TWI283649B - IC test sorting machine - Google Patents

IC test sorting machine Download PDF

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Publication number
TWI283649B
TWI283649B TW94127219A TW94127219A TWI283649B TW I283649 B TWI283649 B TW I283649B TW 94127219 A TW94127219 A TW 94127219A TW 94127219 A TW94127219 A TW 94127219A TW I283649 B TWI283649 B TW I283649B
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Taiwan
Prior art keywords
test
tested
guiding
tray
item
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TW94127219A
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Chinese (zh)
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TW200707619A (en
Inventor
Yuan-Long Chang
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Hon Tech Inc
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Abstract

A kind of IC test sorting machine, in which the material-inputting apparatus with the guiding mechanism is used to carry and correct the material-tray that carries the IC to be tested so as to make the material-moving apparatus capable of accurately picking the IC to be tested. For each material-picking mechanism of the material-moving apparatus, the second directional movement structure having the picking implement is installed in a suspending manner below the first directional movement structure so as to save the device arrangement space and have the capability of shrinking machine volume. At first, the material-moving apparatus uses the picking implement to move the IC to be tested to a heating apparatus where the IC to be tested is heated. Then, the IC to be tested is moved to a carrying apparatus, which moves the IC to be tested inside a hot testing room having good airtight characteristic such that the IC to be tested is located at one side of the testing stage. After that, the vision apparatus installed outside the hot testing room is capable of scanning to check if there is any foreign matter inside the testing stage. Then, the inspecting apparatus, which is installed outside the hot testing room, uses the picking implement to move the IC to be tested of the carrying apparatus to the testing stage to perform the inspecting operation. After the inspection is completed, the measurement-finished IC is placed on the carrying apparatus and is moved outside the hot testing room such that the material-moving apparatus can move out the measurement-finished IC to the material-outputting position. In addition, the measurement-completed IC is sorted and placed according to the testing results so as to reach the purpose of greatly increasing the application benefit.

Description

1283649 九、發明說明: 【發明所屬之技術領域】 本發明係有關一種可導正料盤以供移料裝置準確取放Ic, 並節省移料裝置之配置空間而可縮小機器體積,及可防止Ic受 損與提升檢測品質之1C測試分類機。 【先前技術】 在現今,業者於積體電路(integrated circuit,簡稱I c )製作完成後,均會利用一I C檢測分類機執行電路檢測作業, 以檢測I C於生產過程中是否損壞而淘汰出不良品,請參閱第1 圖所示,係為台灣申請第88212975號「積體電路檢測機構」專利 案’該檢測機構係於機台上設有測試台1用以檢測I C,一入料 裝置2係設置於測試台1之前方用以承載待測j c,其係於一輸 送台3之兩侧設有輸送帶4,該輸送帶4可供擺置盛裝待測!c ^料盤,俾靖料錄送至舰位置,私壓缸5雜定位,一 置6,係於測試台1之兩侧設有第-取料 2:芊-第;該第一、二取料機構7、8各於機台 向:=移二= 第-方向位移’進而該移料裝J 之取放器1 1作 置2上之細I C先移载至—機構7可將入料裝 載至载送裝置1 3處,該載㈣;ff1 2處加熱,再將I C移 第一、二載送機構14、15,^ 3係於測試台1之兩侧設有 1c载送至測試台1之側方,丄^第一载送機構14可將待測 上方,並以取放器i 7於測Ί測裝置16係設於測試台1之 將待測IC移載至測試台1而二,栽送裝置13間位移,俾以 後,再將完測I C移載至第二檢測作業,待I C檢測完畢 运機構15上而移載出檢測裝置 1283649 1β供第一取料機構8將完測iς移載至出料裝置18處,並 ,檢測結果而分類收置;惟,此—檢測機構於使用上具有如下缺 失: 1 ·該入料裝置2僅於輸送帶4之側方以一壓缸5頂置料盤,但 1一壓紅5並無法有效且正確地將偏斜之料盤導正,以致料 ^移載至預設位置時,仍呈—偏斜狀,而無法 6之取放器1i準確對位吸取待測〗c,造成取用〗c上之 不便。 2·該移料裝置6係於機台之兩側架設第二方向 • ”架設第-方向移動結構1 〇,但該第二;=構3 =對地增加機H體積,而不利於細場所之空間配置。 3 · =„,將I C移載至加熱裝置丄2處乃為模擬 1^工作溫度,但該測試台!卻於開放式之常溫空 =試作業,雜I c無祕持補擬工作溫度離 仃測試,造成測試品質不佳之缺失。 Μ下進 4 ·由^試台i内可能會殘留受損! 〇之餘屑或灰塵等異物, 但使用者並無法立即得知而迅速排除,易、 •【發上内J】、成貝壞率增加及測試品質不佳之缺失。 料裝==:¾盤分=,俾以利用入 準確取出! C ’達到便利二㉝二可供移繼 方向以f,於第- ==設空間’達到縮小機器 1283649 溫度之狀態下執行檢測作*,_提升1c檢測品質之 古一之又_目的係在於該檢測裝置上相對應測試台位置設 試台,並將掃猫訊號傳輸至控制器, 續物’而可迅速排除異物’以防止後 她fIC又知’達到降低Ic損壞率之實用效益。 測試:之係種1 c測試分纖,包含: 入料裝置設於測試台之前方,魏供置放錄制1 c之料 :台之兩侧方’用以移載待測/完測1 C ; 罩内,以提供—氣雜良好之高溫作 试台之另二侧方,用以載送待測/完測I C . ,· 卜部,肋於載送裝置及職台間移 視覺裝置:啦之外部且姆制試台位置,用以掃猫 出料裝置·=於測試台之前方,用以供置放盛裝完測1 C之料 備用置盤裝置:肖IX承置空料盤。 導正測:入料裝置更包含有導正機構,用以 卜、f τ 便刮移料裝置準確取用I C。 各取料“之叙該移料装置更包含有二組取料機構, 結構,而可ι4第構下方係懸吊連結—第二方向移動 積而利於使用場所空間空間’達到縮小機器體 乂測式分類機,該出料裝置更包含有導正機構,用以 1283649 導正料盤位移,以便利移料裝置準確放置ic。 上述IC測試分類機,該載送裝置更包含有第一 第二移載機構’並於各移載機構之載台上設有封閉 測室之通道封閉,使熱測室形成一氣密性良好之 _、*' 而提升檢辭確率。 環境, 【實施方式】 為使貴審查委㈣本發财更進—步之瞭解 實施例並配合圖式,詳述如后·· 芈較隹 圖=閱第2圖所示’係本發明IC測試分類機之各裝置配置 測試台2 0 :係用以測試IC ; 入料裝置:BG :雜於職台2G之前方,用以供置放盛裝制 I C之料盤; 移料裝置4 0 :係設於測試台2 〇之兩侧方,用以移載j Ϊ气f ΐ2:係設於入料裝置3。之财,用以加熱待測I’c ; …測至6 0 v係將測試台20罩置於内,以提供一氣密性良好 之高溫作業環境; 載送裝置7 0 :係設_試台2 〇之另二侧方,用以載送待測/ 完測I C ; 視覺裝置8 0:係設於熱測室6 0之外部且相對應測試台2 〇位 置,用以掃瞄測試台2 〇 ; 檢測裝置9 G ··係設於熱測室6 0之外部,用以於載送裝置7 〇 及測試台2 0間移载待測/完測Ic ; 出料裝置1〇 〇 ·係设於測試台2 〇之前方,用以供置放盛裝完 測I C之料盤; 備用置盤裝置11〇:用以承載空料盤; 以下係為本發明執行I c檢測之-種實施例,請參閱第 二5圖所示,該人料裝置3 G伽馬達3 i作為驅動源驅動一 皮帶輪組3 2,令皮帶輪組3 2帶動轴桿_之輸送帶组3 3轉 1283649 ,“帶動且具==座”⑵動=5 ’並利 置其 - ^叙道i1之固定導板3 91底面設有虹3 9 2,、並供裝設 置係導ϊ:=3!^相對應導桿3 9 ^1位 方5 動位移,進而當料盤輸送至導正機構3 9之侧 ^款° :制壓缸3 9 2之活塞桿向前凸伸以帶動活動導板3 9 板3 9 3即利用導槽3 9 3 1沿固定導板3 9 ^ 911移動,而頂抵於料盤之側面及角部,並以捲举 ,,為靠置基準面而可有效調整料盤之擺置肖度,以供移料置、 4 0可準確取出料盤中之待測I匚; 請參閱第2、6〜1〇圖所示,該移料裝置4〇係於測試台 2 0之兩側分別設有第一取料機構41及第二取料機構4 3,^ 一、二取料機構41、4 3各設有一第一方向移動結構,各第一 方向移動結構係於第一方向機架内架設一由馬達4丄丄、4 3工 驅動之皮帶輪組412、4 3 2,並於皮帶輪組412、4 3 2 上連結一活動架413、4 3 3,該活動架413、4 3 3以第 一方向滑座414、434滑置於機架頂面之第一方向滑軌 415、4 3 5上,並於活動架413、4 3 3之底面各裝設一 第二方向移動結構,該第二方向移動結構係於活動架413、 4 3 3之底面設有一第二方向機架416、4 3 6,並於第二方 向機架416、4 3 6上設有一由馬達417、4 3 7驅動之皮 帶輪組418、4 3 8,且於皮帶輪組418、4 3 8上連結一 1283649 可作第三方向位移之取放器419、4 3 9,該取放器4 χ 9、 4 3 9之底面設有吸頭,另於第二方向機架4玉6、4 3 6之 面設有第二方向滑軌42 0、440供取放器419、4 3 9之1283649 IX. Description of the Invention: [Technical Field] The present invention relates to a steerable tray for accurately loading and unloading Ic, and saving the configuration space of the material moving device, thereby reducing the volume of the machine and preventing 1C test sorter with Ic damage and improved inspection quality. [Prior Art] Nowadays, after the manufacturer completes the integrated circuit (Ic), it will use an IC detection classifier to perform circuit detection operations to detect whether the IC is damaged during the production process and eliminate it. For the good product, please refer to Figure 1 for the Taiwan Patent Application No. 88212975 "Integrated Circuit Testing Organization" Patent Case. The testing mechanism is equipped with a test bench 1 for detecting ICs and a feeding device. The system is disposed before the test bench 1 to carry the jc to be tested, and is disposed on both sides of a transport platform 3 with a conveyor belt 4, which can be placed and placed for testing! c ^ tray, 俾 料 料 送 送 舰 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The reclaiming mechanism 7 and 8 are respectively transferred to the machine table:==shift 2=first-direction displacement, and then the pick-up device 1 of the moving device J is transferred to the fine IC first to the mechanism 7 The material is loaded to the carrying device 13, the load (4); ff1 2 is heated, and then the IC is moved to the first and second carrying mechanisms 14, 15 and 3, and the two sides of the test stand 1 are provided with 1c to be carried to The side of the test bench 1 , the first carrier 14 can be used to test the upper part, and the pick-up device 7 is placed on the test bench 1 to transfer the IC to be tested to the test bench. 1 and 2, the planting device 13 is displaced, and then the test IC is transferred to the second detecting operation, and the IC detecting and finishing mechanism 15 is moved to remove the detecting device 1283649 1β for the first reclaiming mechanism 8 The completion test is transferred to the discharge device 18, and the detection result is classified and stored; however, the detection mechanism has the following defects in use: 1 · The feeding device 2 is only on the side of the conveyor belt 4 Putting a tray on top of a cylinder 5, 1 Pressing red 5 does not effectively and correctly guide the skewed tray, so that when the material is transferred to the preset position, it is still skewed, and the picker 1i cannot be accurately aligned. 〗 〖 to be tested, resulting in the inconvenience of accessing 〗 〖. 2. The loading device 6 is erected in the second direction on both sides of the machine table. ” erecting the first-direction moving structure 1 〇, but the second; = constituting 3 = increasing the volume of the machine H to the ground, which is not conducive to fine places Space configuration. 3 · = „, transfer the IC to the heating device 丄 2 is the analog 1 ^ working temperature, but the test bench! However, in the open-air normal temperature = test operation, the miscellaneous I c has no secret to compensate for the working temperature deviation test, resulting in the lack of good test quality. Μ下进 4 ·The damage may be left in the test bench i! Foreign matter such as debris or dust, but the user can not immediately know and quickly eliminate, easy, • [in the inside J], the increase in the rate of bad shell and the lack of test quality. Material loading ==: 3⁄4 disk division =, 俾 to use the accurate extraction! C 'reach convenience 2 33 2 for the direction of the shift to f, in the first - = = set space 'to achieve the reduction of the machine 1283649 temperature to perform the test For the *, _ upgrade 1c detection quality of the ancient one again _ the purpose is to set the test station on the test device position on the test device, and transfer the scan cat signal to the controller, the continuation 'can quickly exclude foreign matter' After preventing her fIC, she knows that it can achieve the practical benefit of reducing the Ic damage rate. Test: The 1 c test split fiber, including: The feeding device is placed in front of the test bench, and the Wei is placed for recording 1 c material: the sides of the platform are used to transfer the test to be tested/completed 1 C In the hood, the other side of the test bench is provided to provide the high temperature and good temperature for carrying the test/test IC. , · Bu, ribs on the carrying device and the shifting visual device between the stations: The external and the test bench position is used to sweep the cat discharge device ·= in front of the test bench for the placement of the 1 C material reserve tray device: Xiao IX is equipped with an empty tray. Guided positive test: The feeding device further includes a guiding mechanism for accurately picking up I C for the scraping device. Each reclaiming material "discloses the re-feeding device to include two sets of reclaiming mechanisms, and the structure can be suspended under the structure of the first structure - the second direction moves the product to facilitate the use of the space space of the space to achieve a reduction in the machine body. The sorting device further comprises a guiding mechanism for the displacement of the 1283649 guiding tray to facilitate the accurate placement of the ic by the loading device. The above IC testing sorting machine further includes the first and second The transfer mechanism 'is closed on the stage of each transfer mechanism with a closed test chamber, so that the thermal test chamber forms a good airtightness _, *' to improve the accuracy of the test. Environment, [Embodiment] Let the review committee (4) make the fortune more advanced - understand the example and cooperate with the schema, and the details are as follows: 芈 隹 = = 图 图 图 图 图 图 图 图 图 图 图 图 图Test stand 2 0: used to test IC; Feeding device: BG: Before the 2G in the service station, it is used to place the tray of the packaged IC; The transfer device 4 0: is set on the test stand 2 〇 The two sides are used to transfer j Ϊ gas f ΐ2: it is installed in the feeding device 3. Heating to be tested I'c; ...measured to 60 v to place the test bench 20 inside to provide a high-temperature working environment with good air tightness; carrier device 7 0: tie _ test stand 2 Side, for carrying the test/test IC; Vision device 80: is located outside the thermal chamber 60 and corresponds to the test station 2 , position for scanning the test bench 2 〇; G ·· is located outside the thermal test chamber 60 for transferring the test/test Ic between the carrier device 7 and the test bench 20; the discharge device 1〇〇 is set on the test bench 2 In the past, the tray for placing the test IC is placed; the spare tray device 11〇: for carrying the empty tray; the following is an embodiment of the present invention for performing Ic detection, see the second In the figure 5, the human material device 3G gamma motor 3 i is used as a driving source to drive a pulley set 3 2, so that the pulley set 3 2 drives the shaft _ the conveyor belt set 3 3 to 1283649, "carrying and having == seat "(2) Move = 5 ' and set it - ^ Xudao i1 fixed guide plate 3 91 has a rainbow 3 9 2 on the bottom, and the installation system guide: = 3! ^ corresponding guide 3 9 ^ 1 Bit 5 dynamic displacement, and then as a tray It is conveyed to the side of the guiding mechanism 39. °: The piston rod of the cylinder 3 9 2 protrudes forward to drive the movable guide plate 39. The plate 3 9 3 is guided by the guide groove 3 9 3 1 along the fixed guide plate 3 9 ^ 911 moves, and the top is offset to the side and corner of the tray, and is rolled up, which can effectively adjust the placement of the tray for the reference surface to be used for the material shifting, 4 0 can be accurate The first pick-up mechanism 41 and the second are respectively disposed on the two sides of the test bench 20, respectively, as shown in the second and sixth figures. The reclaiming mechanism 4 3, ^ 1 and 2 reclaiming mechanisms 41, 4 3 are each provided with a first direction moving structure, and each of the first direction moving structures is erected in the first direction frame by a motor 4 丄丄, 4 3 The pulleys 412, 433 are driven, and a movable frame 413, 433 is connected to the pulley sets 412, 433, and the movable frames 413, 433 are slid in the first direction sliding seats 414, 434. The first direction sliding rails 415 and 435 are disposed on the top surface of the rack, and a second direction moving structure is disposed on the bottom surfaces of the movable frames 413 and 433. The second direction moving structure is attached to the movable frame 413. , the bottom of 4 3 3 A second direction frame 416, 436, and a second direction frame 416, 436 are provided with a pulley set 418, 433, driven by motors 417, 433, and on the pulley set 418. 4 3 8 is connected to a 1283649, which can be used as a third direction displacement picker 419, 4 3 9, the pick-and-place 4 χ 9, 4 3 9 has a suction head on the bottom surface, and the second direction frame 4 The surface of the jade 6, 4 3 6 is provided with a second direction slide rail 42 0, 440 for the pick and place device 419, 4 3 9

=-方向α座4 21、4 41滑置組裝,進而可控制第一取料機 構41之馬達417驅動皮帶輪組418,而帶動取放器4工9 作第二方向位移至入料裝置3 0處,並令取放器4 χ 9之吸頭下 降而^料盤中之待測〗c,以便將〗。移载至加熱裝置$ 〇處; 請參閱S 1 1圖所示,由於加熱裝置5⑽為常見之設計, ^贅述,該第—取料機構41之馬達411即驅動皮帶輪組 412而帶動第二方向移動結構及取放器4丄9作第一方向位 移嫌再令第二方向移動結構之馬達417驅動皮帶輪組418, 而帶動取放H4 1 9作第二方向轉至加齡£5 Q 置人於加熱裝置5 〇内,進而使! C處於模擬工 艰*兄, s 閱第12〜14圖所示,該熱測室6 Q係將測試台2 0 31‘2:並?内部設有發熱件61,且以鼓風機62將發孰件 吹送於室内循環,而熱測室6 0之底面則設有 機分ΐ設置載送裝置7 〇之第—移載機構7 1及 移載機構係以馬達7 1 1、7 2 1驅動一 1 2、72 2,而帶動一載台7 1 3、7 2 3作第- 及巧Γ/3、7 2 3上設有二封板714Α ILi拍iI24A、7 24Β,並以封板714Α及7 2 4Α 部頂面二3:2之通道6 3、6 4封閉,另於熱測室6 0之外 ^ η在^裝置8 〇及檢測裝置9 0,其中,該視覺裂置 台2。之位置,而可為一c CD 8 1,該 第一、一取一取料機構9 1及第二取料機構9 3,該 ί帶輪:9 3各別以馬達9 1 1、9 3 1驅動-q3 9作動^健-9 32,而傳動一第三方向螺桿913、 9 3 3作動,該第三方向螺桿9 i 3、9 3 3則供—支架9工4、 1283649 934之螺套915、935螺合組装,該支架914、934 之側面則設有第二方向滑軌916、9 3 6供一取放器9工7、 ^ 3 7頂面之第二方向滑座918、9 3 8滑置組裝°,該取放器 917、9 3 7之底面係没有吸頭,並於侧面設有第三方向滑軌 9 19、9 3 9供一連結架9 20、94 0之第三方&滑座 92 1、94 1滑置組裝,該連結架9 2 0、94 0則連结於一 由馬達9 2 2、9 4 2傳動之第二方向螺桿9 2 3、9 4 3,而 後令取放器917、9 3 7及吸頭由熱測室6 〇頂面之滑槽6 5 置入於内,並於取放器917、9 3 7之兩侧各連結一環狀封帶 9 2 4、9 44,用以將滑槽65封閉,使熱測室6〇形成一氣 密性良好之高溫作業環境; 請參閱第15圖所示,第一取料機構41係控制取放器 419將加熱裝置5 0上之待測IC移載至第一移載機構71之 載台713上,該第一移載機構71之馬達71χ即驅動皮帶輪 組712,而帶動載台713位移至熱測室6 〇内,將Ic載送 至測試台2 0之侧方,此時,請參閱第丄6圖所示,使用者可控 制C CD 81依使用所需而採隨機檢測方式,對測試台2 〇進行 知瞒,並將知猫訊號傳輸至控制|§ (圖中未示出),以檢測出測試 台2 0之内部是否殘留有受損Ί C餘屑或灰塵等;異物=== _ 測試台2 0具有異物,即可事先將異物排除,以防止後續置入之 I C壓抵於異物而造成損壞,以大幅降低Ic損壞率,請參閱第 17、18圖所示,當C C D 81執行掃瞄測試台2 〇完畢後, 該第一取料機構91係以馬達911驅動皮帶輪組912及第三 方向螺桿913,而帶動支架914及取放器917作第三方向 下降位移,令取放器917之吸頭吸取第一移載機構71載台 713上之待測IC,並向上位移復位,而後該第一取料機構 91之馬達9 2 2即驅動第二方向螺桿9 2 3,令連結架g 2 0 頂推取放器917作第二方向位移,使取放器917之吸頭將I C移載至測試台2 0之上方,再以馬達9 χ1驅動取放器9工7 11 1283649=- direction α seat 4 21, 4 41 is slip-assembled, and then the motor 417 of the first reclaiming mechanism 41 can be controlled to drive the pulley set 418, and the pick-and-place device 4 is driven to shift in the second direction to the feeding device 30. At the same time, and let the tip of the pick-up device 4 χ 9 drop and the test piece in the tray is to be tested. Transfer to the heating device $ ;; Please refer to the figure S 1 1 , since the heating device 5 ( 10 ) is a common design, the motor 411 of the first reclaiming mechanism 41 drives the pulley set 412 to drive the second direction The moving structure and the pick-and-place device 4丄9 are used for the first direction displacement, and the motor 417 of the second direction moving structure drives the pulley set 418, and drives the pick and place H4 19 as the second direction to the ageing £5 Q. In the heating device 5 ,, and then make! C is in the simulation workman's brother, s see the picture 12~14, the thermal test chamber 6 Q is the test stand 2 0 31'2: and the inside is provided with the heat generating member 61, and the blower 62 will be worried The parts are blown in the indoor circulation, and the bottom surface of the thermal measuring chamber 60 is provided with a machine-divided setting carrier device 7 - the transfer mechanism 7 1 and the transfer mechanism are driven by the motor 7 1 1 , 7 2 1 2, 72 2, and drive a stage 7 1 3, 7 2 3 for the first - and smart / 3, 7 2 3 with two plates 714 Α ILi shot iI24A, 7 24 Β, and with the cover 714 Α and 7 2 4 Α The top surface of the second 3:2 channel 6 3, 6 4 is closed, and the other is in the thermal chamber 60 0 ^ η in the device 8 〇 and the detection device 90, wherein the visual cleavage table 2. The position may be a c CD 8 1, the first, the first take-out mechanism 9 1 and the second reclaiming mechanism 9 3, the LY pulley: 9 3 each with a motor 9 1 1 , 9 3 1 drive-q3 9 actuation ^ Jian-9 32, and the drive a third direction screw 913, 9 3 3 actuation, the third direction screw 9 i 3, 9 3 3 for the bracket 9 work 4, 1283649 934 screw The sleeves 915 and 935 are screw-assembled, and the sides of the brackets 914 and 934 are provided with second direction slide rails 916 and 936 for a pick-and-placer 9 and a third direction slide 918 of the top surface. , 9 3 8 sliding assembly °, the bottom surface of the pick-and-place 917, 9 3 7 has no suction head, and the third direction sliding rail 9 19, 9 3 9 is provided on the side for a connecting frame 9 20, 94 0 The third-party & slides 92 1 , 94 1 are slidably assembled, and the link frames 9 2 0 and 94 0 are coupled to a second-direction screw 9 2 3, 9 driven by motors 9 2 2, 9 4 2 4 3, and then the pick-and-place 917, 9 3 7 and the suction head are placed in the chute 65 of the top surface of the thermal chamber 6 and are connected to each other on both sides of the pick-and-place 917, 913 The annular sealing strips 9 2 4 and 9 44 are used to close the chute 65 to form a high temperature tightness of the thermal chamber 6 Referring to FIG. 15, the first reclaiming mechanism 41 controls the pick-and-placer 419 to transfer the IC to be tested on the heating device 50 to the stage 713 of the first transfer mechanism 71, the first The motor 71 of the transfer mechanism 71 drives the pulley set 712, and the driven stage 713 is displaced into the thermal chamber 6 ,, and Ic is carried to the side of the test stand 20, at this time, please refer to Fig. 6 In the display, the user can control the C CD 81 to use the random detection method according to the use, to know the test station 2, and transmit the known cat signal to the control|§ (not shown) to detect the test. Whether there is any damaged ΊC residual dust or dust inside the table 20; foreign matter === _ Test stand 2 0 has foreign matter, you can remove foreign matter in advance to prevent the subsequent IC from being pressed against foreign matter Damaged to greatly reduce the Ic damage rate, as shown in Figures 17, 18, after the CCD 81 performs the scan test station 2, the first reclaim mechanism 91 drives the pulley set 912 and the third with the motor 911. The direction screw 913 drives the bracket 914 and the pick-and-place 917 to perform a third direction downward displacement, so that the nozzle of the pick-and-placer 917 The IC to be tested on the stage 713 of the first transfer mechanism 71 is sucked and reset by upward displacement, and then the motor 92 2 of the first reclaiming mechanism 91 drives the second direction screw 9 2 3 to connect the frame g 2 0 The push-pull picker 917 is displaced in the second direction, so that the suction head of the pick-and-placer 917 transfers the IC to the top of the test stand 20, and then drives the pick-and-place device with the motor 9 χ1. 7 11 1283649

放器9 1 7即以第三方向滑執9 1 9沿連 置=冗=向:座9 2 1下降,而將吸頭上之待測I C 畢後請3第圖所示,當1。於測試台2 〇内檢測完 7 構7 2之馬達7 21係驅動皮帶輪組 7 2 3上之翁7 9^ 72 3移動至熱啦6 G内,並以載台 性2通道6 4封閉,使熱測室60均保持 取放器9 1 =境’而後第一取料機構9 1即控制The slider 9 1 7 slides in the third direction 9 1 9 along the connection = redundant = direction: the seat 9 2 1 descends, and the I C after the measurement on the tip is shown in the figure 3, when 1. In the test stand 2, the 7 7 motor 7 is detected. The 21 series drive pulley set 7 2 3 on the Weng 7 9^ 72 3 moves into the hot 6 G, and is closed by the carrier 2 channel 6 4 , Keeping the thermal chamber 60 in the picker 9 1 = environment ' and then the first reclaiming mechanism 9 1 is controlled

第二移載機構7 2之上方,而可將完測I C 6 0,'^U -取2 2將完測1❻載出熱測室 以供將下—細ί;:^4機構9 3則移動至測試台2 0之上方, \參閱第^ ^於測試台2 0内執行測試作業; 7 2 i將完測J 二移^構”即控制載台 ^ ^^卩叫達^ 3m機輪構組4 3取 移,再以馬達4 3 7驅動皮帶器84 作第一方向位 二移載_ 2¾台=器= 頭下降以吸取完測Ic,一^ 1 ο 10 2帶動軸桿兩侧之輸送帶組1〇動皮帶輪組 間則設有以綠1 G她動_動^Above the second transfer mechanism 7 2, the IC 60 can be completed, and the ^^U - 2 2 will be completed and 1 ❻ will be carried out to the thermal chamber for the next - fine; : ^ 4 mechanism 9 3 Move to the top of the test bench 2 0, \ see the ^ ^ test test in the test bench 2 0; 7 2 i will complete the test J two transfer structure ^ control the stage ^ ^ ^ 卩 call up ^ 3m wheel The configuration 4 3 is removed, and then the motor 44 3 is driven to drive the belt 84 as the first direction and the second position is transferred. _ 23⁄4 == head = head down to absorb the measured Ic, one ^ 1 ο 10 2 to drive the sides of the shaft The conveyor belt group 1 is provided with a green belt and a green belt.

1283649 升降位移,並於兩侧機架上設有具擺動塊之承置件i 6,用以 ,擺置盛裝完測I C之料盤,為便於區別各料盤盛裝之〗c檢測 等級,係可以料盤顏色作一區分,例如以黑色料盤用以盛裝不良 品I C,而以彩色料盤用以盛裝良品J c,另於出料裝置丄〇 〇 之機架頂面適當位置設有導正機構i 〇 7,由於該導正機構 107之設計相同於出料機構30之導正機構39,故在此不予 贅述,因此,第二取料機構4 3即以馬達4 3 ;[帶動活動架 4 3 3及取放器4 3 9等作第一方向位移,再以另一馬達4 3 7 帶動取放器4 3 9及IC作第二方向位移,並依檢測結果將 IC擺放至指定之料盤中,當料盤盛裝滿〗c後,即由輸送帶組 10 3輸送至頂座1〇 5上,而後壓缸1〇 4即驅動頂座1〇 5 ϊΐϊ盤上升,而將料盤擺置於承置件1〇 6上收置,以完成出 請參閱第2 4、2 5圖所示,該入、出料裝置3 〇、1〇 〇 間,設有-備用置盤裝置i i Q,其設有_底面具第二方向滑軌 組1^ 2之承板111,用以供承置空料盤,並於承板i ^工侧 方之橫向機架上以馬達i i 3驅動_皮帶輪組!i 4,而帶動一 具壓缸116之連結架115,並以壓缸116連結一取放器 士17,使取放器117可作第三方向位移,另於取放器丄工7 f橫,機,_設有—第_方向滑執組1 1 8用以辅助滑移作 可㈣G處之料盤,其盛裝之1 C被取用完畢時, ,盤裝置1 1 Q之馬達1 1 3驅動皮帶輪組1 1 4, iL 4器11 7作第—方向位移,將空料盤移載至承板 ,而承板1 1 1上亦可放置不同顏色之料盤,由取 载至出料裝置10 0處,用以補充作為盛裝完測 ICf科盤,達到便利承置及補置空料盤之實用效益。 。,本發卿具實祕及進步性,絲見有相同之產 ασ A 4,從而允符發明專利申請要件,爰依法提出申請。 13 1283649 第l 第2圖 第3圖 第4圖 第5圖 第6圖 第7圖 第8圖 第9圖 第1 第1 【圖式簡單說明】 圖··習式第88212975號專利案各裝置之配置圖。 第2圖:本發明各裝置之配置圖。 係入料裝篁之前視圖。 係入料裝置之俯視圖。 係入料裝置之導正機構使用示意圖。 係移料裝置之俯視圖。 係各取料機構之第一方向移動結構示意圖。1283649 Lifting and displacement, and mounting brackets i6 with swinging blocks on the two sides of the frame for placing the trays for the ICs in order to distinguish the detection level of each tray. The color of the tray can be differentiated, for example, the black tray is used to hold the defective IC, and the color tray is used to hold the good product J c, and the guide is placed at the appropriate position on the top surface of the rack. The positive mechanism i 〇7, since the design of the guiding mechanism 107 is the same as that of the guiding mechanism 39 of the discharging mechanism 30, it will not be described here. Therefore, the second reclaiming mechanism 4 3 is driven by the motor 4 3 ; The movable frame 4 3 3 and the pick-up device 4 3 9 are displaced in the first direction, and then the other motor 4 3 7 drives the pick-and-place device 4 3 9 and the IC to be displaced in the second direction, and the IC is placed according to the detection result. In the designated tray, when the tray is full, the conveyor belt 10 3 is transported to the top seat 1〇5, and the rear cylinder 1〇4 drives the top seat 1〇5 to rise. The tray is placed on the mounting member 1〇6 to be completed, so as to complete the drawing, as shown in the figure 2, 4, 5, the inlet and outlet devices 3 〇, 1〇〇 , a backup tray device ii Q is provided, which is provided with a bottom plate 111 of the second direction slide rail group 1 2 for supporting the empty tray and on the side of the carrier Drive the motor ii 3 on the horizontal frame _ pulley set! i 4, while driving a connecting frame 115 of the pressure cylinder 116, and connecting a pick-and-place device 17 with the pressure cylinder 116, so that the pick-and-placer 117 can be displaced in the third direction, and the pick-and-place device is completed. , machine, _ set - the _ direction sliding group 1 1 8 is used to assist the slip as the tray of the (4) G, when the 1 C of the container is taken, the motor 1 1 of the disk device 1 1 3 drive pulley set 1 1 4, iL 4 11 7 for the first direction displacement, the empty tray is transferred to the carrier, and the tray 1 1 1 can also be placed in different color trays, from the loading to the out At 10 o'clock, it is used to supplement the utility of the ICf as a complete instrument to achieve the practical benefits of placing and replenishing empty trays. . The hair of the hair is secret and progressive. The silk has the same production ασ A 4, thus allowing the invention patent application requirements, and applying according to law. 13 1283649 1st 2nd, 3rd, 4th, 5th, 6th, 7th, 8th, 9th, 1st, 1st, 1st [Simplified illustration] Fig. 8th Patent Application No. 88212975 Configuration diagram. Fig. 2 is a layout view of each device of the present invention. The front view of the feed assembly. A top view of the feeding device. A schematic diagram of the use of the guiding mechanism of the feeding device. A top view of the shifting device. A schematic diagram of the movement of the first direction of each reclaiming mechanism.

係第一取料機構之第二方向移動結構示意圖。 π係第二取料機構之第二方向移動結構示意圖。 〇圖:係移料裝置取料之示意圖。 =ϋ圖:係移料裝置將IC移載至加熱裝置之示意圖。 第t ^圖:·係熱測室、载送裝置、檢測裝置及視覺裝置之前視圖 第1 4 ^ :係熱測室、载送裝置、檢測裝置及覺裝置之側視圖 =·係熱測室、載送裝置及視覺裝置之局部俯視圖。 G = 軸送裝置栽人1C之制示意圖。 第1 7圖::ίίίί掃瞄測試台之使用示意圖。 第工8圖由$一移載機構上移載1 C之使用示意廣 第1 9圖將1 C移載至測試台之使用示意圖。 第2 〇圖:係檢;之使用示意圖。 _。將元測1c移载至第二移栽機構之使用 第21圖:你箓- 囷、。-載機構將完測I C移載出熱測室之使用示 第2 2圖··係第二& 第2 3圖:係“裝C移載至*料裝置之示意圈 局部不意圖。 1283649 第2 4圖:係備用置盤裝置之俯視圖。 第2 5圖:係備用置盤裝置之局部侧視圖。 第二取料機構:4 3 皮帶輪組:412、4 3 2 第一方向滑座:4 14、434 第一方向滑執:415、43 5 第二方向機架:416、4 3 6 【主要元件符號說明】 〔習式〕 測試台:1 輸送台· 3 壓缸:5 第一取料機構:7 第二方向移動結構:9 取放器:11 載送裝置:13 第二載送機構:15 取放器:17 〔本發明〕 測試台:2 0 入料裝置:3 0 皮帶輪組:3 2 馬達:3 4 承置件:3 6 固定導板:371 壓缸:3 7 2 頂部:3 7 31 移料裝置:40 入料裝置:2 輸送帶:4 移料裝置:6 第二取料機構:8 第一方向移動結構:10 加熱裝置:12 第一載送機構:14 檢測裝置:16 出料裝置:18 馬達:3 1 輸送帶組:3 3 頂座:3 5 導正機構:3 7 導桿:3 7 1 1 活動導板:373 導槽:3 7 3 2 第一取料機構:41 馬達:411、4 31 活動架:413、4 3 3 15The schematic diagram of the second direction moving structure of the first reclaiming mechanism. Schematic diagram of the second direction moving structure of the π-based second reclaiming mechanism. 〇图: A schematic diagram of the material picking device. = ϋ diagram: A schematic diagram of the transfer device moving the IC to the heating device. Figure t: Figure: Front view of the thermal test chamber, carrier device, detection device and vision device. 1 4 ^ : Side view of the thermal chamber, carrier device, detector device and sensor device =· Thermal test room A partial top view of the carrier device and the vision device. G = Schematic diagram of the 1C system of the shaft feeding device. Figure 17:: Use of the ίίίί scan test bench. Figure 8 shows the use of 1 C transfer from a transfer mechanism. Figure 1 shows the use of 1 C transfer to the test bench. Figure 2: Checking the system; _. Transfer the meta-test 1c to the second transplanting mechanism. Figure 21: You 箓- 囷,. - The use of the load-bearing mechanism to transfer the test IC out of the thermal test chamber is shown in Fig. 2 2······························· Figure 24: Top view of the spare tray device. Figure 25: Partial side view of the spare tray device. Second take-up mechanism: 4 3 Pulley set: 412, 4 3 2 First direction slide: 4 14,434 First direction slip: 415, 43 5 Second direction Rack: 416, 4 3 6 [Main component symbol description] [Live] Test bench: 1 Conveyor table · 3 Cylinder: 5 First take Material mechanism: 7 Second direction moving structure: 9 Pick and place device: 11 Carrier: 13 Second carrier: 15 Pick and place: 17 [Invention] Test bench: 2 0 Feeding device: 3 0 Pulley set :3 2 Motor: 3 4 Mounting: 3 6 Fixed guide: 371 Pressing cylinder: 3 7 2 Top: 3 7 31 Transfer device: 40 Feeding device: 2 Conveyor belt: 4 Transfer device: 6 Second Reclaiming mechanism: 8 First direction moving structure: 10 Heating device: 12 First carrying mechanism: 14 Detection device: 16 Discharging device: 18 Motor: 3 1 Conveyor belt group: 3 3 Block: 3 5 Guide mechanism: 3 7 Guide rod: 3 7 1 1 Activity guide: 373 Guide groove: 3 7 3 2 First reclaim mechanism: 41 Motor: 411, 4 31 Mobile frame: 413, 4 3 3 15

馬達:9 2 2、9 4 2 封帶:9 24、9 44 出料裝置:100 皮帶輪組·· 1 〇 2 壓虹:10 4 承置件:10 6 傷用置盤裝置:11〇 第二方向滑執組:112 1283649 馬達·· 4 1 7、4 3 7 皮帶輪組:4 1 8、4 3 8 取放器:419、4 3 9 第二方向滑軌:4 2 0、4 4 0 第二方向滑座:421、441 加熱裝置:5 0 熱測室:6 0 發熱件·· 6 1 鼓風機:6 2 通道:6 3、6 4 滑槽:6 5 載送裝置·· 7 0 第一移載機構:7 1 第二移載機構:7 2 馬達·· 7 1 1、7 2 1 皮帶輪組:712、722載台:713、723 封板·· 714A、714B、724A、724B 視覺裝置:80 CCD:81 檢測裝置·· 9 0 第一取料機構:9 1 第二取料機構:93 馬達:911、931 皮帶輪組:9 1 2、9 3 2第三方向螺桿:913、9 3 3 支架·· 9 1 4、9 3 4 螺套:9 1 5、9 3 5 第二方向滑軌·· 9 1 6、9 36 取放器:9 1 7、9 3 7 第二方向滑座·· 9 1 8、9 3 8 第三方向滑軌:919、9 3 9 連結架:9 2 0、9 4 0 第三方向滑座·· 9 2 1、9 4 1 第二方向螺桿:9 2 3、9 4 3 馬達:1〇1 輸送帶組·· 1 〇 3 頂座:10 5 導正機構:1〇 7 承板:111 16 1283649 :架器 達結放 馬連取 7 皮帶輪組:114 壓缸:116 第一方向滑軌組:118 17Motor: 9 2 2, 9 4 2 Sealing strap: 9 24, 9 44 Discharge device: 100 Pulley set · · 1 〇 2 Pressure rainbow: 10 4 Bearings: 10 6 Injury setting device: 11 〇 second Directional slip group: 112 1283649 Motor·· 4 1 7、4 3 7 Pulley set: 4 1 8、4 3 8 Pick and place: 419, 4 3 9 Second direction slide: 4 2 0, 4 4 0 Two-direction slide: 421, 441 Heating device: 5 0 Thermal chamber: 6 0 Heat-generating parts · 6 1 Blower: 6 2 Channel: 6 3, 6 4 Chute: 6 5 Carrier device ····················· Transfer mechanism: 7 1 Second transfer mechanism: 7 2 Motor·· 7 1 1、7 2 1 Pulley set: 712, 722 stage: 713, 723 cover plate · · 714A, 714B, 724A, 724B Vision device: 80 CCD:81 Detection device·· 9 0 First reclaiming mechanism: 9 1 Second reclaiming mechanism: 93 Motor: 911, 931 Pulley set: 9 1 2, 9 3 2 Third direction screw: 913, 9 3 3 Bracket·· 9 1 4, 9 3 4 Screw sleeve: 9 1 5, 9 3 5 Second direction slide ···································· · 9 1 8, 9 3 8 Third direction slide: 919, 9 3 9 Link: 9 2 0, 9 4 0 Third direction Block·· 9 2 1、9 4 1 Second direction screw: 9 2 3, 9 4 3 Motor: 1〇1 Conveyor belt set·· 1 〇3 Top seat: 10 5 Guide mechanism: 1〇7 Carrier plate: 111 16 1283649 : The frame is reached and the horse is taken. 7 Pulley set: 114 Cylinder: 116 First direction slide set: 118 17

Claims (1)

1283649 十、申請專利範圍: 1 · 一種I c測試分類機,包含: 測試台:係用以測試I c ; 入料裝置:係設於測試台之前方,用以供置放盛裝待測I c ^ 之料盤,並具有導正機構用以導正料盤; 移料裝置:係設於測試台之侧方用以移載I c,包含有至少 一取料機構,該取料機構係於第一方向移動結構 之下方設有一具取放器之第二方向移動結構; 载送裝置:係設於測試台之另侧方,用以載送待測/完測J • C ; 檢測裝置:係設於測試台之上方,用以於載送裝置及測試台 間移載IC; 出料裝置:係設於測試台之前方,用以供置放盛裝完測J c 之料盤,並具有導正機構用以導正料盤。 2 · ^申請專利範圍第丄項所述之! 〇測試分賴,其中,該入 =置之導正機構係設有—具導桿之gj定導板,供裝設一活 ,導板,該活動導板於相對應導桿位置設有導槽,另於固定 導板之底面設有壓缸用以帶動活動導板位移。 3請專利範圍第1項所述之10測試分類機,其中,該移 第:方向移動結構係以驅動源驅動二活 方向移動結構係以另-驅動源驅動取 4 ·依申請專利範圍第1項所述之〗c測試分類機 送有至少一移載機構’該移載機構係以驅 一载台作第一方向位移用以载送J C。 動源驅動 5 .依申請細第1項所述之J c測試分類機, 測裝置係试有至少一取料機構,該取料機構係i k 一取放器作第二、三方向位移,用以於载送ί置 18 1283649 移載I C。 6 7 依申請專利範圍第1項所述之Ic測試分類機,其中,該出 料裝置之導正機構係設有一具導桿之固定導板,供裝設一活 動導板,該活動導板於相對應導桿位置設有導槽,另於固定 導板之底面設有壓缸用以帶動活動導板位移。 8 9 ,申請專利範圍第1項所述之I C測試分類機,更包含於測 之外部設有一具發熱件及鼓風機之熱測室,用以提供測 试σ於氣雄、性良好之南溫作業環境執行測試作業。 專鄕卿1項所述之1 C峨分賴,更包含於檢 設有—視覺裝置,該視餘置可為—C C D,用以 掃瞄測試台内是否有異物。 職置之侧方汉有加熱裝置,用以加熱待測J c。 191283649 X. Patent application scope: 1 · An I c test classification machine, including: test bench: used to test I c ; feeding device: set in front of the test bench for placement and testing I c ^The tray has a guiding mechanism for guiding the tray; the material feeding device is disposed on the side of the test bench for transferring the Ic, and includes at least one reclaiming mechanism, the reclaiming mechanism is attached to A second direction moving structure of the pick-and-place device is disposed below the first direction moving structure; the carrying device is disposed on the other side of the test bench for carrying the test/finish J/C; the detecting device: The system is disposed above the test bench for transferring the IC between the carrying device and the test bench; the discharging device is disposed in front of the test bench for placing the tray for receiving the J c and having The guiding mechanism is used to guide the tray. 2 · ^ Apply for the patent scope as described in item !! 〇 test is divided, wherein the guiding mechanism of the input=setting is provided with a gj guiding plate with a guiding rod for installing a living guide plate, and the movable guiding plate is provided with a guide at the position of the corresponding guiding rod The groove is provided with a pressure cylinder on the bottom surface of the fixed guide plate for driving the displacement of the movable guide plate. 3 Please refer to the 10 test sorting machine described in the first item of the patent scope, wherein the shifting direction: the moving structure is driven by the driving source to drive the two active direction moving structure to drive by another driving source. 4 The c test sorting machine described in the item is provided with at least one transfer mechanism 'the transfer mechanism is configured to drive the first stage for displacement of the JC. Dynamic source drive 5. According to the J c test sorting machine described in the first item of the application, the measuring device is tested with at least one reclaiming mechanism, and the reclaiming mechanism is an ik pick and place device for second and third direction displacement, In order to carry the ί set 18 1283649 transfer IC. 6 7 The Ic test sorting machine according to item 1 of the patent application scope, wherein the guiding mechanism of the discharging device is provided with a fixed guiding plate with a guiding rod for installing a movable guiding plate, the movable guiding plate A guide groove is arranged at the position of the corresponding guide rod, and a pressure cylinder is arranged on the bottom surface of the fixed guide plate for driving the displacement of the movable guide plate. 8 9 . The IC test classification machine mentioned in item 1 of the patent application scope includes a heat test room with a heat generating component and a blower outside the test to provide a test σ in the air and a good south temperature. The job environment performs a test job. The 1 C峨 所述 所述 1 , , , , , , , , , , , , , 1 1 1 1 1 1 1 1 1 1 1 1 1 视觉 视觉 视觉 视觉 视觉 视觉 视觉 视觉 视觉 视觉 视觉 视觉 视觉 视觉 视觉The side of the job has a heating device to heat the J c to be tested. 19
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