moving structure 32 can move the moving base 322 in the horizontal direction (X direction). In other words, the pick-and-place device 10 is disposed in the horizontal moving structure 32, and the horizontal moving structure 32 drives the pick-and-place device 10 to move in the horizontal direction. The horizontal moving structure 32 is disposed on the vertical moving structure 34. The vertical movement structure 34 drives the horizontal movement structure 32 to move in the vertical direction (Y direction). Thus, by the horizontal moving structure 32 and the vertical moving structure 34 of the mobile device 30, the pick-and-place device 10 can be moved in the horizontal direction (X direction) and the vertical direction (Y direction) to increase the convenience of accessing the integrated circuit chip. Sex, and improve the efficiency of pick and place.

In summary, the pick-and-place device for the integrated circuit chip of the present invention comprises a pick-and-place structure, a rotating structure, a transmission structure and a driving structure. The present invention drives the transmission structure by using the driving structure, and drives the rotating structure to rotate, so that the rotating structure That will drive the nozzle to rotate. Therefore, the pick-and-place device of the present invention can drive a plurality of nozzles to rotate at the same time by a single driving structure, so that the plurality of integrated circuit chips can be rotated while the nozzles are being loaded and discharged. The circuit chip is in the correct direction, so as to increase the convenience when handling the integrated circuit chips.

Therefore, the present invention is a novelty, progressive and available for industrial use, and should conform to the patent application requirements stipulated in the Patent Law of China, and undoubtedly file an invention patent application according to law. The bureau gave patents as soon as possible, and felt prayed.

However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the shapes, structures, features, and spirits described in the claims are equivalently changed. Modifications are intended to be included in the scope of the patent application of the present invention.

10‧‧‧ pick and place device

12‧‧‧ Pedestal

122‧‧‧Substrate

123‧‧‧ Backboard

124‧‧‧First bearing housing

126‧‧‧Second bearing

128‧‧‧3rd bearing housing

14‧‧‧ pick and place structure

142‧‧ ‧ nozzle

144‧‧‧Actuator

146‧‧‧ drive shaft

17‧‧‧ Transmission structure

172‧‧‧First transmission unit

1722‧‧‧Drive wheel

1724‧‧‧First main drive wheel

1726‧‧‧ drive belt

174‧‧‧second transmission unit

1742‧‧‧Second main drive wheel

1744‧‧‧Subordinate drive wheel

1746‧‧‧ drive belt

18‧‧‧Drive structure

20‧‧‧ hollow shaft tube

16‧‧‧Rotating structure

162‧‧‧Main rotating structure

164‧‧‧Subordinate rotating structure

166‧‧‧Line sleeve

1662‧‧‧ trench

1682‧‧‧First rotary bearing

1684‧‧‧Second rotary bearing

1686‧‧‧3rd rotary bearing

169‧‧‧ spacer ring

22‧‧‧Connected

24‧‧‧Cylinder

30‧‧‧Mobile devices

32‧‧‧ horizontal moving structure

322‧‧‧Mobile seat

34‧‧‧ Vertical mobile structure

1 is a perspective view of a preferred embodiment of the pick-and-place device of the integrated circuit of the present invention; FIG. 1B is a perspective view of another view of the pick-and-place device of the first A; A perspective view of a preferred embodiment of a hollow shaft tube, a rotating structure, a transmission structure, and a pick-and-place structure; a third view of the preferred embodiment of the rotating structure of the present invention; and a fourth embodiment of the present invention A front view of a preferred embodiment of the hollow sleeve tube; a fourth embodiment of the present invention is a plan view of a preferred embodiment of the linear sleeve of the present invention, and a fifth embodiment of the present invention; A front view of a preferred embodiment of a pick-and-place device for a circuit chip; and a sixth view of a preferred embodiment of the pick-and-place device for an integrated circuit of the present invention disposed on the mobile device.

10‧‧‧ pick and place device

12‧‧‧ Pedestal

122‧‧‧Substrate

123‧‧‧ Backboard

14‧‧‧ pick and place structure

142‧‧ ‧ nozzle

144‧‧‧Actuator

146‧‧‧ drive shaft

16‧‧‧Rotating structure

162‧‧‧Main rotating structure

164‧‧‧Subordinate rotating structure

17‧‧‧ Transmission structure

174‧‧‧second transmission unit

1742‧‧‧Second main drive wheel

1744‧‧‧Subordinate drive wheel

1746‧‧‧ drive belt

18‧‧‧Drive structure

20‧‧‧ hollow shaft tube

22‧‧‧Connected

Claims (17)

The pick-and-place device of the integrated circuit chip comprises: a pedestal; a plurality of pick-and-place structures disposed on the pedestal, the pick-and-place structures respectively have a nozzle, and the pick-and-place structures respectively control the sucking The nozzle moves up and down; a plurality of rotating structures are disposed on the base and drive the nozzles to rotate; a transmission structure is disposed on the rotating structures and drives the rotating structures to rotate; and a driving structure is disposed on the base The driving structure drives the transmission structure to rotate the rotating structures, and the rotating structures drive the nozzles to rotate; wherein the rotating structures comprise at least one main rotating structure and at least one subordinate rotating structure, the driving structure Driving the transmission structure to drive the rotation of the main rotating structure, the main rotating structure driving the rotation of the slave rotating structure; wherein the transmission structure comprises: a first transmission unit disposed on the driving structure and the main rotating structure, the driving structure is driven The first transmission unit drives the main rotating structure to rotate. The first transmission unit comprises: a driving wheel disposed on the driving structure, the driving node Driving the driving wheel to rotate; at least one first main transmission wheel is disposed on the at least one main rotating structure; and a transmission member driven by the driving wheel to drive the first main transmission wheel to rotate, and the main rotating structure is driven Rotating; and a second transmission unit disposed on the main rotation structure and the slave rotation structure, the main rotation structure rotating to drive the second transmission unit to drive the rotation of the slave rotation structure, the second transmission unit comprising: a second main drive wheel disposed on the main rotating structure; a slave drive wheel disposed on the slave rotating structure; and a transmission member driven by the main rotating structure to drive the slave drive wheel to rotate and rotate the slave Rotating structure. The pick-and-place device for an integrated circuit chip according to claim 1, further comprising a plurality of hollow shaft tubes respectively penetrating the rotating structures and connecting the nozzles. The pick-and-place device for an integrated circuit chip according to claim 2, further comprising a plurality of connecting ports, the connecting ports respectively connecting the hollow shaft tubes. The pick-and-place device for an integrated circuit chip according to claim 2, wherein each of the rotating structures comprises: at least a linear sleeve sleeved on the hollow shaft tube, the linear sleeve being fixed to the transmission structure, The linear sleeve drives the hollow shaft tube to rotate; and a plurality of rotary bearings are disposed on the base and sleeved on the linear sleeve. The pick-and-place device for an integrated circuit wafer according to claim 4, wherein the outer side shape of the hollow shaft tube matches the inner shape of the linear sleeve. The pick-and-place device for an integrated circuit chip according to claim 5, wherein one side of one of the linear sleeves is provided with at least one groove, and one end of at least one of the cylinders is disposed at the groove, the column The other end is disposed in the transmission structure, the transmission structure drives the cylinder to rotate, the cylinder drives the linear sleeve to rotate, and the linear sleeve drives the hollow shaft tube to rotate. The pick-and-place device for an integrated circuit wafer according to claim 4, wherein the linear sleeve is a spline bearing sleeve. The pick-and-place device for an integrated circuit chip according to claim 4, further comprising at least one spacer ring sleeved on the linear sleeve and located in one of the inner rings of the rotary bearings. The pick-and-place device for an integrated circuit chip according to the fourth aspect of the invention, wherein the base comprises: a substrate; and a plurality of bearing blocks disposed on the substrate, wherein the rotary bearings are disposed on the bearing blocks. The pick-and-place device for an integrated circuit chip according to claim 9, wherein the rotary bearing comprises: a first rotary bearing, a first bearing seat disposed on the bearing housing; and a second rotary bearing Provided in a second bearing seat of the bearing housing and located under the first rotating bearing; and a third rotating bearing disposed on the third bearing seat of the bearing housing and located in the second rotation Below the bearing. The pick-and-place device for an integrated circuit chip according to claim 1, wherein each of the pick-and-place structure comprises: an actuator disposed on the base; and a drive shaft disposed through the actuator And connected to the nozzle, the rotating structure drives the transmission shaft to rotate, and the actuator drives the transmission shaft to move up and down. The pick-and-place device for an integrated circuit chip according to claim 11, wherein the drive shaft is coupled to a hollow shaft tube, the drive shaft is in communication with the hollow shaft tube, and the hollow shaft tube is disposed in the rotating structure. The pick-and-place device for an integrated circuit chip according to claim 11, wherein the actuator is a pneumatic cylinder. The pick-and-place device for an integrated circuit chip according to claim 11, wherein the drive shaft is a hollow tubular member. The pick-and-place device for an integrated circuit chip according to claim 1, further comprising a mobile device, wherein the base is disposed on the mobile device. The pick-and-place device for an integrated circuit chip according to claim 15, wherein the moving device comprises: a horizontal moving structure, the base is disposed on the horizontal moving structure, and moves in the X direction; and a vertical The moving structure is disposed on the vertically moving structure and moves in the Y direction. The pick-and-place device for an integrated circuit chip according to claim 1, wherein the driving structure is a positioning motor.