CN111715542A - Semiconductor element sorting and testing integrated machine - Google Patents
Semiconductor element sorting and testing integrated machine Download PDFInfo
- Publication number
- CN111715542A CN111715542A CN202010621863.6A CN202010621863A CN111715542A CN 111715542 A CN111715542 A CN 111715542A CN 202010621863 A CN202010621863 A CN 202010621863A CN 111715542 A CN111715542 A CN 111715542A
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- semiconductor element
- motor
- belt
- testing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2301/00—Sorting according to destination
- B07C2301/0008—Electronic Devices, e.g. keyboard, displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0063—Using robots
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a semiconductor element sorting and testing integrated machine which comprises a base, wherein a support frame is fixedly arranged on the upper surface of the base, a cross beam is fixedly arranged at the top of the support frame through bolts, a movable plate is movably arranged on one side of the cross beam, a lifting arm is movably arranged on one side of the movable plate, a grabbing mechanism is fixedly arranged at the bottom end of the lifting arm, a socket plate is arranged on the upper surface of the base, a testing socket is arranged on the socket plate, a plurality of mounting grooves are formed in the testing socket, the grabbing mechanism comprises a mounting plate, a plurality of external splines are rotatably arranged on a first support seat, vent pipes are movably arranged on the inner sides of the external splines along the vertical direction, and suction; the invention can test a plurality of semiconductor elements at a time, has high working efficiency and is convenient for adjusting the angles of the semiconductor elements, thereby accurately placing the semiconductor elements into the mounting groove and having high mounting speed of the semiconductor elements.
Description
Technical Field
The invention relates to the technical field of semiconductor production equipment, in particular to a semiconductor element sorting and testing integrated machine.
Background
Patent document (CN104096684B) discloses a sorter for testing semiconductor devices, which cannot adjust the angle of a semiconductor device when the semiconductor device is transported during the testing process, requires manual adjustment, has poor mounting accuracy and low speed, and thus reduces the working efficiency.
Disclosure of Invention
The invention aims to provide a semiconductor element sorting and testing all-in-one machine, which solves the technical problems that the existing semiconductor element sorting and testing all-in-one machine is small in single test quantity, cannot adjust the angle of a semiconductor element, is low in mounting speed of the semiconductor element and low in working efficiency.
The purpose of the invention can be realized by the following technical scheme:
the semiconductor element sorting and testing integrated machine comprises a base, wherein a support frame is fixedly arranged on the upper surface of the base, a cross beam is fixedly arranged at the top of the support frame through a bolt, a movable plate is movably arranged on one side of the cross beam, a lifting arm is movably arranged on one side of the movable plate along the vertical direction, and a grabbing mechanism is fixedly arranged at the bottom end of the lifting arm;
a first motor is fixedly installed on one side of the movable plate, a gear is fixedly installed on an output shaft end of the first motor, a rack is fixedly installed on the surface of one side of the cross beam, the gear is meshed with the rack, a transmission belt is arranged on one side of the cross beam, the upper end and the lower end of the transmission belt are fixedly connected with the lifting arm through a fixing plate respectively, a second motor is fixedly installed on one side of the movable plate, a transmission wheel is fixedly installed on an output shaft end of the second motor, the transmission wheel is matched with the inner side surface of the transmission belt, two rotating rollers are rotatably installed on one side of the movable plate and are located above and below the transmission wheel respectively, and the rotating rollers are tightly matched with the outer surface of the transmission belt;
the grabbing mechanism comprises a mounting plate, a first supporting seat is fixedly mounted on one side of the mounting plate, a plurality of external splines are rotatably mounted on the first supporting seat, ventilating pipes are movably mounted on the inner sides of the external splines along the vertical direction, suction nozzles are fixedly mounted at the bottoms of the ventilating pipes, a second supporting seat is fixedly mounted on one side of the mounting plate, the ventilating pipes penetrate through the second supporting seat, the ventilating pipes are in sliding fit with the second supporting seat, a first plurality of groups of belt pulleys are rotatably mounted on one side of the mounting plate, the number of the first belt pulleys in each group is two, the two first belt pulleys are distributed up and down, the two first belt pulleys are in transmission connection through a belt, a plurality of third motors are fixedly mounted on the other side of the mounting plate, the output shaft ends of the third motors are fixedly connected with one belt pulley in each group, one side of the first belt is fixedly connected with the connecting block;
a plurality of fourth motors are fixedly arranged on the upper surface of the first supporting seat, belt pulleys II are fixedly arranged on output shaft ends of the fourth motors and the external spline, and the two belt pulleys II are in transmission connection through a belt II;
the upper surface fixed mounting of base has the socket board, socket board and external power source electric connection, the upper surface fixed mounting of socket board has test socket, test socket's upper surface is seted up a plurality of and is used for installing semiconductor element's mounting groove, and semiconductor element passes through test socket and socket board electric connection.
Furthermore, a vertical groove is formed in the outer peripheral surface of the vent pipe, and the outer peripheral surface of the vent pipe is matched with the inner peripheral surface of the external spline.
Furthermore, a plurality of longitudinal rods are vertically fixed between the first supporting seat and the second supporting seat, the longitudinal rods penetrate through the upper surface and the lower surface of the connecting block, and the longitudinal rods are in sliding fit with the connecting block.
Furthermore, two slide rails are fixedly mounted on one side of the cross beam, two slide blocks are fixedly mounted at two ends of the surface of one side of the movable plate, and the movable plate is connected with the cross beam in a sliding mode through the slide blocks and the slide rails.
Furthermore, a plurality of indicator lamps are arranged on the upper surface of the test socket and used for judging whether the semiconductor element is electrified or not, the indicator lamps correspond to the mounting grooves one to one, and the indicator lamps are distributed on the upper surface of the test socket in an equidistant linear array.
Furthermore, two sliding rails are vertically fixed on one side of the lifting arm, two groups of sliding blocks are fixedly mounted on one side of the moving plate and are respectively in sliding connection with the two sliding rails, and the number of each group of sliding blocks is two.
Furthermore, a control switch is fixedly installed on the upper surface of the base.
Further, the semiconductor element sorting and testing integrated machine comprises the following working steps:
the method comprises the following steps that firstly, a first motor is started, the first motor drives a gear to rotate and drives a moving plate to move, a grabbing mechanism is made to move above a semiconductor element, the semiconductor element is sucked through a suction nozzle, the semiconductor element is driven to move above a test socket through the first motor, a fourth motor is started, the fourth motor drives a belt pulley II to rotate and drives a belt pulley II to rotate, the suction nozzle and the semiconductor element are driven to rotate, and the angle of the semiconductor element is adjusted;
step two, a second motor is started, the second motor drives a driving wheel to rotate, a lifting arm is pulled to descend through a driving belt, a third motor is started, the third motor drives a belt pulley to rotate, drives the belt pulley to rotate, and drives a breather pipe to descend, the breather pipe drives a suction nozzle to descend, each semiconductor element enters a corresponding mounting groove, and the suction nozzle loosens the semiconductor element;
and step three, turning on the control switch, electrifying the test socket, enabling the current to pass through the semiconductor element, enabling the indicator lamp to be on when the semiconductor element can be electrified, enabling the product to be qualified, and enabling the indicator lamp to be in an off state and enabling the product to be unqualified when the semiconductor element cannot be electrified.
The invention has the beneficial effects that:
the grabbing mechanism is provided with the plurality of suction nozzles, a plurality of semiconductor elements can be carried at a time, the test socket is provided with the plurality of mounting grooves for placing the semiconductor elements, the test socket can test the plurality of semiconductor elements at a time, the work efficiency is high, the belt pulley II is driven to rotate by the fourth motor, the belt pulley II is driven to rotate, the suction nozzles and the semiconductor elements are driven to rotate, and therefore the angle of the semiconductor elements is adjusted, the semiconductor elements are accurately placed into the mounting grooves, the test is guaranteed to be carried out smoothly, the mounting speed of the semiconductor elements is high, and the work efficiency is effectively improved.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a three-dimensional structure diagram of a semiconductor device sorting and testing integrated machine according to the present invention;
FIG. 2 is a perspective view of the grasping mechanism of the present invention;
FIG. 3 is a perspective view of another embodiment of the grasping mechanism of the present invention;
FIG. 4 is an assembly view of the socket board and the test socket of the present invention.
In the figure: 1. a base; 2. a support frame; 3. a cross beam; 4. a lifting arm; 5. a grabbing mechanism; 6. moving the plate; 7. a first motor; 8. a rack; 9. a second motor; 10. a driving wheel; 11. a fixing plate; 12. a drive belt; 13. rotating the roller; 14. a gear; 15. a socket board; 16. a test socket; 17. mounting grooves; 18. an indicator light; 19. mounting a plate; 20. a first supporting seat; 21. a breather pipe; 22. an external spline; 23. a suction nozzle; 24. a first belt pulley; 25. a first belt; 26. a fourth motor; 27. a second belt pulley; 28. a second belt; 29. a second supporting seat; 30. connecting blocks; 31. a longitudinal bar; 32. a third motor; 33. and controlling the switch.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-4, the semiconductor element sorting and testing integrated machine comprises a base 1, wherein a support frame 2 is fixedly installed on the upper surface of the base 1, a cross beam 3 is fixedly installed at the top of the support frame 2 through bolts, a movable plate 6 is movably installed on one side of the cross beam 3, a lifting arm 4 is movably installed on one side of the movable plate 6 along the vertical direction, and a grabbing mechanism 5 is fixedly installed at the bottom end of the lifting arm 4;
a first motor 7 is fixedly installed on one side of the moving plate 6, a gear 14 is fixedly installed on an output shaft end of the first motor 7, a rack 8 is fixedly installed on the surface of one side of the cross beam 3, the gear 14 is meshed with the rack 8, a transmission belt 12 is arranged on one side of the cross beam 3, the upper end and the lower end of the transmission belt 12 are fixedly connected with the lifting arm 4 through a fixing plate 11 respectively, a second motor 9 is fixedly installed on one side of the moving plate 6, a transmission wheel 10 is fixedly installed on the output shaft end of the second motor 9, the transmission wheel 10 is matched with the inner side surface of the transmission belt 12, two rotating rollers 13 are rotatably installed on one side of the moving plate 6, the two rotating rollers 13 are respectively positioned above and below the transmission wheel 10, and the rotating rollers 13 are tightly matched with the outer surface of;
a plurality of fourth motors 26 are fixedly installed on the upper surface of the first support seat 20, belt pulleys 27 are fixedly installed at the output shaft ends of the fourth motors 26 and the external spline 22, and the two belt pulleys 27 are in transmission connection through a belt 28;
the upper surface fixed mounting of base 1 has socket board 15, socket board 15 and external power source electric connection, the upper surface fixed mounting of socket board 15 has test socket 16, test socket 16's upper surface is seted up a plurality of and is used for installing semiconductor element's mounting groove 17, and semiconductor element passes through test socket 16 and socket board 15 electric connection.
The outer peripheral surface of the vent pipe 21 is provided with a vertical groove, and the outer peripheral surface of the vent pipe 21 is matched with the inner peripheral surface of the external spline 22.
A plurality of longitudinal rods 31 are vertically fixed between the first supporting seat 20 and the second supporting seat 29, the longitudinal rods 31 penetrate through the upper surface and the lower surface of the connecting block 30, and the longitudinal rods 31 are in sliding fit with the connecting block 30.
Two sliding rails are fixedly mounted on one side of the cross beam 3, two sliding blocks are fixedly mounted at two ends of the surface of one side of the moving plate 6, and the moving plate 6 is connected with the cross beam 3 in a sliding mode through the sliding blocks and the sliding rails.
The upper surface of the test socket 16 is provided with a plurality of indicator lamps 18, the indicator lamps 18 are used for judging whether the semiconductor element is electrified, the indicator lamps 18 correspond to the mounting grooves 17 one by one, and the indicator lamps 18 are distributed on the upper surface of the test socket 16 in an equidistant linear array.
Two sliding rails are vertically fixed on one side of the lifting arm 4, two groups of sliding blocks are fixedly installed on one side of the moving plate 6, the two groups of sliding blocks are respectively in sliding connection with the two sliding rails, and the number of each group of sliding blocks is two.
The upper surface of the base 1 is fixedly provided with a control switch 33.
The top of the vent tube 21 is connected to an external vacuum generator.
The semiconductor element sorting and testing integrated machine comprises the following working steps:
step one, starting a first motor 7, wherein the first motor 7 drives a gear 14 to rotate and drives a moving plate 6 to move, so that a grabbing mechanism 5 moves above a semiconductor element, the semiconductor element is sucked by a suction nozzle 23, the semiconductor element is driven by the first motor 7 to move above a test socket 16, a fourth motor 26 is started, the fourth motor 26 drives a second belt pulley 27 to rotate and drives a second belt 28 to rotate, the suction nozzle 23 and the semiconductor element are driven to rotate, and the angle of the semiconductor element is adjusted;
step two, starting a second motor 9, wherein the second motor 9 drives a transmission wheel 10 to rotate, and pulls a lifting arm 4 to descend through a transmission belt 12, a third motor 32 is started, the third motor 32 drives a first belt pulley 24 to rotate, drives a first belt 25 to rotate, and drives a vent pipe 21 to descend, the vent pipe 21 drives a suction nozzle 23 to descend, so that each semiconductor element enters a corresponding mounting groove 17, and the suction nozzle 23 loosens the semiconductor element;
and step three, the control switch 33 is turned on, the test socket 16 is electrified, the current passes through the semiconductor element, when the semiconductor element can be electrified, the indicator lamp 18 is on, the product is qualified, and when the semiconductor element cannot be electrified, the indicator lamp 18 is in an off state, and the product is unqualified.
According to the invention, the plurality of suction nozzles 23 are arranged on the grabbing mechanism 5, a plurality of semiconductor elements can be carried at a time, and the plurality of mounting grooves 17 are formed in the test socket 16 for placing the semiconductor elements, so that the plurality of semiconductor elements can be tested at a time, the working efficiency is high, the belt pulley 27 is driven to rotate by the fourth motor 26, the belt pulley 28 is driven to rotate, the suction nozzles 23 and the semiconductor elements are driven to rotate, the angle of the semiconductor elements is adjusted, the semiconductor elements are accurately placed into the mounting grooves 17, the smooth test is ensured, the mounting speed of the semiconductor elements is high, and the working efficiency is effectively improved.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. The semiconductor element sorting and testing integrated machine is characterized by comprising a base (1), wherein a support frame (2) is fixedly mounted on the upper surface of the base (1), a cross beam (3) is fixedly mounted at the top of the support frame (2) through a bolt, a movable plate (6) is movably mounted on one side of the cross beam (3), a lifting arm (4) is movably mounted on one side of the movable plate (6) along the vertical direction, and a grabbing mechanism (5) is fixedly mounted at the bottom end of the lifting arm (4);
one side of the movable plate (6) is fixedly provided with a first motor (7), an output shaft end of the first motor (7) is fixedly provided with a gear (14), one side surface of the cross beam (3) is fixedly provided with a rack (8), the gear (14) is meshed with the rack (8), one side of the cross beam (3) is provided with a transmission belt (12), the upper end and the lower end of the transmission belt (12) are fixedly connected with the lifting arm (4) through a fixing plate (11) respectively, one side of the movable plate (6) is fixedly provided with a second motor (9), an output shaft end of the second motor (9) is fixedly provided with a transmission wheel (10), the transmission wheel (10) is matched with the inner side surface of the transmission belt (12), one side of the movable plate (6) is rotatably provided with two rotating rollers (13), and the two rotating rollers (13) are positioned on the transmission wheel (10) respectively, Below, the roller (13) is tightly matched with the outer surface of the transmission belt (12);
snatch mechanism (5) and include mounting panel (19), one side fixed mounting of mounting panel (19) has supporting seat (20), rotate on supporting seat (20) and install a plurality of external splines (22), the inboard of external splines (22) has breather pipe (21) along vertical direction movable mounting, the bottom fixed mounting of breather pipe (21) has suction nozzle (23), one side fixed mounting of mounting panel (19) has supporting seat two (29), breather pipe (21) runs through supporting seat two (29), breather pipe (21) and supporting seat two (29) sliding fit, one side of mounting panel (19) is rotated and is installed a plurality of sets of belt pulley (24), every set the quantity of belt pulley (24) is two, two belt pulley (24) are upper and lower distribution, two connect through belt (25) transmission between belt pulley (24), a plurality of third motors (32) are fixedly mounted on the other side of the mounting plate (19), the output shaft ends of the third motors (32) are fixedly connected with one belt pulley I (24) of each group, a connecting block (30) is rotatably mounted on the vent pipe (21), and one side of the belt I (25) is fixedly connected with the connecting block (30);
a plurality of fourth motors (26) are fixedly installed on the upper surface of the first supporting seat (20), belt pulleys II (27) are fixedly installed at the output shaft ends of the fourth motors (26) and the external spline (22), and the two belt pulleys II (27) are in transmission connection through a belt II (28);
the upper surface fixed mounting of base (1) has socket board (15), socket board (15) and external power source electric connection, the upper surface fixed mounting of socket board (15) has test socket (16), a plurality of mounting groove (17) that are used for installing semiconductor component are seted up to the upper surface of test socket (16), and semiconductor component passes through test socket (16) and socket board (15) electric connection.
2. The semiconductor element sorting and testing all-in-one machine as claimed in claim 1, wherein vertical grooves are formed in the outer peripheral surface of the vent pipe (21), and the outer peripheral surface of the vent pipe (21) is matched with the inner peripheral surface of the external spline (22).
3. The semiconductor component sorting and testing all-in-one machine as claimed in claim 1, wherein a plurality of longitudinal rods (31) are vertically fixed between the first supporting seat (20) and the second supporting seat (29), the longitudinal rods (31) penetrate through the upper surface and the lower surface of the connecting block (30), and the longitudinal rods (31) are in sliding fit with the connecting block (30).
4. The semiconductor element sorting and testing integrated machine according to claim 1, wherein two sliding rails are fixedly mounted on one side of the cross beam (3), two sliding blocks are fixedly mounted at two ends of the surface of one side of the moving plate (6), and the moving plate (6) is slidably connected with the cross beam (3) through the sliding blocks and the sliding rails.
5. The semiconductor element sorting and testing integrated machine according to claim 1, wherein a plurality of indicator lamps (18) are arranged on the upper surface of the testing socket (16), the indicator lamps (18) are used for judging whether the semiconductor elements are electrified, the indicator lamps (18) are in one-to-one correspondence with the mounting grooves (17), and the indicator lamps (18) are distributed on the upper surface of the testing socket (16) in an equidistant linear array.
6. The semiconductor element sorting and testing integrated machine according to claim 1, wherein two sliding rails are vertically fixed on one side of the lifting arm (4), two sets of sliding blocks are fixedly mounted on one side of the moving plate (6), the two sets of sliding blocks are respectively connected with the two sliding rails in a sliding manner, and the number of each set of sliding blocks is two.
7. The semiconductor component sorting and testing all-in-one machine as claimed in claim 1, wherein a control switch (33) is fixedly mounted on the upper surface of the base (1).
8. The semiconductor component sorting and testing all-in-one machine according to claim 1, wherein the semiconductor component sorting and testing all-in-one machine comprises the following working steps:
the method comprises the steps that firstly, a first motor (7) is started, the first motor (7) drives a gear (14) to rotate and drives a moving plate (6) to move, a grabbing mechanism (5) is made to move above a semiconductor element, the semiconductor element is sucked through a suction nozzle (23), the semiconductor element is driven to move above a test socket (16) through the first motor (7), a fourth motor (26) is started, the fourth motor (26) drives a second belt pulley (27) to rotate and drives a second belt (28) to rotate and drives the suction nozzle (23) and the semiconductor element to rotate, and the angle of the semiconductor element is adjusted;
step two, a second motor (9) is started, the second motor (9) drives a transmission wheel (10) to rotate, a lifting arm (4) is pulled to descend through a transmission belt (12), a third motor (32) is started, the third motor (32) drives a first belt pulley (24) to rotate, drives a first belt (25) to rotate and drives a vent pipe (21) to descend, the vent pipe (21) drives a suction nozzle (23) to descend, each semiconductor element enters a corresponding mounting groove (17), and the suction nozzle (23) loosens the semiconductor element;
and step three, turning on the control switch (33), electrifying the test socket (16), enabling current to pass through the semiconductor element, enabling the indicator lamp (18) to be on when the semiconductor element can be electrified, enabling the product to be qualified, and enabling the indicator lamp (18) to be in an off state and enabling the product to be unqualified when the semiconductor element cannot be electrified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010621863.6A CN111715542A (en) | 2020-06-30 | 2020-06-30 | Semiconductor element sorting and testing integrated machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010621863.6A CN111715542A (en) | 2020-06-30 | 2020-06-30 | Semiconductor element sorting and testing integrated machine |
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| Publication Number | Publication Date |
|---|---|
| CN111715542A true CN111715542A (en) | 2020-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010621863.6A Pending CN111715542A (en) | 2020-06-30 | 2020-06-30 | Semiconductor element sorting and testing integrated machine |
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| CN (1) | CN111715542A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115412829A (en) * | 2022-09-22 | 2022-11-29 | 景德镇金诚电子实业有限公司 | Device and method for manufacturing high-quality loudspeaker |
| CN115979559A (en) * | 2023-01-20 | 2023-04-18 | 临沂恩科半导体科技有限公司 | Semiconductor multi-endpoint access test equipment |
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| CN108357923A (en) * | 2018-03-07 | 2018-08-03 | 广东华测检测机器人股份有限公司 | Material transferring device |
| CN109753290A (en) * | 2018-11-27 | 2019-05-14 | 苏州永创智能科技有限公司 | Planer-type automates burning chip machine |
| CN209889821U (en) * | 2019-02-25 | 2020-01-03 | 苏州美生高智能科技有限公司 | High-speed rotating lifting adsorption mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW201116467A (en) * | 2009-11-04 | 2011-05-16 | System General Corp | A pick-and-place device for ICs |
| CN108033266A (en) * | 2018-01-19 | 2018-05-15 | 苏州杰锐思自动化设备有限公司 | Multistation draws module |
| CN108357923A (en) * | 2018-03-07 | 2018-08-03 | 广东华测检测机器人股份有限公司 | Material transferring device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115412829A (en) * | 2022-09-22 | 2022-11-29 | 景德镇金诚电子实业有限公司 | Device and method for manufacturing high-quality loudspeaker |
| CN115412829B (en) * | 2022-09-22 | 2023-06-16 | 景德镇金诚电子实业有限公司 | Manufacturing device and method of high-quality loudspeaker |
| CN115979559A (en) * | 2023-01-20 | 2023-04-18 | 临沂恩科半导体科技有限公司 | Semiconductor multi-endpoint access test equipment |
| CN115979559B (en) * | 2023-01-20 | 2023-09-12 | 宜宾卓邦科技有限公司 | Semiconductor multi-endpoint path test equipment |
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Application publication date: 20200929 |
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| RJ01 | Rejection of invention patent application after publication |