AU2003280771A1 - Method of combining metal with surface of molded cycloolefin resin and metal-combined molded cycloolefin resin - Google Patents

Method of combining metal with surface of molded cycloolefin resin and metal-combined molded cycloolefin resin

Info

Publication number
AU2003280771A1
AU2003280771A1 AU2003280771A AU2003280771A AU2003280771A1 AU 2003280771 A1 AU2003280771 A1 AU 2003280771A1 AU 2003280771 A AU2003280771 A AU 2003280771A AU 2003280771 A AU2003280771 A AU 2003280771A AU 2003280771 A1 AU2003280771 A1 AU 2003280771A1
Authority
AU
Australia
Prior art keywords
molded
cycloolefin resin
metal
combined
combining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003280771A
Inventor
Hiroyuki Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Publication of AU2003280771A1 publication Critical patent/AU2003280771A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
AU2003280771A 2002-11-15 2003-11-13 Method of combining metal with surface of molded cycloolefin resin and metal-combined molded cycloolefin resin Abandoned AU2003280771A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002332630A JP2004169049A (en) 2002-11-15 2002-11-15 Method for compounding metal to surface of cyclic olefine-based resin molding, and metal-compounded cyclic olefine-based resin molding
JP2002-332630 2002-11-15
PCT/JP2003/014461 WO2004046419A1 (en) 2002-11-15 2003-11-13 Method of combining metal with surface of molded cycloolefin resin and metal-combined molded cycloolefin resin

Publications (1)

Publication Number Publication Date
AU2003280771A1 true AU2003280771A1 (en) 2004-06-15

Family

ID=32321665

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003280771A Abandoned AU2003280771A1 (en) 2002-11-15 2003-11-13 Method of combining metal with surface of molded cycloolefin resin and metal-combined molded cycloolefin resin

Country Status (4)

Country Link
JP (1) JP2004169049A (en)
AU (1) AU2003280771A1 (en)
TW (1) TWI340769B (en)
WO (1) WO2004046419A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1709115B1 (en) * 2003-12-30 2007-04-25 3M Innovative Properties Company Filled composite
JP4774711B2 (en) * 2004-10-05 2011-09-14 住友ベークライト株式会社 Resin composition for circuit board, resin layer, carrier material with resin layer, and circuit board
JP4579048B2 (en) * 2005-05-10 2010-11-10 富士フイルム株式会社 Metal film forming method, metal pattern forming method using the same, and metal film
JP5345753B2 (en) * 2006-05-09 2013-11-20 ポリプラスチックス株式会社 High frequency electronic component material and high frequency electronic component made of the material
JP2009161857A (en) * 2007-12-14 2009-07-23 Fujifilm Corp Photosensitive resin composition for plating and method for producing substrate with metal layer using the same
JP2011181916A (en) * 2010-02-05 2011-09-15 Sumitomo Bakelite Co Ltd Resin composition, high frequency circuit board using the same, and antenna module
JP2011184695A (en) * 2011-04-18 2011-09-22 Sumitomo Bakelite Co Ltd Resin composition, resin layer and carrier material with resin layer, and circuit board
EP3338520A1 (en) * 2015-08-21 2018-06-27 Corning Incorporated Glass substrate assemblies having low dielectric properties
WO2018016527A1 (en) * 2016-07-22 2018-01-25 京セラ株式会社 Organic insulating body, metal-clad laminate and wiring board
JP6923351B2 (en) * 2017-04-26 2021-08-18 株式会社Ｃ−Ｉｎｋ Laminate
WO2020121632A1 (en) * 2018-12-14 2020-06-18 株式会社クレハ Antibacterial molded article and use thereof
WO2022118175A1 (en) * 2020-12-02 2022-06-09 3M Innovative Properties Company Curable compositions, composite foam, method of making the same, and article including the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6229191A (en) * 1985-07-30 1987-02-07 三井化学株式会社 High frequency electric circuit board
JP2881751B2 (en) * 1989-03-10 1999-04-12 三井化学株式会社 Plating composition and plating
JPH05156100A (en) * 1991-12-03 1993-06-22 Mitsui Petrochem Ind Ltd Resin composition and its use
KR100480548B1 (en) * 1997-06-06 2005-04-07 제온 코포레이션 Resin-coated matal foils containing cycloolefinic polymers, laminated boards and multilayer laminated boards using the same, and process for producing multilayer laminated boards
JP2000017444A (en) * 1998-06-29 2000-01-18 Nec Kansai Ltd Resin molding and production of resin molding
JP2001026687A (en) * 1999-07-14 2001-01-30 Sumitomo Chem Co Ltd Copolymer composition
JP2001031788A (en) * 1999-07-22 2001-02-06 Teijin Meton Kk Plated crosslinked polymer molding

Also Published As

Publication number Publication date
JP2004169049A (en) 2004-06-17
TW200420752A (en) 2004-10-16
WO2004046419A1 (en) 2004-06-03
TWI340769B (en) 2011-04-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase