CN111715542A - An all-in-one machine for sorting and testing semiconductor components - Google Patents
An all-in-one machine for sorting and testing semiconductor components Download PDFInfo
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- CN111715542A CN111715542A CN202010621863.6A CN202010621863A CN111715542A CN 111715542 A CN111715542 A CN 111715542A CN 202010621863 A CN202010621863 A CN 202010621863A CN 111715542 A CN111715542 A CN 111715542A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2301/00—Sorting according to destination
- B07C2301/0008—Electronic Devices, e.g. keyboard, displays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0063—Using robots
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Abstract
Description
技术领域technical field
本发明涉及半导体生产设备技术领域,具体涉及一种半导体元件分选测试一体机。The invention relates to the technical field of semiconductor production equipment, in particular to an integrated machine for sorting and testing semiconductor components.
背景技术Background technique
专利文件(CN104096684B)公开了半导体元件测试用分选机,该分选机在测试过程中对半导体元件进行搬运时,无法调节半导体元件的角度,需要人为手动调节,安装精度较差,速度慢,从而导致工作效率降低。The patent document (CN104096684B) discloses a sorting machine for testing semiconductor components. The sorting machine cannot adjust the angle of the semiconductor components when handling the semiconductor components during the test process, and requires manual adjustment. The installation accuracy is poor and the speed is slow. As a result, work efficiency is reduced.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种半导体元件分选测试一体机,解决了现有半导体元件分选测试一体机单次测试数量少,无法对半导体元件的角度进行调节,半导体元件安装速度慢,工作效率低的技术问题。The purpose of the present invention is to provide an all-in-one machine for sorting and testing semiconductor components, which solves the problem that the existing all-in-one machine for sorting and testing semiconductor components has a small number of single tests, cannot adjust the angle of semiconductor components, and has slow installation speed of semiconductor components and high working efficiency. Low technical issues.
本发明的目的可以通过以下技术方案实现:The object of the present invention can be realized through the following technical solutions:
一种半导体元件分选测试一体机,包括底座,所述底座的上表面固定安装有支撑架,所述支撑架的顶部通过螺栓固定安装有横梁,所述横梁的一侧活动安装有移动板,所述移动板的一侧沿竖直方向活动安装有升降臂,所述升降臂的底端固定安装有抓取机构;An integrated machine for sorting and testing semiconductor components, comprising a base, a support frame is fixedly installed on the upper surface of the base, a cross beam is fixedly installed on the top of the support frame by bolts, and a movable plate is movably installed on one side of the cross beam, A lifting arm is movably installed on one side of the moving plate along the vertical direction, and a grabbing mechanism is fixedly installed at the bottom end of the lifting arm;
所述移动板的一侧固定安装有第一电机,所述第一电机的输出轴端固定安装有齿轮,所述横梁的一侧表面固定安装有齿条,所述齿轮与齿条相啮合,所述横梁的一侧设置有传动皮带,所述传动皮带的上、下端分别通过固定板与升降臂固定连接,所述移动板的一侧固定安装有第二电机,所述第二电机的输出轴端固定安装有传动轮,所述传动轮与传动皮带的内侧面相配合,所述移动板的一侧转动安装有两个转辊,两个所述转辊分别位于传动轮的上、下方,所述转辊与传动皮带的外表面紧密配合;A first motor is fixedly installed on one side of the moving plate, a gear is fixedly installed on the output shaft end of the first motor, a rack is fixedly installed on one side surface of the beam, and the gear is engaged with the rack. One side of the beam is provided with a transmission belt, the upper and lower ends of the transmission belt are respectively fixedly connected to the lifting arm through a fixed plate, and a second motor is fixedly installed on one side of the moving plate, and the output of the second motor is A transmission wheel is fixedly installed at the shaft end, and the transmission wheel is matched with the inner side of the transmission belt. One side of the moving plate is rotatably installed with two rotating rollers, and the two rotating rollers are respectively located above and below the transmission wheel. The rotating roller is closely matched with the outer surface of the transmission belt;
所述抓取机构包括安装板,所述安装板的一侧固定安装有支撑座一,所述支撑座一上转动安装有若干个外花键,所述外花键的内侧沿竖直方向活动安装有通气管,所述通气管的底部固定安装有吸嘴,所述安装板的一侧固定安装有支撑座二,所述通气管贯穿支撑座二,所述通气管与支撑座二滑动配合,所述安装板的一侧转动安装有若干组皮带轮一,每组所述皮带轮一的数量为两个,两个所述皮带轮一呈上、下分布,两个所述皮带轮一之间通过皮带一传动连接,所述安装板的另一侧固定安装有若干个第三电机,所述第三电机的输出轴端与每组的其中一个皮带轮一固定连接,所述通气管上转动安装有连接块,所述皮带一的一侧与连接块固定连接;The grabbing mechanism includes a mounting plate, a
所述支撑座一的上表面固定安装有若干个第四电机,所述第四电机的输出轴端与外花键上均固定安装有皮带轮二,两个所述皮带轮二之间通过皮带二传动连接;Several fourth motors are fixedly installed on the upper surface of the first support seat, and the second pulley is fixedly installed on the output shaft end of the fourth motor and the external spline, and the two belt pulleys are driven between the second belts. connect;
所述底座的上表面固定安装有插座板,所述插座板与外部电源电性连接,所述插座板的上表面固定安装有测试插座,所述测试插座的上表面开设有若干个用于安装半导体元件的安装槽,半导体元件通过测试插座与插座板电性连接。A socket board is fixedly installed on the upper surface of the base, the socket board is electrically connected to an external power supply, a test socket is fixedly installed on the upper surface of the socket board, and a plurality of test sockets are opened on the upper surface of the test socket for installation The mounting groove of the semiconductor element, the semiconductor element is electrically connected with the socket board through the test socket.
进一步的,所述通气管的外周面上开设有竖槽,所述通气管的外周面与外花键的内周面相配合。Further, a vertical groove is formed on the outer peripheral surface of the ventilation pipe, and the outer peripheral surface of the ventilation pipe is matched with the inner peripheral surface of the external spline.
进一步的,所述支撑座一与支撑座二之间垂直固定有若干个纵杆,所述纵杆贯穿连接块上、下表面,所述纵杆与连接块滑动配合。Further, a plurality of vertical rods are vertically fixed between the first support base and the second support base, the vertical rods penetrate the upper and lower surfaces of the connecting block, and the vertical rods are slidably matched with the connecting block.
进一步的,所述横梁的一侧固定安装有两个滑轨,所述移动板一侧表面的两端均固定安装有两个滑块,所述移动板通过滑块、滑轨与横梁滑动连接。Further, two sliding rails are fixedly installed on one side of the beam, and two sliding blocks are fixedly installed on both ends of one side surface of the moving plate, and the moving plate is slidably connected to the beam through the sliding block and the sliding rail. .
进一步的,所述测试插座的上表面开设有若干个指示灯,所述指示灯用于判断半导体元件是否通电,若干个所述指示灯与若干个安装槽一一对应,若干个所述指示灯在测试插座的上表面呈等间距线性阵列分布。Further, several indicator lights are provided on the upper surface of the test socket, and the indicator lights are used to judge whether the semiconductor element is energized. It is distributed in an equidistant linear array on the upper surface of the test socket.
进一步的,所述升降臂的一侧竖直固定有两个滑轨,所述移动板的一侧固定安装有两组滑块,两组滑块分别与两个滑轨滑动连接,每组滑块的数量为两个。Further, two sliding rails are vertically fixed on one side of the lifting arm, and two sets of sliding blocks are fixedly installed on one side of the moving plate, and the two sets of sliding blocks are respectively slidably connected with the two sliding rails, and each set of sliding blocks is slidably connected to the two sliding rails. The number of blocks is two.
进一步的,所述底座的上表面固定安装有控制开关。Further, a control switch is fixedly installed on the upper surface of the base.
进一步的,该半导体元件分选测试一体机的工作步骤为:Further, the working steps of the semiconductor component sorting and testing integrated machine are:
步骤一、启动第一电机,第一电机带动齿轮转动,并带动移动板移动,使抓取机构移动到半导体元件的上方,通过吸嘴吸住半导体元件,通过第一电机带动半导体元件移动到测试插座的上方,启动第四电机,第四电机带动皮带轮二转动,并带动皮带二转动,并带动吸嘴和半导体元件转动,调节半导体元件的角度;
步骤二、启动第二电机,第二电机带动传动轮转动,并通过传动皮带拉动升降臂下降,启动第三电机,第三电机带动皮带轮一转动,并带动皮带一转动,并带动通气管下降,通气管带动吸嘴下降,使各个半导体元件进入到相应的安装槽内,吸嘴松开半导体元件;
步骤三、打开控制开关,测试插座通电,电流经过半导体元件,当半导体元件可以通电时,指示灯亮,产品合格,当半导体元件无法通电时,指示灯处于熄灭状态,产品不合格。Step 3: Turn on the control switch, energize the test socket, and the current passes through the semiconductor element. When the semiconductor element can be energized, the indicator light is on, and the product is qualified. When the semiconductor element cannot be energized, the indicator light is off and the product is unqualified.
本发明的有益效果:Beneficial effects of the present invention:
本发明通过在抓取机构上设置若干个吸嘴,可以单次搬运多个半导体元件,通过在测试插座上开设若干个安装槽放置半导体元件,本发明单次可以对多个半导体元件进行测试,工作效率高,本发明通过第四电机带动皮带轮二转动,并带动皮带二转动,并带动吸嘴和半导体元件转动,从而对半导体元件的角度进行调节,从而将半导体元件精准的放入安装槽内,保证了测试的顺利进行,半导体元件的安装速度快,有效提高了工作效率。In the present invention, a plurality of suction nozzles are arranged on the grabbing mechanism, and a plurality of semiconductor elements can be transported at a time. By opening a plurality of mounting slots on the test socket to place the semiconductor elements, the present invention can test a plurality of semiconductor elements at a time. The work efficiency is high, the present invention drives the second pulley to rotate through the fourth motor, and drives the second belt to rotate, and drives the suction nozzle and the semiconductor element to rotate, so as to adjust the angle of the semiconductor element, so that the semiconductor element can be accurately placed in the installation slot. , to ensure the smooth progress of the test, the installation speed of semiconductor components is fast, and the work efficiency is effectively improved.
附图说明Description of drawings
为了便于本领域技术人员理解,下面结合附图对本发明作进一步的说明。In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.
图1为本发明一种半导体元件分选测试一体机的立体结构图;1 is a three-dimensional structural diagram of an integrated machine for sorting and testing semiconductor components according to the present invention;
图2为本发明抓取机构的立体结构图;Fig. 2 is the three-dimensional structure diagram of the grasping mechanism of the present invention;
图3为本发明抓取机构另一角度的立体结构图;Fig. 3 is the three-dimensional structure diagram of another angle of the grasping mechanism of the present invention;
图4为本发明插座板、测试插座的组装图。FIG. 4 is an assembly diagram of the socket board and the test socket of the present invention.
图中:1、底座;2、支撑架;3、横梁;4、升降臂;5、抓取机构;6、移动板;7、第一电机;8、齿条;9、第二电机;10、传动轮;11、固定板;12、传动皮带;13、转辊;14、齿轮;15、插座板;16、测试插座;17、安装槽;18、指示灯;19、安装板;20、支撑座一;21、通气管;22、外花键;23、吸嘴;24、皮带轮一;25、皮带一;26、第四电机;27、皮带轮二;28、皮带二;29、支撑座二;30、连接块;31、纵杆;32、第三电机;33、控制开关。In the figure: 1. Base; 2. Supporting frame; 3. Beam; 4. Lifting arm; 5. Grabbing mechanism; 6. Moving plate; 7. First motor; 8. Rack; 9. Second motor; 10 , transmission wheel; 11, fixed plate; 12, transmission belt; 13, roller; 14, gear; 15, socket board; 16, test socket; 17, installation slot; 18, indicator light; 19, installation plate; 20, Support seat one; 21, ventilation pipe; 22, external spline; 23, suction nozzle; 24, pulley one; 25, belt one; 26, fourth motor; 27, pulley two; 28, belt two; 29, support seat Two; 30, connecting block; 31, longitudinal rod; 32, the third motor; 33, control switch.
具体实施方式Detailed ways
下面将结合实施例对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
如图1-4所示,一种半导体元件分选测试一体机,包括底座1,所述底座1的上表面固定安装有支撑架2,所述支撑架2的顶部通过螺栓固定安装有横梁3,所述横梁3的一侧活动安装有移动板6,所述移动板6的一侧沿竖直方向活动安装有升降臂4,所述升降臂4的底端固定安装有抓取机构5;As shown in Figures 1-4, an integrated machine for sorting and testing semiconductor components includes a
所述移动板6的一侧固定安装有第一电机7,所述第一电机7的输出轴端固定安装有齿轮14,所述横梁3的一侧表面固定安装有齿条8,所述齿轮14与齿条8相啮合,所述横梁3的一侧设置有传动皮带12,所述传动皮带12的上、下端分别通过固定板11与升降臂4固定连接,所述移动板6的一侧固定安装有第二电机9,所述第二电机9的输出轴端固定安装有传动轮10,所述传动轮10与传动皮带12的内侧面相配合,所述移动板6的一侧转动安装有两个转辊13,两个所述转辊13分别位于传动轮10的上、下方,所述转辊13与传动皮带12的外表面紧密配合;A
所述抓取机构5包括安装板19,所述安装板19的一侧固定安装有支撑座一20,所述支撑座一20上转动安装有若干个外花键22,所述外花键22的内侧沿竖直方向活动安装有通气管21,所述通气管21的底部固定安装有吸嘴23,所述安装板19的一侧固定安装有支撑座二29,所述通气管21贯穿支撑座二29,所述通气管21与支撑座二29滑动配合,所述安装板19的一侧转动安装有若干组皮带轮一24,每组所述皮带轮一24的数量为两个,两个所述皮带轮一24呈上、下分布,两个所述皮带轮一24之间通过皮带一25传动连接,所述安装板19的另一侧固定安装有若干个第三电机32,所述第三电机32的输出轴端与每组的其中一个皮带轮一24固定连接,所述通气管21上转动安装有连接块30,所述皮带一25的一侧与连接块30固定连接;The
所述支撑座一20的上表面固定安装有若干个第四电机26,所述第四电机26的输出轴端与外花键22上均固定安装有皮带轮二27,两个所述皮带轮二27之间通过皮带二28传动连接;A plurality of
所述底座1的上表面固定安装有插座板15,所述插座板15与外部电源电性连接,所述插座板15的上表面固定安装有测试插座16,所述测试插座16的上表面开设有若干个用于安装半导体元件的安装槽17,半导体元件通过测试插座16与插座板15电性连接。A
所述通气管21的外周面上开设有竖槽,所述通气管21的外周面与外花键22的内周面相配合。A vertical groove is formed on the outer peripheral surface of the
所述支撑座一20与支撑座二29之间垂直固定有若干个纵杆31,所述纵杆31贯穿连接块30上、下表面,所述纵杆31与连接块30滑动配合。A plurality of vertical rods 31 are vertically fixed between the
所述横梁3的一侧固定安装有两个滑轨,所述移动板6一侧表面的两端均固定安装有两个滑块,所述移动板6通过滑块、滑轨与横梁3滑动连接。One side of the
所述测试插座16的上表面开设有若干个指示灯18,所述指示灯18用于判断半导体元件是否通电,若干个所述指示灯18与若干个安装槽17一一对应,若干个所述指示灯18在测试插座16的上表面呈等间距线性阵列分布。The upper surface of the
所述升降臂4的一侧竖直固定有两个滑轨,所述移动板6的一侧固定安装有两组滑块,两组滑块分别与两个滑轨滑动连接,每组滑块的数量为两个。One side of the
所述底座1的上表面固定安装有控制开关33。A
所述通气管21的顶部与外部真空发生器连接。The top of the
该半导体元件分选测试一体机的工作步骤为:The working steps of the semiconductor component sorting and testing integrated machine are:
步骤一、启动第一电机7,第一电机7带动齿轮14转动,并带动移动板6移动,使抓取机构5移动到半导体元件的上方,通过吸嘴23吸住半导体元件,通过第一电机7带动半导体元件移动到测试插座16的上方,启动第四电机26,第四电机26带动皮带轮二27转动,并带动皮带二28转动,并带动吸嘴23和半导体元件转动,调节半导体元件的角度;
步骤二、启动第二电机9,第二电机9带动传动轮10转动,并通过传动皮带12拉动升降臂4下降,启动第三电机32,第三电机32带动皮带轮一24转动,并带动皮带一25转动,并带动通气管21下降,通气管21带动吸嘴23下降,使各个半导体元件进入到相应的安装槽17内,吸嘴23松开半导体元件;
步骤三、打开控制开关33,测试插座16通电,电流经过半导体元件,当半导体元件可以通电时,指示灯18亮,产品合格,当半导体元件无法通电时,指示灯18处于熄灭状态,产品不合格。
本发明通过在抓取机构5上设置若干个吸嘴23,可以单次搬运多个半导体元件,通过在测试插座16上开设若干个安装槽17放置半导体元件,本发明单次可以对多个半导体元件进行测试,工作效率高,本发明通过第四电机26带动皮带轮二27转动,并带动皮带二28转动,并带动吸嘴23和半导体元件转动,从而对半导体元件的角度进行调节,从而将半导体元件精准的放入安装槽17内,保证了测试的顺利进行,半导体元件的安装速度快,有效提高了工作效率。In the present invention, by setting a plurality of
以上公开的本发明优选实施例只是用于帮助阐述本发明。优选实施例并没有详尽叙述所有的细节,也不限制该发明仅为所述的具体实施方式。显然,根据本说明书的内容,可作很多的修改和变化。本说明书选取并具体描述这些实施例,是为了更好地解释本发明的原理和实际应用,从而使所属技术领域技术人员能很好地理解和利用本发明。本发明仅受权利要求书及其全部范围和等效物的限制。The above-disclosed preferred embodiments of the present invention are provided only to help illustrate the present invention. The preferred embodiments do not exhaust all the details, nor do they limit the invention to only the described embodiments. Obviously, many modifications and variations are possible in light of the content of this specification. The present specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is to be limited only by the claims and their full scope and equivalents.
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