KR19980014310U - Pickup device for semiconductor assembly - Google Patents

Abstract

Disclosed is a pickup apparatus for assembling semiconductors which is improved to allow adsorption and redirection of lids. The pick-up apparatus 400 includes a head unit 450 having a suction head 461 for sucking the lid 6 in which the exhaust hole 6a is formed; A sub mount 110 provided above the main mount 100 and supported by the frame 120; An X-axis screw 410 installed in the sub mount in parallel with the conveying direction of the lead frame 10 and being driven to rotate; A first slider 420 moved along the X axis screw; A fixed block 430 fixed to the first slider; A Y-axis screw 440 installed on the fixed block in a direction perpendicular to the X-axis screw 410 and driven to rotate; And a second slider 451 moving along the Y-axis screw and supporting the head unit. Such a pickup device enables the redirection of the lead according to the position recognition signal of the exhaust hole, and from this it is possible to automatically supply the lead on the lead frame. Therefore, since a separate manual work is not required to match the exhaust hole of the conventional lead, it is advantageous to improve productivity by drastically reducing the work manpower.

Description

Pickup device for semiconductor assembly

The present invention relates to a pickup device for assembling semiconductors, and more particularly, to a pickup device for assembling semiconductors capable of picking up elements constituting a semiconductor assembly and converting the picked up elements in a desired direction.

In general, the lead frame 10 includes a pad 1 on which the IC chip 5 is mounted and an inner lead 2 connected to the IC chip 5 as shown in FIGS. 1 and 2; inner lead) and outer lead (3; outer lead) connected to the outer terminal.

In the semiconductor chip assembly using the lead frame 10, a molding process of molding the resin body 4 to maintain the distance between the leads 2 and to prevent deformation of the leads 2 during the post-treatment process, and the lead frame ( A die bonding step for mounting the IC chip 5 on the pad 1 of the pad 10, a wire bonding step for electrically connecting the IC chip 5 and the inner lead 2, and the resin body 4 Through a dispensing process of applying a thermoplastic epoxy resin 7 on the upper part and a lead mounting process of protecting a circuit element such as an IC chip 5 by placing a lid 6 on the coated epoxy resin 7. Assembled

In the lead mounting process, the lid 6 is mounted while the lead frame 10 is heated to a predetermined temperature in order to prevent the curing of the epoxy resin before the lead is supplied. In this case, the pad 1 and the lid 6 are mounted. Air is expanded in the space formed therebetween, and the seating position of the lid 6 is changed or bubbles are generated in the coated epoxy resin 7 due to the inflated air, thereby causing problems such as a decrease in adhesive strength or a lack of sealing.

To this end, an air hole 6a is normally formed in the lid 6 so that air is exhausted when the lid 6 is mounted. Therefore, after the lead mounting process, a sealing process for sealing the exhaust hole 6a is continued.

On the other hand, the lid 6 is mounted to the lead frame 10 by the suction of the robot head, in order to simplify the control of the sealing head in the exhaust hole sealing process, the exhaust hole 6a of each lead 6 supplied. It is required to mount the lid 6 so that is uniformly arranged.

To this end, conventionally, after storing the leads 6 by hand so that the exhaust holes 6a of the leads 6 are uniformly arranged in the lead storage arrangement board (not shown), the array board in which the leads 6 are accommodated. Is adopted in the lead mounting process so that the robot head absorbs the lead from the array plate and mounts the lead frame. At this time, the robot head has a structure capable of X-axis movement reciprocating between the lead frame and the array plate, and Z-axis movement to attract / release the lid.

Therefore, the process of arranging the robot head so that the exhaust hole 6a of the lid 6 is constant in the array plate is essential.

The present invention has been made to solve the above problems, to provide a pickup device for assembling the semiconductor to be able to change the direction of the lead to a predetermined position by recognizing the position of the exhaust hole of the lead and then adsorption.

1 is a plan view showing a conventional lead frame,

2 is a cross-sectional view of a lead frame in which an IC chip is mounted;

Figure 3 is a schematic front view showing a lead supply device employing the pickup device of the present invention,

4 is a schematic plan view of FIG. 3;

5A and 5B are operation views seen from A-A of FIG. 4,

6 is a plan view showing a lead guide unit;

7 is a perspective view showing an exhaust hole direction recognition unit of a lid;

8 is a side view of FIG. 7;

9 is a perspective view showing a pickup device of the present invention;

10 is a cross-sectional view showing a pickup device of the present invention.

* Explanation of symbols for main parts of the drawings

10 ... Lead frame 100 ... Main frame

110 Sub Sub 130,131 Guide Block

200 ... Lead guide unit 210 ... Vibration hopper

300 ... directional unit 310 ... table

320 ... Base 321 ... Perforator

330,331 ... 1st moving block 333,334 ... 1st gripping lever

340,341 2nd moving block 343,344 2nd gripping lever

390 Backlight 400 Pick-up

410 ... X-axis screw 420 ... 1st slider

440 ... Y-axis screws 450 ... head unit

460 head block 461 adsorption head

470 ... cam motor 480 ... rotary motor

In the present invention to achieve the above object, in the pickup unit for semiconductor assembly comprising a head unit having a suction head for adsorbing the lead formed exhaust holes, and a transfer means for transferring the head unit to the X-Y axis,

The head unit includes a camera unit for recognizing the position of the exhaust hole of the lid, a rotating means for rotating the suction head at a predetermined angle according to a signal from the detection means, and lifting means for lifting the suction head up and down. It is done.

The conveying means includes a main mount, a sub mount supported on the upper portion of the main mount; an X axis screw installed in the X axis direction in the sub mount and driven to rotate; A first slider moved in the X-axis direction according to the rotational drive of the X-axis screw; A fixed block fixed to the first slider; A Y-axis screw installed on the fixed block in a direction perpendicular to the X-axis screw to rotate; According to the rotational drive of the Y-axis screw has a structure that includes a second slider which is moved in the Y-axis direction and the head unit is supported.

The elevating means is a cam motor fixed to the second slider and rotationally drives a cam member of a predetermined shape, a driven roller installed at an end of the suction head and in contact with a cam surface of the cam member, and the driven roller. It has a structure provided with the spring member which elastically biases a cam member, and the support means which can support the said adsorption head up and down.

The rotating means has a structure fixed to the second slider and provided with a rotating motor which is rotated in a predetermined step according to the signal of the camera unit, and a power transmitting means for transmitting the power of the rotating motor to the suction head. .

According to the features of the present invention as described above, the pickup device of the present invention rotates the adsorption head in accordance with the exhaust hole position recognition signal of the camera unit to redirect the lid to the set position, it is possible to suck and transport the lead.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2, the pick-up apparatus of the present invention comprises a die bonding step of mounting the IC chip 5 on the pad 1 of the lead frame 10, the IC chip 5 and the inner lead 2; ) And the dispensing process of applying the thermoplastic epoxy resin 7 on top of the resin body 4 in sequence, followed by the wire bonding process of electrically connecting the wires) and the exhaust hole 6a in the applied epoxy resin 7. It is applied to a lead mounting process for protecting the circuit elements such as the IC chip 5 by mounting the formed lid 6.

Meanwhile, referring to FIGS. 3 and 4, the lead supply device 1000 employing the pickup device of the present invention includes a pair of guide blocks 130 and 131 for guiding the lead frame 10 in which the dispensing process is performed. The main stand 100 is provided; A lead guide unit 200 provided on the main mount 100 to sequentially guide the plurality of leads 6; An exhaust hole direction recognizing unit 300 for recognizing a position for forming the exhaust hole 6a of the lead 6 supplied from the lead guide unit 200; The lead 6 is supplied from the lead guide unit 200 to the direction recognition unit 300, the lead 6 is switched in accordance with the recognized signal, and the lead frame 10 from the direction recognition unit 300. And a lead pick-up device 400 for transferring the lid 6 to the lid.

Each of the guide blocks 130 and 131 is provided with transfer belts 132 and 133 for seating and transporting the lead frame 10, as shown in FIGS. 5A and 5B. Fixing plates 134 and 135 for fixing 10 are provided. And between the two guide blocks 130, 131, the heater block 137 for heating and raising the lead frame 10 located at the working position to fix the lead frame 10 together with the fixing plates 134, 135. This is provided. Reference numeral 136 denotes a cylinder for elevating the heater block 137.

In addition, a sensor (not shown) for detecting the lead frame 10 to be transported is provided at a work position, and a stopper 140 for operating a solenoid (not shown) to move up and down is provided according to the sensor signal.

3, 4 and 6, the lead guide unit 200 is a vibration in which a plurality of leads 6 are accommodated and vibrated with a predetermined amplitude, and a guide rib 211 is formed to guide the leads 6 according to the vibration. The hopper 210 and the vibration hopper 210 are connected to guide the leads 6 sequentially and have a connecting rail 220 formed with a stopper 221 at the end.

3, 4, 7, 8, and 10, the direction recognition unit 300 is fixed to the table 310 and the table 310, which is fixed to the main stand 100, and the lid 6 is A base 320 which is seated and has a plurality of light transmitting holes 321, a backlight 390 provided at the bottom of the base 320 to emit light, and light projected through the exhaust hole 6a of the lid 6. And a camera 395 which receives the light and recognizes the position of the exhaust hole 6a.

Here, the lid 6 has a rectangular structure, and the exhaust hole 6a has a structure formed at the corner portion. The through holes 321 formed in the base 320 are formed at positions corresponding to the rectangular corner portions, respectively. Therefore, when the lid 6 is seated on the base 320, the exhaust hole 6a coincides with at least one through hole 321.

The camera 395 forms coordinates dividing the lid 6 into four, and generates an error signal between the coordinates received through the exhaust hole 6a and the set coordinates.

On the other hand, the base 320 is provided with a holding means for seating the lead 6 accurately and stably.

The gripping means are installed to be slidable along the X / Y axis rails 350 and 360 and the X axis rails 350 which are installed to be orthogonal to each other on the table 310, and are opposed to the base 320. A pair of first movable blocks 330 and 331 provided to be slidable along the Y-axis rail 360 and a pair of second movable blocks 340 provided to face each other with respect to the base 320 are provided. And a pair of first and second grip levers 333, 334 and 343 and 344 fixedly installed at the first and second movable blocks 330 and 331 and 340 and 341 respectively. First moving means for moving the first moving blocks 330 and 331 along the X-axis rail 350 so as to approach or move away from each other, and the Y-axis rails 360 to approach or move the second moving blocks 340 and 341 to each other. And a second moving means for moving along.

The first moving means may include a first spring 332 for elastically biasing each of the first moving blocks 330 and 331, and one end of each of the first moving blocks 330 and 331 to be rotatably connected to each other. A pair of first and second links 372 and 373 and a pair of second and third links 374 and 375 (376 and 377), which are formed together with each of the first and second links 372 and 373 to form a triangular shape and are rotatably connected to each other. And a first main link 371 rotatably connected at opposite ends of the first links 372 and 373 and a first solenoid 370 for elevating the first main link 371. .

7 and 8, the second moving means includes a second spring 342 for mutually biasing each of the second moving blocks 340 and 341 and each of the second moving blocks 340. A pair of fourth links 382 and 383, one end of which is rotatably connected to 341, and a pair of fourth links 382 and 383, which are formed in a triangular shape and are rotatably connected to each other. Fifth and sixth links 384 and 385 (386 and 387), second main links 381 and two second main links 381 which are rotatably connected to the other ends of the fourth links 382 and 383, respectively. A second solenoid 380 for elevating is provided.

When each of the first and second solenoids 370 and 380 is controlled to be OFF, the rod of each solenoid is lowered, and at the same time, the first and second springs 332 and 342 are operated by the first and second springs 332 and 342. As the two moving blocks 330 and 331 340 and 341 approach each other, the edges of the lid 6 are gripped.

In addition, when each of the first and second solenoids 370 and 380 is controlled to be ON, the load of each solenoid is raised, and at the same time, the first and second moving blocks 330 and 331 and 340 and 341 are separated from each other by the operating force of each link. As a result, the grip levers 333 and 334 and 343 and 344 are separated from the edge of the lid 6. At this time, the first and second springs 332 and 342 are tensioned.

3, 4 and 9, 10, the lead pick-up apparatus 400 of the present invention includes a head unit 450 having a suction head 461 for sucking the lead 6 having the exhaust hole 6a formed therein. And a transfer means for transferring the head unit 450 to the XY axis.

The head unit 450 is a camera unit 395 for recognizing the position of the exhaust hole 6a of the lid 6, and rotation means for rotating the suction head 461 at a predetermined angle in accordance with the signal of the camera unit 395. And elevating means for elevating the suction head 461.

And the conveying means is provided on the main mount 100, the sub mount 110 is supported on the frame 120; An X-axis screw 410 installed in the sub mount 110 in parallel with the conveying direction of the lead frame 10 to be driven in rotation; A first slider 420 moved along the X-axis screw 410; A fixed block 430 fixed to the first slider 420; A Y-axis screw 440 installed on the fixed block 430 in a direction perpendicular to the X-axis screw 410 and driven to rotate; And a second slider 451 moving along the Y-axis screw 440 and supporting the head unit 450.

The lifting means for elevating the suction head 461 is fixed to the second slider 451, and is provided with a cam motor 470 for rotating and driving a cam member 471 having a predetermined shape, and an end of the suction head 461. A driven roller 466 provided to be in contact with the cam surface of the cam member 471, a spring member 462 elastically biasing the driven roller 466 to the cam member 471, and a suction head 461 to be lifted and lowered. Support means for supporting is provided.

The support means includes a hollow head block 460 fixed to the second slider 451, a hollow housing 464 rotatably supported on an inner circumferential surface of the head block 460, and a housing 464. The hollow spacer 463 is pressed against the inner circumferential surface, and the suction head 461 is slidably coupled, and one end of the spring member 462 is supported on the upper end thereof, and the spring member 462 is fixed to the suction head 461. It is provided with a fixing ring 465, the other end of the support).

The rotating means is fixed to the second slider 451 and transmits the power of the rotating motor 480 and the rotating motor 480 to the suction head 461 in a predetermined step according to the direction recognition signal. A power transmission means is provided. The power transmission means is wound around the motor pulley 481 coupled to the rotating motor 480, the rotation pulley 483 coupled to the housing 464, and the motor pulley 481 and the rotation pulley 483. It has a structure provided with a belt 482 to be.

In the head unit 450, the lid 6 is adsorbable to the suction head 461 by the operation of a vacuum pump (not shown).

In the above, the suction head 461 is lowered in conjunction with the rotation of the cam member 471, and is raised by the rotation of the cam member 471 and the restoring force of the spring member 462. And the rotation motor 480 is rotated by the step applied according to the error signal generated from the direction recognition unit 300 to rotate the adsorption head (461).

Reference numerals 484 and 485 denote rotating discs and sensors for detecting the rotation speed of the rotating motor 480, respectively.

The lead supply device employing the pickup device according to the present invention configured as described above is operated as follows. First, the lead frame 10 which has undergone the dispensing process is transferred to the lead 6 supply position by the transfer belts 132 and 133. At this time, when the lead frame 10 approaches the supply position, the lead frame 10 is detected by the detection of a sensor (not shown), and the stopper 140 is raised in response to the detection signal to overload the lead frame 10. Prevent it.

Thereafter, as shown in FIGS. 5A and 5B, the heater block 137 is raised by the operation of the cylinder 136, and the lead frame 10 is disposed between the fixed plates 134 and 135 and the heater block 137. It will be fixed. The heater block 137 to be heated at this time prevents the curing of the epoxy resin 7 coated on the resin body 4 of the lead frame 10.

Meanwhile, as shown in FIG. 6, the lead 6 is sequentially supplied from the vibration hopper 210 and the connecting rail 220 of the lead guide unit 200 simultaneously with the supply of the lead frame 10. At this time, the best lead 6 stopped at the stopper 221 is transferred to the direction recognition unit 300 by the pickup device 400. That is, referring to FIGS. 3, 4 and 10, the pickup device 400 is transferred to the lead guide unit 200 by the driving of the first motor 115, and then the suction head is driven by the cam motor 470. 461 is lowered and at the same time, the lid 6 positioned at the top of the lead guide unit 200 is adsorbed to the suction head 461 by the operation of a vacuum pump (not shown). In this state, the pickup device 400 is transferred to the upper part of the base 320 of the direction recognition unit 300 by the reverse driving of the first motor 115, and the suction head 461 is lowered by the driving of the cam motor 470. The seat 6 is seated on the base 320.

In this way, the direction recognition unit 300 on which the lid 6 is seated on the base 320 is operated as follows.

Referring to FIGS. 7 and 8, when the lid 6 is seated on the base 320, the first and second solenoids 370 and 380 are turned off to lower each rod. In this case, the first moving blocks 330 and 331 and the second moving blocks 340 and 341 are linked to each of the links 372-377 and 382-387, respectively, for the X-axis rail 350 and the Y-axis rail ( Along 360) in the mutually approaching direction. At this time, the first gripping levers 333 and 334 and the second gripping levers 343 and 344 grip the edges of the lead 6.

In this state, as shown in FIG. 10, the camera 395 is transferred to the upper portion of the lid 6, and the light source of the backlight 390 passes through the through hole 321 and the exhaust hole 6a. ). At this time, the arrangement state of the lid 6 is recognized according to the position where the light source is irradiated to the camera 395.

Thereafter, the suction head 461 is lowered by the rotation of the cam member 471 to suck the lid 6 in vacuum, and rotate the rotary motor 480 in a predetermined step according to the recognition signal. At this time, the suction head 461 receives the power to the belt 482 and rotates together to rotate the lead 6 to the set position.

In this state, the pickup device 400 moves the X-Y axis and supplies the lead 6 to the lead frame 10 positioned on the work position. At this time, each lead 6 supplied on the lead frame 10 is supplied such that each exhaust hole 6a is arranged in a predetermined direction.

The pickup device according to the present invention as described above can be supplied to the lead frame 10 by redirecting the lid 6 to the set position in accordance with the position recognition signal of the exhaust hole 6a recognized from the direction recognition unit 300. .

The pick-up device of the present invention enables the redirection of the lead according to the position recognition signal of the exhaust hole, and from this, it is possible to automatically supply the lead on the lead frame. Therefore, since a separate manual work is not required to match the exhaust hole of the conventional lead, it is advantageous to improve productivity by drastically reducing the work manpower.

Claims (6)

A pickup unit for semiconductor assembly comprising a head unit having a suction head for adsorbing a lead having an exhaust hole, and a transfer unit for transferring the head unit to an X-Y axis. The head unit includes a camera unit for recognizing the position of the exhaust hole of the lid, a rotating means for rotating the suction head at a predetermined angle according to a signal from the detection means, and lifting means for lifting the suction head up and down. Pick-up device for semiconductor assembly. According to claim 1, wherein the conveying means is a main mount, A sub mount supported on an upper portion of the main mount; An X-axis screw installed on the sub mount in the X-axis direction and driven to rotate; A first slider moved in the X-axis direction according to the rotational drive of the X-axis screw; A fixed block fixed to the first slider; A Y-axis screw installed on the fixed block in a direction perpendicular to the X-axis screw to rotate; And a second slider which is moved in the Y-axis direction according to the rotational drive of the Y-axis screw and supports the head unit. The cam lifter according to claim 1 or 2, wherein the elevating means is fixed to the second slider and rotates and drives a cam member of a predetermined shape, and is attached to an end of the suction head and contacts the cam surface of the cam member. And a spring member for elastically biasing the driven roller to the cam member, and supporting means for supporting the suction head to be liftable. The method of claim 3, wherein the support means is a hollow head block fixed to the second slider, a hollow housing rotatably supported on the inner peripheral surface of the head block, and the compression is coupled to the inner peripheral surface of the housing and the suction The head assembly is slidably coupled to the upper end of the hollow spacer for supporting one end of the spring member, and a fixing ring fixed to the suction head and the other end of the spring member is provided for Pickup device. According to claim 3, wherein the rotating means is fixed to the second slider and the rotary motor is rotated in a predetermined step in accordance with the signal of the camera unit, and a power transmission means for transmitting the power of the rotary motor to the suction head; Pickup device for a semiconductor assembly characterized in that provided. No content