TWI340769B - Method for compounding metal onto surface of molded article of cyclic olefin based resin, and molded article of cyclic olefin based resin compounded with metal - Google Patents

Method for compounding metal onto surface of molded article of cyclic olefin based resin, and molded article of cyclic olefin based resin compounded with metal

Info

Publication number
TWI340769B
TWI340769B TW092131910A TW92131910A TWI340769B TW I340769 B TWI340769 B TW I340769B TW 092131910 A TW092131910 A TW 092131910A TW 92131910 A TW92131910 A TW 92131910A TW I340769 B TWI340769 B TW I340769B
Authority
TW
Taiwan
Prior art keywords
molded article
based resin
cyclic olefin
olefin based
metal
Prior art date
Application number
TW092131910A
Other languages
English (en)
Chinese (zh)
Other versions
TW200420752A (en
Inventor
Hiroyuki Kanai
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of TW200420752A publication Critical patent/TW200420752A/zh
Application granted granted Critical
Publication of TWI340769B publication Critical patent/TWI340769B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
TW092131910A 2002-11-15 2003-11-14 Method for compounding metal onto surface of molded article of cyclic olefin based resin, and molded article of cyclic olefin based resin compounded with metal TWI340769B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002332630A JP2004169049A (ja) 2002-11-15 2002-11-15 環状オレフィン系樹脂成形品表面への金属複合方法及び金属複合化環状オレフィン系樹脂成形品

Publications (2)

Publication Number Publication Date
TW200420752A TW200420752A (en) 2004-10-16
TWI340769B true TWI340769B (en) 2011-04-21

Family

ID=32321665

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092131910A TWI340769B (en) 2002-11-15 2003-11-14 Method for compounding metal onto surface of molded article of cyclic olefin based resin, and molded article of cyclic olefin based resin compounded with metal

Country Status (4)

Country Link
JP (1) JP2004169049A (ja)
AU (1) AU2003280771A1 (ja)
TW (1) TWI340769B (ja)
WO (1) WO2004046419A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1902276A (zh) * 2003-12-30 2007-01-24 3M创新有限公司 填充复合物
JP4774711B2 (ja) * 2004-10-05 2011-09-14 住友ベークライト株式会社 回路基板用樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板
JP4579048B2 (ja) * 2005-05-10 2010-11-10 富士フイルム株式会社 金属膜形成方法、それを用いた金属パターン形成方法及び金属膜
JP5345753B2 (ja) * 2006-05-09 2013-11-20 ポリプラスチックス株式会社 高周波用電子部品用材料及び当該材料からなる高周波用電子部品
JP2009161857A (ja) * 2007-12-14 2009-07-23 Fujifilm Corp めっき用感光性樹脂組成物、及び、それを用いた金属層付き基板の製造方法
JP2011181916A (ja) * 2010-02-05 2011-09-15 Sumitomo Bakelite Co Ltd 樹脂組成物及びそれを用いた高周波用回路基板及びアンテナモジュール
JP2011184695A (ja) * 2011-04-18 2011-09-22 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板
WO2017034969A1 (en) * 2015-08-21 2017-03-02 Corning Incorporated Methods of continuous fabrication of features in flexible substrate webs and products relating to the same
WO2018016527A1 (ja) * 2016-07-22 2018-01-25 京セラ株式会社 有機絶縁体、金属張積層板および配線基板
JP6923351B2 (ja) * 2017-04-26 2021-08-18 株式会社Ｃ−Ｉｎｋ 積層体
WO2020121632A1 (ja) * 2018-12-14 2020-06-18 株式会社クレハ 抗菌性成形体およびその使用
US20240002586A1 (en) * 2020-12-02 2024-01-04 3M Innovative Properties Company Curable compositions, composite foam, method of making the same, and article including the same
WO2024204593A1 (ja) * 2023-03-30 2024-10-03 ポリプラスチックス株式会社 液晶性樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6229191A (ja) * 1985-07-30 1987-02-07 三井化学株式会社 高周波電気回路基板
JP2881751B2 (ja) * 1989-03-10 1999-04-12 三井化学株式会社 メッキ用組成物およびメッキ物
JPH05156100A (ja) * 1991-12-03 1993-06-22 Mitsui Petrochem Ind Ltd 樹脂組成物およびその用途
KR100452678B1 (ko) * 1997-06-06 2004-10-14 제온 코포레이션 환상 올레핀계 중합체를 함유하는 절연재료
JP2000017444A (ja) * 1998-06-29 2000-01-18 Nec Kansai Ltd 樹脂成形体及び樹脂成形体の製造方法
JP2001026687A (ja) * 1999-07-14 2001-01-30 Sumitomo Chem Co Ltd 共重合体組成物
JP2001031788A (ja) * 1999-07-22 2001-02-06 Teijin Meton Kk メッキされた架橋重合体成形物

Also Published As

Publication number Publication date
TW200420752A (en) 2004-10-16
JP2004169049A (ja) 2004-06-17
AU2003280771A1 (en) 2004-06-15
WO2004046419A1 (ja) 2004-06-03

Similar Documents

Publication Publication Date Title
TWI340769B (en) Method for compounding metal onto surface of molded article of cyclic olefin based resin, and molded article of cyclic olefin based resin compounded with metal
EP1785440A4 (en) VULCANIZABLE RESIN COMPOSITION, CONFORMING ARTICLE AND PROCESS FOR PRODUCING THE SAME
EP1514901A4 (en) CUSHION COMPOSITION FOR TIRES AND TIRES MANUFACTURED THEREOF
EP1938918A4 (en) FORM, METHOD FOR PRODUCING THE SHAPE AND FORMING PRODUCTS MANUFACTURED BY THE FORM
EP1506926A4 (en) SYNTHETIC RESIN BOTTLE
EP1479502A4 (en) PROCESS FOR PRODUCING MOLDED ARTICLES BASED ON REGENERATED THERMOPLASTIC RESIN
GB2410620B (en) Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom
EP1616886A4 (en) CURABLE RESIN, PROCESS FOR PRODUCING THE SAME, AND CURABLE RESIN COMPOSITION
AU2003263991A8 (en) Article of manufacture with in-molded erasable and markable discrete surface structure and method of manufacture
EP1591487A4 (en) RESIN COMPOSITION AND PROCESS FOR PRODUCING RESIN MOLDING
AU2003236718A1 (en) Method and device for the injection moulding of multi-component fibre-reinforced moulded parts
TWI370141B (en) Ethylene copolymers, a composition of the ethylene copolymers, a foamed apticles and the method for producing the foamed article
AU2003257645A8 (en) Molded object obtained by in-mold coating and process for producing the same
AU2003292593A8 (en) Antistatic agents for resins, antistatic resin compositions, and moldings of antistatic resins
AU2003252743A1 (en) Synthetic resin bottle body with grip
AU2003275580A1 (en) Resin composition and molded object formed from the resin composition
AU2003264472A8 (en) Thermoplastic resin composition and moldings thereof
AU2003261794A1 (en) Integrally molded surface fastener, and continuous production method and continuous production device therefor
EP1623823A4 (en) DECORATIVE PLASTIC PACKING BODY AND METHOD FOR THEIR RECYCLING
AU2003252742A1 (en) Synthetic resin bottle body with grip
AU2003245389A1 (en) Mult-shot injection molded component and method of manufacture
AU2003303861A1 (en) Thermoplastic resin composition, process for manufacture and use thereof
AU2003295768A8 (en) Method for manufacturing articles with materials containing tapered polymers
EP1517952A4 (en) METHOD FOR THE PRODUCTION OF AGGLOMERITIZED PELLETS OF POLYTETRAFLUOROETHYLENE AND FORM BODY THEREOF
GB2393961B (en) Moulded thermoplastic articles and process

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees