JP2000017444A - Resin molding and production of resin molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin molding capable of forming fine patterns and producing an inexpensive electron circuit structure and a process for producing this resin molding. SOLUTION: The stage for directly laminating a metallic layer 12 on a resin 11 in the process for producing the resin molding directly laminated with the resin 11 consisting of a single material and the metallic layer 12 without the intervention of an adhesive layer consists of a stage for roughening the surface itself of the resin 11 to a surface roughness of >=0.1 to <=10 microns and a stage for footing the metallic layer 12 by direct electroless plating on the surface of the resin 11 roughened in this stage.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molded product capable of forming a fine pattern and producing an inexpensive electronic circuit structure, and a method for producing the resin molded product.

[0002]

2. Description of the Related Art At present, wiring on a so-called printed board or wiring formed on a film-like substrate is often used in precision electronic equipment and the like. Since these are capable of forming fine patterns, are relatively inexpensive, and have high reliability, they are used in very many fields. In particular, in recent years, IC chips, LSI chips, MPUs and the like are arranged on a substrate or a case made of these resin materials,
2. Description of the Related Art A technique for manufacturing a small and inexpensive electronic circuit structure has attracted attention.

In these devices, generally, a copper wiring is formed by plating on a resin base material, and the copper wiring is bonded to a bump electrode of an IC chip or a bond England of an IC chip by wire bonding or direct bonding. An electronic circuit structure or an electronic device or the like is provided by mounting this on a mother substrate without sealing it on a base material or as it is. The present invention relates to a resin molded product and a method for producing the resin molded product, and these have been increasingly improved in recent years due to high-density wiring and the like accompanying miniaturization of electronic devices.

Conventionally, this type of resin molded product has formed a circuit wiring by bonding a copper foil and a resin. However, this resin is poor in adhesion of a polyamide or imide material to the copper foil. The emphasis was on improving. Various adhesives have been devised and invented in order to improve this adhesiveness, for example, a mixture of an ethylene copolymer and a polyamide resin or a cyanate ester resin and a butadiene resin or an epoxy ester of acrylic acid or methacrylic acid. And epoxy-modified nylon which also has flame retardancy and chemical resistance include addition-reaction crosslinked silicone rubber.

[0005] Polyamide or imide is a resin material that has been used very well to date because it has a film forming property and it is difficult to firmly adhere directly to a copper foil, but has a certain degree of adhesiveness. There is also a method of forming a thin film instead of forming a copper foil on such a resin material.
The method of forming the copper foil is called a subtractive method, and the additive method uses electroless plating, electrolytic plating, or the like.

[0006] Compared to the subtractive method, the additive method does not require a large amount of copper foil to be removed by etching. In addition, the circuit forming method is simplified, the pollution-free resources are reduced, and the precision of the circuit pattern is good. I have. However, in the case of the additive method, there is a problem that the adhesion between the plated circuit pattern and the printed circuit board is weaker than that of the subtractive method. Therefore, although a great deal of effort has been made to improve this point, the main invention until now has been focused on a so-called photohoming method using a photosensitive agent that generates plating nuclei.

In order to improve the adhesion between the electroless plating circuit pattern and the printed circuit board, there are overwhelmingly many methods in which the surface of the substrate is roughened. In most cases, the surface is roughened. That is, a diene-based synthetic rubber adhesive is applied to an aluminum foil having a roughened plastic sheet adhered to the resin surface or an uneven surface formed by alkaline zinc plating, and this is integrally formed with a printed circuit board. And forming a rough surface by removing the zinc plating layer.

In addition, a printed circuit board provided with a coating having a hollow hole, a diene-based synthetic rubber-based adhesive is coated on a printed circuit board, and then a part of the surface layer of the adhesive is scraped off to a certain depth. There are things. However, even with these methods, it is very difficult to form a metal layer having a strong adhesive force on a so-called resin, particularly a copper layer, by electroless plating, and all of these methods use an adhesive layer. However, the production cost was high and it was not always a good method.

There is also a method using a vacuum evaporation apparatus, a sputtering apparatus, or the like as a means capable of obtaining a certain adhesion. This is a process shown in FIG. 18. First, a resin base material, that is, a resin molded body is prepared, and a metal layer is formed on this surface by sputtering or vapor deposition as a plating base layer. Further, electrolytic plating is performed using the metal layer as a base layer, the metal layer is grown to a predetermined thickness, and then the wiring is processed. However, this method has another problem. That is, unlike the above-mentioned method, although no adhesive layer or the like is used, a vacuum device or the like is essential, so that capital investment becomes large, and the operation becomes complicated, which is not a good method.

[0010] As another method, particularly in the case of a resin form having three-dimensional wiring, a method as shown in FIG. 18 has been adopted. This is to form a primary molded body by mixing a catalyst that serves as a growth nucleus of plating in the resin, and then secondary-molding a non-plated resin having no plating nucleus as a non-molded body and roughening it It is to grow electroless plating selectively. However, in this method, the complexity of the process was the same as that of other methods, such as mixing plating growth nuclei in the resin and requiring secondary molding. As described above, a complicated process must be adopted because it is difficult to fix the resin material having sufficient strength by electroless plating on the resin material.

[0011]

First, the first conventional method, namely, when a metal layer is laminated on a resin, the surface thereof is roughened using an adhesive layer, and electroless plating is performed thereon. In a method such as applying electroplating on top of electroless plating, a separate adhesive layer must be formed on the resin, and the surface of the adhesive layer must also be roughened by predetermined processing. Therefore, the manufacturing process is complicated, the cost is increased, and the reliability is not necessarily high.

According to a second method different from this method, that is, a method using a vacuum evaporation apparatus or a sputtering apparatus, it is possible to form a metal layer on a resin with a certain fixing strength. As described above, there is a problem that a large facility such as a vacuum device must be used and the manufacturing cost is high. In any of these methods, the adhesive strength between the resin and the metal layer is not always sufficient, and the conventional manufacturing method or the resin molded article is considered to have a problem from this point.

Further, as another method, particularly in the case of a resin-made form having three-dimensional wirings, plating growth nuclei are mixed in the resin, or secondary molding is required. The complexity of the process is similar to the others. As described above, a complicated process must be adopted because it is difficult to fix the resin material having sufficient strength by electroless plating on the resin material.

Therefore, in the present invention, a laminated film for producing such an electronic circuit structure or a method for producing the laminated film can be directly fixed on a resin by electroless plating with sufficiently high mechanical strength. The present invention provides a resin molded product and a method for manufacturing the resin molded product, and can provide a low-cost, high-reliability, high-strength resin molded product that could not be realized by the conventional method.

[0015]

In order to solve the above-mentioned problems, the present inventor provides the following means. First, a resin molded body in which a resin made of a single material and a metal layer are directly laminated without interposing an adhesive material layer, and when the metal layer is laminated on the resin, the resin surface itself has a surface roughness of 0.1 mm. This is a resin molded article that is roughened to 1 μm or more and 10 μm or less, and a metal layer is formed on the surface of the roughened resin. The feature of the present invention lies in the size of the surface roughness of the resin surface itself.

Further, as a method for producing such a resin molded article, there is provided a method for producing a resin molded article in which a resin made of a single material and a metal layer are directly laminated without interposing an adhesive material layer. The step of directly laminating a metal layer includes a step of roughening the resin surface itself to a surface roughness of 0.1 μm or more and 10 μm or less, and a step of directly electrolessly plating the metal layer on the surface of the resin roughened by this step. And a step of forming a resin molded article.

Further, the present inventors recommend a range of 1 μm or more and 5 μm or less as a particularly preferred range of the above-mentioned roughness of the resin surface. That is, a resin molded body in which a resin and a metal layer made of a single material are directly laminated without interposing an adhesive material layer, and when the metal layer is directly laminated on the resin, the resin surface itself has a surface roughness of 1%. A resin molded article having a metal layer formed directly on the surface of the roughened resin and having a metal layer formed directly on the surface of the roughened resin, and a resin made of a single material and a metal layer are not interposed through an adhesive material layer. In the method for manufacturing a directly laminated resin molded body, the step of directly laminating a metal layer on the resin includes a step of roughening the resin surface itself to a surface roughness of 1 μm or more and 5 μm or less; In particular, a method for producing a resin molded body, which comprises a step of directly forming a metal layer on the surface of the resin by electroless plating.

As a particularly preferred method for carrying out the invention as described above, the roughening step is a step of roughening the resin surface itself by sandblasting.
Or the method for producing a resin molded article according to claim 4, wherein the roughening step is a step of roughening the resin surface itself by wet blasting. Can be.

Further, as the material of the resin, polyimide, polyamide imide, polyether-ether ketone,
Any one of the materials selected from the group consisting of polyphenylene sulfide, liquid crystal polymer, fluororesin, polysulfone, polyethersulfone, polyamide 46, polyethylene naphthalate, polybutylene terephthalate, and aromatic polyester is particularly excellent. In carrying out the method of the present invention, it is not necessary to largely change the conditions according to the material, and a predetermined effect can be easily obtained.

Further, the media of the above-mentioned wet blast has a center particle size of 10 to 300 μm and a hardness of 1300 to 2500 or less in a Knoop hardness.
It is preferably a polygonal particle having a hardness of 7 or more and 15 or less. Further, as a method of forming the metal layer on the resin, there is a method of manufacturing a resin molded body in which a resin made of a single material and a metal layer are directly laminated without using an adhesive material layer, and the metal layer is formed on the resin. The steps of directly laminating the resin include roughening the resin surface itself to a surface roughness of 0.1 μm or more and 10 μm or less, and forming a conductive layer by electroless plating directly on the surface of the resin roughened by this step. And a step of forming a thick metal layer by electrolytic plating using the conductive layer formed in this step as a base.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, the invention according to the present application is as defined in claims 1 to 11. These will be described below in the order of claims with reference to the drawings. First, the invention according to claim 1 is a resin molded body in which a resin and a metal layer made of a single material are directly laminated without interposing an adhesive layer as described above, and the metal layer is formed on the resin. The lamination is a resin molded body in which the surface of the resin itself is roughened to a surface roughness of 0.1 μm or more and 10 μm or less, and a metal layer is formed on the surface of the roughened resin.

First, the reason why the present invention is made of a single material is that a separate adhesive layer is not interposed on a resin as in the prior art. The metal layer is intended to include a wiring pattern for forming an electronic circuit in the electronic circuit structure. A typical example is copper, but copper is particularly low in adhesion strength of plating with such a resin material. Is the most suitable metal material for the present invention. Copper is most excellent as a metal layer of such a resin molded article from the viewpoint that copper is relatively inexpensive and has high electric conductivity.

The metal layer according to the first aspect of the present invention is not limited to copper, but may be any material that can be used as a material for forming wiring in an electronic circuit structure or the like. Needless to say. Laminating directly is basically a repetition of the above, but means that both are directly pulled without interposing any other adhesive layer between the resin and the metal layer.

The feature of the present invention is that the resin and the metal layer can be directly laminated as described above, and an adhesive layer or the like is not required between them. In addition to saving material costs, the resin surface itself as described in the latter part of the invention of claim 1 is compared with the case of directly forming the metal layer resin using a vacuum evaporation apparatus or a sputtering apparatus. Is characterized by the fact that the surface roughness of the substrate is roughened to 0.1 μm or more and 10 μm or less, so that the bonding strength between the resin and the metal layer is stronger than that of the conventional one.

FIG. 1 is a simplified illustration of the present invention. That is, as shown in FIG.
2 are formed, but the surface of this resin 11 is 0.1
The surface roughness is not less than 10 microns and not more than 10 microns. When the surface roughness is smaller than 0.1 micron as described above, sufficient bonding strength with the metal layer 12 cannot always be obtained when the surface roughness is smaller than 0.1 micron, and when the surface roughness is larger than 10 microns. Is a metal layer 12 formed on the resin 11 in view of the recent miniaturization of the wiring pattern.
This is due to disconnection of the wire.

Therefore, the surface roughness is 0.1 μm or more and 10 μm or more.
If the surface is roughened to the order of microns or less, the fixing strength between the resin 11 and the metal layer 12 can be made much stronger than before. Although FIG. 1 shows the case where the metal layer 12 is attached to the upper surface of the resin 11, the invention described in claim 1 is not necessarily limited to this embodiment, and the metal layers are formed on both surfaces of the resin. The same is true in the case where it is performed. “On resin” means that not only the upper part in the drawing but also the lower part in the drawing are included in the concept of “on resin”.

Needless to say, the invention described in claim 1 is not an invention applied only to a resin molded body consisting of only a resin and a metal layer. There may be a plurality of resin and metal layers and other various layers. FIG. 2 is a view showing the effect of the first aspect of the present invention. FIG. 2 (b) shows a conventional method in which a metal layer 22 is formed on a resin film 21 by sputtering or vapor deposition, and an external force F is applied to the resin film. FIG. 3A is a view showing a state in which a part thereof is peeled off, and FIG. 3A shows a case where the resin molded body 20 according to the first aspect of the present invention is bent in the same manner as in the state of FIG. FIG. 3 is a view showing a state in which the metal layer 22 does not peel off.

In short, in the conventional method, the adhesive strength at the interface between the resin 21 and the metal layer 22 in the resin molded body 20 is insufficient. Although there was a problem that both layers were peeled off, as shown in FIG. 1A, in the case of the resin molded article 20 according to the first aspect of the present invention, the interface thereof had a roughness of 0.1 μm or more and 10 μm or less. Since it is composed of the metal layer 22 formed on the converted resin 21, the bonding strength between the two is dramatically increased as compared with the conventional one.

The reason for this is that, since the resin is formed with a predetermined surface roughness, the surface area thereof becomes larger than that of the conventional one, and therefore, the resin 2
This is because the bonding strength per unit area between the metal layer 1 and the metal layer 22 is increased. FIG. 3 shows a case for mounting, for example, a semiconductor element using the resin molded body 30 according to the first aspect of the present invention.

When the invention of claim 1 is used, the metal layer 32 can be formed on the resin 31 of such a resin molded body with a high adhesive strength, so that the adhesive strength is higher than that of the conventional one. As a result, the reliability of the entire semiconductor device is improved, and even if it is stored as a tape-shaped roll or used, there is no possibility that the resin molded body is damaged by the stress at that time, so that the overall manufacturing cost is reduced. It also has the advantage of facilitating production.

FIG. 4 shows an embodiment in which the resin 41 is provided on the resin 41.
This figure shows a cross section of a case manufactured by forming a metal layer 42 by the same method as the described invention as an intermediate structure and further laminating another resin material thereon. That is, the metal layer 42 is wired not only on the surface of the resin molded body 40 but also on the inner surface thereof, and connects the internal electrode 43 and the external connection portion 44.

When the semiconductor device 47 is mounted on the case manufactured by processing the resin molded body 40 according to the first aspect of the present invention and the lid 45 is covered with the sealing resin 46 as shown in FIG. As shown, it is easy to handle, and in addition to being capable of transporting or storing a film-like material as a roll, in this way, for example, a silicon chip is directly thermo-compressed onto a case without using wire bonding. Even in such a case, since the wiring on the case does not peel off due to the heating and does not peel off due to the stress at the time of pressure bonding, a material which is extremely suitable as a case for such a semiconductor device. It is. Particularly, when a three-dimensional circuit wiring is formed, a large stress is easily generated between the metal layer 42 and the material of the resin 41 constituting the wiring, so that the present invention is particularly effective.

Next, claim 2 will be described. Claim 2
The described invention is a method for manufacturing a resin molded body in which a resin and a metal layer made of a single material are directly laminated without an adhesive layer as described above, and the step of directly laminating the metal layer on the resin is The surface of the resin itself has a surface roughness of 0.1 μm or more.
This is a method for producing a resin molded body, comprising a step of roughening to a size of 0 μm or less and a step of directly forming a metal layer on the surface of the resin roughened by this step by electroless plating.

The gist of the invention according to claim 2 is that the resin molded product according to claim 1 is obtained from the manufacturing method, and the point is that the surface of the resin itself has a surface roughness of 0.1 μm or more. This is a method for producing a resin molded article that includes a step of roughening to 10 μm or less. Claim 2
Another feature of the description is that a metal layer can be formed directly on the surface of the resin thus roughened by electroless plating. In the prior art, it was extremely difficult to form electroless plating directly on a resin in the process of manufacturing a resin molded body.

In order to solve this, conventionally, as described above, a special component which becomes a growth nucleus of plating is contained in the resin. For example, palladium particles were included. As another method, conventionally, electroless plating has been performed by roughening the surface using, for example, an adhesive layer as described above. However, a feature of the present invention is that it includes a step of roughening the surface of the resin itself without using a growth nucleus for plating and without using an adhesive layer, and without using an adhesive layer. Electroless plating can be directly applied to the surface of this resin, thereby producing a resin molded body at a low cost without a step of forming an adhesive layer or a step of using vapor deposition sputtering as in a conventional method. You can do it. This is shown in FIG.

The features of the present invention are shown in FIGS.
Among the steps up to (h), there are the steps (c) and (f). That is, in the step (c), a resin molded block (before the destruction processing is performed on the resin molded body) is prepared, the resin is washed, and the resin is washed with a surface roughness of about 0.1 to 10 μm. Roughens to surface roughness. Although various methods of this roughening are conceivable, the present inventors have found that it is most appropriate to perform this roughening by a specific method as described in the following claims.

Next, an electroless plating is formed directly on the roughened resin through a washing and drying step after the roughening step. After the electroless plating is formed, it is washed and dried to produce a product or to be transported to another process, whereby a highly reliable resin molded product, an intermediate structure of the resin molded product, or an electronic circuit structure can be manufactured.

Next, the third aspect of the present invention will be described. The invention according to claim 3 is, as described above, a resin molded body in which a resin and a metal layer made of a single material are directly laminated without interposing an adhesive layer, and the direct lamination of the metal layer on the resin is The resin surface itself is roughened to a surface roughness of 1 μm or more and 5 μm or less, and a resin molded body in which a metal layer is directly formed on the surface of the roughened resin. The feature of the present invention is that the surface roughness of the resin is in the range of 0.1 μm to 10 μm in the case of claims 1 and 2, but is limited to 1 μm to 5 μm. is there.

The present inventors have conducted intensive research and development on the inventions described in claims 1 and 2, and found that the optimum value of the surface roughness is particularly 1 to 5 microns. Within this range, especially the adhesive strength between the resin and the metal layer can be strengthened, and sufficient reliability can be secured because there is no disconnection even for fine wiring. . When the surface roughness is greater than 1 micron, particularly strong adhesion between the resin material and the metal layer is possible. When the surface roughness is greater than 5 microns, fine wiring to be formed on this resin Becomes difficult.

This is because a thick film must be used, which limits the fine processing of wiring. This is shown in FIG. As described above, the feature of the present invention is that the surface of the resin 61 is roughened to 1 μm or more and 5 μm or less, and the resin molded body in which the metal layer 62 is directly formed on the surface of the resin 61. 60. FIG. 6 also differs from the above-described claim 1 only in that point.

Next, the invention according to claim 4 will be described. The invention according to claim 4 is a method for manufacturing a resin molded body in which a resin and a metal layer made of a single material are directly laminated without interposing an adhesive layer, wherein the step of directly laminating the metal layer on the resin comprises: A step of roughening the resin surface itself to a surface roughness of 1 μm or more and 5 μm or less, and a step of directly forming a metal layer on the surface of the resin roughened by this step by electroless plating. It is a manufacturing method.

The invention according to claim 4 is essentially the same invention in which the resin molded product according to claim 3 is regarded as a manufacturing method. However, the point substantially lower than that of the invention described in claim 3 is that direct electroless plating is performed as a method for forming a metal layer in addition to the roughening step. Therefore, the invention according to claim 4 is shown in FIG. In short, the process diagram of the present invention is different from the process diagram of FIG. 7F in that the roughening process of the process (c) in the processes (a) to (h) of FIG. The point is that a metal layer is formed by electroless plating.

It should be noted that the range of 1 micron or more and 5 microns or less is the same as in the invention of the third aspect, that is, if it is larger than 1 micron, the fixing strength is more than 0.1 micron of the invention of the first aspect. In addition, it is possible to secure a sufficient bonding strength between the metal layer and the resin, and if it is 5 μm or less, very fine wiring is required when processing this metal layer to form wiring on the resin. This is due to the fact that a circuit failure due to the disconnection of the copper wiring over the resin step does not occur.

FIG. 7 shows the steps (i) and (j) of the process according to the fourth aspect of the present invention. In some cases, the process according to the seventh aspect of the present invention may be a completed product, and other steps may be performed as an intermediate structure. It is shown that the electronic circuit assembly may be further laminated on the upper part. In any case, the invention as shown in the steps (c) and (f) in FIG. It can be said that the production method according to the invention described in Item 4 is used. FIG. 8 shows another embodiment of the invention described in claim 4 and the invention described in claim 2. In short, the conventional claim 1 in the process diagram of FIG.
Or, the difference from the invention described in 3 is that there is a step (a ′).

The step (a ') is a step of molding a resin film, for example, forming a through hole, forming a via hole, or forming a positioning groove or a positioning hole on the resin film. It refers to The resin molded body is made by laminating a metal layer on the resin, but it is made of various shapes in three dimensions, such as a lead frame insert board, a large current three-dimensional board, a three-dimensional frame with a jumper wire configuration, There is also a type which is initially formed in a flat shape, and a part of which is subjected to a forming process during the manufacturing process to obtain a resin molded body.

In short, the manufacturing method of the resin molded article according to the second or fourth aspect is intended to include a method including an intermediate molding step. Also, this molding step is not necessarily included after step (a) shown in FIG. 8 and may include a molding step in other parts. Claim 2 which has a process and satisfies predetermined requirements
Alternatively, it can be said that the invention is substantially the same as the invention described in claim 4.

Next, the invention according to claim 5 will be described. In the invention described in claim 5, the roughening step is a step of roughening the resin surface itself by sandblasting.
Or a method for producing a resin molded product according to item 4. The feature of the present invention is that the surface of the resin is roughened when the metal layer is formed on the mounting in the resin molding or the method of manufacturing the resin molding. The present inventors have found such a surface roughness of 0.1 μm or more and 10 μm or less, preferably 1 μm or more and 5 μm or less, but roughening for realizing such a surface roughness. It has been found that sandblasting is very useful as a process as in the invention of claim 5.

FIGS. 9 (a) and 9 (b) conceptually show the fifth aspect of the present invention. In short, the term "sandblasting" used by the present inventors is synonymous with spraying, and the particles 92 are projected onto the workpiece 91 by being accelerated by centrifugal force by a rotating impeller or ejected together with compressed air. It indicates the general method of injection processing for processing. It is generally called sand blasting because it is common to use sand as such particles, but the inventor of the present invention does not necessarily limit the purpose of sand blasting to using sand as particles but small steel or cast iron. In the case of using particles produced by the above method, it is generally called a shot blast or the like, but even for these, the present inventors use the term "sand blast".

The point is that when such particles are bombarded at high speed with a predetermined energy onto the film, the surface of the film is partially peeled or dented, so that the surface has irregularities. In the case of having roughness, that is, from 0.1 to 10 microns or 1
Particularly, in the case of about 5 μm or more and 5 μm or less, by forming a metal layer on the surface thereof, the adhesive strength between the resin and the metal layer can be extremely increased. FIG.
Shows the surface state of the resin 101 after the sand blasting step of the invention of claim 5 is completed.

FIG. 10 is a conceptual view, and in the enlarged view, the surface roughness of 1 μm to 5 μm or not shown but not less than 0.1 μm to 10 μm is shown in a wavy shape. However, actually, it is not necessarily such a wave-like state, and the surface is more steep and uneven. This is clearly shown in the photograph of FIG. In short, the surface is partially peeled or partially dug as shown in the photograph shown in FIG. 11, and thus the peeling or dug forms unevenness on the surface, and the metal layer sufficiently wraps around and is fixed. By doing so, the bonding strength between the resin and the metal layer is increased.

The advantage of using sandblasting as a surface roughening means is that irregularities having an optimal size can be formed with good reproducibility without depending on the type of material. This is because, as described above, sandblasting is performed with mechanical collision energy to perform surface processing, and therefore does not require a chemical reaction depending on the material of the workpiece.

Another effect of realizing such a surface roughness by using sand blast and forming a metal layer is shown in FIG.
As shown in (b), only the portion 93 where the metal layer is to be formed is exposed, and the other portion is covered 94. If sandblasting is performed, the surface can be selectively roughened, and the metal layer is formed only on that portion. Is to be able to do it. In other words, according to this method, only the portion where the metal layer is to be formed is roughened, and the other portions are left as they are, and the metal layer can be selectively formed on the portion without a plating cover. Is grown, and the metal layer does not grow in other parts, so that there is an advantage that the process can be simplified. This point
This can be said to be advantageous as compared with the conventional subtractive method and the double forming method shown in FIG.

Next, the invention according to claim 6 will be described. The invention according to claim 6 is the method for producing a resin molded product according to claim 2, 4 or 5, wherein the roughening step is a step of roughening the resin surface itself by wet blasting. The present inventors have found that among sandblasting, wet blasting is further suitable for the roughening step of the present invention. FIG. 12 shows the concept of wet blast.

As shown in FIG. 12, particles which are abrasives 122 and a liquid are put in a tank 127 in a mixed state, and the material in the mixed state is injected by a jet flow 124 branched from a blast pump 123. It is constantly stirred.
A part thereof is pressurized by a blast pump 123, introduced into a projection gun 125, and mixed with compressed air 126 by the projection gun 125 to collide with the surface of a resin base material resin film, ie, a resin 121, which is a workpiece. It is. In the projection gun 125, the abrasive 122 and the compressed air 126 are mixed and projected by the nozzle, and the projected abrasive 122 returns to the tank 127 and is reused. FIG. 13 is a conceptual diagram showing the projection gun 130.

Liquid + solid and compressed air 1 as abrasive material 132
36 are mixed as shown in the figure and sprayed forward from the tip of the projection gun 130 with high pressure, and this hits the surface of the resin base material which is the workpiece to form irregularities on the surface of the resin base material, that is, the resin. You. FIG. 14 shows the optimum conditions for such wet blasting. We consider that the optimal conditions for such wet blasting are pump pressure of 1
５5 kg / cm ² , compressed air pressure is 1-6 kg / cm
^{2. The} media particle diameter, that is, the diameter of the particles contained in the wet blast, but the ratio of the abrasive to the liquid of 40 to 300 microns is about 5 to 40% by volume.

FIG. 15 is a surface photograph taken by an electron microscope of the unevenness of the resin surface formed by such wet blasting. As shown in the photograph of the surface, in the case of wet blast, the surface is further formed in a uniform, fine and uneven shape as compared with the case of drive blast. The electron micrograph shown in the invention of claim 5 is a view showing what is called sandblast, that is, so-called dry blast, which is a mixture of compressed air and solid particles, such as media, without using a liquid and sprayed onto a resin.

Here, if the meanings of the sand blast and the wet blast used by the present inventor are clarified, the sand blast is a mechanical processing using some fine particles as described above. The purpose is to include both drive blast in which the particles are sprayed and processed and wet blast in which the particles are sprayed together with a liquid to process. Therefore, it can be said that drive blast is a subordinate concept of sand blast.

Next, the invention according to claim 7 will be described. As described above, in the invention according to claim 7, the single material is made of polyimide, polyamide imide, polyether ether,
3. A material made of any one of the group consisting of terketone, polyphenylene sulfide, liquid crystal polymer, fluororesin, polysulfone, polyethersulfone, polyamide 46, polyethylene naphthalate, polybutylene terephthalate, and aromatic polyester. 7. The method for producing a resin molded article according to any one of 4, 5, and 6.

The present inventors have found that the above materials are most suitable as such a single material. This is because the surface of such a material is easily formed by sand blasting, especially wet blasting, and the surface is easy to be formed in the range of 0.1 μm to 10 μm, especially 1 μm to 5 μm, which is considered to be the optimum. This is because it is most suitable for enhancing the adhesive strength between the metal layer and the resin in the resin molded article, which is the initial object of the present invention.

The reason why these groups are described as so-called Markush claims in the present invention is that they have a common feature in that they have high heat resistance in addition to the above-described ease of processing. The heat resistance of these polymers is based on the structure of the polymer and is evaluated based on the glass transition point (tg), melting point (tm), and thermal decomposition onset temperature inherent to the polymer.

The necessary conditions for the heat-resistant polymer are that tg and tm having a physical meaning are sufficiently high to withstand high-temperature softening, and that the pdt value accompanied by a chemical change is sufficiently high to withstand high-temperature deterioration. That is, as a specific example, polyimide has a tg of about 420 ° C. and hardly decomposes up to 500 ° C., and sufficiently satisfies the requirements for high heat resistance. One year at 275 ° C,
Three months at 300 ° C., six days at 350 ° C., and 12 hours at 400 ° C., indicating that this polyimide is a material having high heat resistance.

As described above, the heat-resistant polymer is required to have sufficient heat-softening property and heat-deterioration property. As for the first heat-softening property, the polymer material is used as a film or molded product at a high temperature. The point is that at least tg and tm must be sufficiently high to hold the shape. The group of those described in the Markush claim of claim 7 sufficiently satisfies this requirement.

According to thermodynamics, tm is given by the ratio of the enthalpy of melting δhm to the entropy of melting δsm,
tm = δhm / δsm. Here, δhm is related to the intermolecular force, and δsm is a quantity mainly related to the flexibility and symmetry of the molecule. It is a material with sufficient mechanical strength. Therefore, from such a viewpoint, it can be said that the material of the resin forming the resin molded body of this type is excellent. Further, it is particularly important that, as described above, when these are subjected to sandblasting, there is almost no difference in the surface processing state depending on the type of material.

Next, the invention according to claim 8 will be described. According to the invention of claim 8, as described above, the single material is made of polyimide, polyamide imide, polyether ether,
2. The material according to claim 1, wherein the material is selected from the group consisting of terketone, polyphenylene sulfide, liquid crystal polymer, fluororesin, polysulfone, polyethersulfone, polyamide 46, polyethylene naphthalate, polybutylene terephthalate, and aromatic polyester. Or a resin molded product according to 3.

The invention according to claim 8 is essentially the invention according to claim 7, which is dependent on the invention of the manufacturing method, but is dependent on the invention. In short, it can be said that the present invention substantially forms the same or a higher concept as the invention described in claim 7. The group of elements forming these Markush claims have the same contents as those described in the invention of claim 7, and therefore the details thereof are omitted.

Next, the ninth aspect of the present invention will be described. According to a ninth aspect of the present invention, as described above, the media of the wet blast has a center particle diameter of 10 μm or more and 30 μm or more.
Hardness is 1300 to 25 in the Knoop hardness at 0 micron or less
The method for producing a resin molded article according to claim 6, wherein the particles are polygonal particles having a hardness of 00 or less or a Mohs hardness of 7 or more and 15 or less. We have worked diligently to find out what is most suitable for such a media material. FIG. 16 shows the result of this study using typical materials.

In short, the media or particles of such a wet blast are, as a first condition, that the central particle size is within a certain range, that is, the surface roughness that we desire is 0.1 μm or more and 10 μm or less. Preferably, in order to obtain one having a size of 1 to 5 microns, the media of wet blast must have a median particle size of 10 to 300 microns. Knoop hardness is 1300 or more and 2500 or less or Mohs hardness is 7 or more and 1
It must also be less than 5.

An even more important factor is that the media of the wet blast, that is, the particles are polygonal particles. As can be seen from FIG. 16, it is clear that the desired surface roughness can be reliably obtained with polygonal particles, whereas the above-described results cannot be obtained with a true spherical shape. . This is considered to be because the impact given to the surface of the resin is not scratching the surface of the resin in the case of a perfectly spherical one, so that the surface is not sufficiently roughened.

Next, the invention according to claim 10 will be described. The invention according to claim 10 is a method for manufacturing a resin molded body in which a resin made of a single material and a metal layer are directly laminated without interposing an adhesive layer as described above, wherein the metal layer is directly laminated on the resin. In this step, the resin surface itself has a surface roughness of 0.1
A step of roughening to a micron or more and 10 microns or less, a step of forming a conductive layer directly on the surface of the resin roughened by this step by electroless plating, and a step of electroplating using the conductive layer formed in this step as a base. And a step of forming a thick metal layer.

The feature of the present invention is, in short, a method for forming a metal layer in a resin molded article. A conductive layer is formed directly on the surface of a resin by electroless plating, and then the metal layer is formed by electrolytic plating using the conductive layer as a base. The point is that it is formed thick. In recent years, the specifications required for such a resin molded article have also become diverse, and even when a circuit that must process a very large current as a current value is formed on the resin molded article, is there. For example, it is a large current board or a large current board. In such a case, the conductive layer must be formed sufficiently thick, and it is difficult to form such an electric circuit that handles such a large current only by the conductive layer formed by electroless plating.

However, as described above, since we have developed a manufacturing method in which a conductive layer is firmly formed directly on a resin by electroless plating, the metal layer can be thickened by electrolytic plating using this as a base layer. It is very easy, and according to this, it is possible to easily form an electronic circuit structure having a very thick wiring on a film by having a very thick metal layer or by processing the resin molded body. . FIG. 17 is a process diagram showing the tenth aspect of the present invention.

Referring to FIG. 17 in order, a resin base material (resin molded body) is prepared, washed, roughened, further washed, dried, subjected to electroless plating, washed, and electrolytically plated thereon. Thus, the metal layer is formed sufficiently thick. For example, the thickness of the metal layer formed by this electrolytic plating is 50 microns to 10 microns.
It is possible even with about 0 microns. This is dried and directly made into a product as shown in the figure, or an intermediate structure or an electronic circuit structure of the electronic circuit structure is formed through another process.

Next, the invention according to claim 11 will be described. The invention according to claim 11 is a method of manufacturing a resin molded body in which a resin and a metal layer made of a single material are directly laminated without interposing an adhesive layer, as described above, wherein a metal layer is formed on the resin surface. The steps of directly laminating the resin include a step of roughening the resin surface to a surface roughness of 0.1 μm or more and 10 μm or less, and a step of forming a conductive layer made of copper and unavoidable impurities on the surface of the resin roughened by this step. A step of forming directly by electroless plating, and a step of forming a thick metal layer by electroplating with the conductive layer formed in this step as a base,
This is a method for producing a resin molded article containing:

An embodiment of the present invention described in claim 11 is shown in steps, which is the same as FIG. 17 shown in the invention of claim 10. The feature of the invention according to claim 11 is that what is formed directly on the surface of the resin by electroless plating is a conductive layer made of copper and unavoidable impurities. As already mentioned, the direct formation of copper on the resin is due to the copper layer, which is a metal layer directly on the resin, due to the surface state caused by the physical properties of both materials and the thermal expansion coefficient of both materials. Was difficult to form.

Therefore, as described above, the series of inventions of the present inventors is most suitable for forming a metal layer made of copper and unavoidable impurities on a resin, particularly when forming a metal layer directly on a resin. It is a suitable method. The copper and the unavoidable impurities may form the metal layer according to claim 11 as described above, or another material may be used as the metal layer, and the conductive layer may be formed as a base layer for electrolytic plating. In any case, it is possible to select copper and inevitable impurities as a material layer directly formed by copper and inevitable impurities. It is an invention meaningful to select.

As described above, the present invention can be summarized as a resin molded product in which a resin and a metal layer are directly laminated without interposing an adhesive layer, wherein the surface of the resin is roughened to a predetermined surface roughness. In particular, we have found that sandblasting, which is a drive blast, or wet blasting among sandblasting is most suitable as the roughening step. Finally we show a comparison with other manufacturing processes that have led to drive blast or wet blast being the most suitable

We have compared the use of reverse sputtering in a so-called sputtering apparatus, plasma etching, or wet etching with those of drive blast or wet blast constituting the present invention. In reverse sputtering in a sputtering apparatus, the surface is slightly roughened, but the whole is smooth, which is not preferable. Even when plasma etching is used, only the whole is etched uniformly, and as a result, the surface is smooth and the predetermined surface roughness of the present invention cannot be obtained. Also, in the case of wet etching, it is only dissolved smoothly, and the predetermined surface roughness of the present invention cannot be secured.

On the other hand, among sand blasts, drive blast is not uniform, but it can be processed relatively coarsely, and it can be said that the surface roughness more suitable for drive blast is particularly about 5 μm to 10 μm. . When wet blasting is used, the resin surface can be uniformly and finely processed. In this case, it is most suitable for securing a surface roughness of about 1 to 5 microns. There is a way. In any case, as a result of comparing and considering these five methods, it was concluded that dry blast or wet blast is most suitable for roughening the resin surface which is a feature of the present invention.

Finally, the characteristics of the resin molded article according to the first to eleventh aspects will be briefly described. The tensile strength between the plated metal layer and the resin is about 2.0 kN / m or more. Met. Also, a soldering process, for example, 300 ° C. 6
There was no peeling of the metal layer even in the process of about 0 seconds.

[0080]

As described above, according to the present invention, a resin and a metal layer are directly laminated without interposing an adhesive layer, and the surface of the resin is roughened to a predetermined roughness as a bonding method. Even if the method of forming is, for example, a method such as sputtering or vapor deposition, the bonding strength between the metal layer and the resin can be dramatically increased as compared with the conventional method, and the electroless plating which is a further feature of the present invention. Thus, a strong metal layer can be formed directly on the surface of the resin, and since a predetermined resin material is selected, the heat resistance and the mechanical strength are sufficient and the surface roughness can be easily secured. A completed resin molded body and a method for manufacturing the resin molded body have been completed.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view simply showing the present invention.

FIG. 2 is a diagram showing the effect of the processing of the present invention.

FIG. 3 is a perspective view showing an example in which the resin molded body of the present invention is applied to a case.

FIG. 4 is a sectional view of a case where a resin molded body is applied to a case using the present invention.

FIG. 5 is a manufacturing process diagram for forming the electroless plating of the present invention on a resin molded body.

FIG. 6 is an exploded perspective view showing an optimum surface roughness of the resin of the present invention.

FIG. 7 is a manufacturing process diagram of the present invention.

FIG. 8 is another manufacturing process diagram of the present invention.

FIG. 9 is a perspective view of a conceptual diagram of sandblasting.

FIG. 10 is a perspective view and an enlarged view showing a surface state of a resin after sandblasting.

FIG. 11 is an electron micrograph of the surface state of a resin substrate treated by sandblasting.

FIG. 12 is a conceptual diagram of wet blast.

FIG. 13 is a conceptual diagram of a projection gun.

FIG. 14 is a view showing optimum conditions for wet blasting.

FIG. 15 is an electron micrograph of the surface state of a resin substrate treated with wet blast.

FIG. 16 is a diagram showing a result of study on media for wet blasting.

FIG. 17 is a manufacturing process diagram of an electronic circuit structure having a thick wiring according to the present invention.

FIG. 18 is a manufacturing process diagram of a conventional electronic circuit structure.

[Explanation of symbols]

 10, 20, 30, 40, 60 Resin molded body 11, 21, 31, 41, 61, 101, 121 Resin 12, 22, 32, 42, 62, metal layer

Claims (11)

[Claims] 1. A resin molded body in which a resin and a metal layer made of a single material are directly laminated without interposing an adhesive material layer, and the lamination of the metal layer on the resin is performed when the resin surface itself has a rough surface. A resin molded article having a roughness of 0.1 μm or more and 10 μm or less, and a metal layer formed on the surface of the roughened resin. 2. A method for producing a resin molded body in which a resin made of a single material and a metal layer are directly laminated without interposing an adhesive material layer, wherein the step of directly laminating the metal layer on the resin comprises the step of: A step of roughening the surface itself to a surface roughness of 0.1 μm or more and 10 μm or less, and a step of directly forming a metal layer on the surface of the resin roughened by this step by electroless plating. Production method. 3. A resin molded product in which a resin made of a single material and a metal layer are directly laminated without interposing an adhesive material layer, wherein the direct lamination of the metal layer on the resin is such that the resin surface itself is a surface. A resin molded article having a roughness of 1 μm or more and 5 μm or less, and a metal layer formed directly on the surface of the roughened resin. 4. A method for manufacturing a resin molded body in which a resin made of a single material and a metal layer are directly laminated without interposing an adhesive material layer, wherein the step of directly laminating a metal layer on the resin comprises the step of: A method for producing a resin molded body, comprising: a step of roughening the surface itself to a surface roughness of 1 μm or more and 5 μm or less, and a step of directly forming a metal layer on the surface of the resin roughened by this step by electroless plating. . 5. The method for producing a resin molded product according to claim 2, wherein the roughening step is a step of roughening the resin surface itself by sandblasting. 6. The roughening step is a step of roughening the resin surface itself by wet blasting.
The method for producing a resin molded article according to the above. 7. The single material may be polyimide, polyamide imide, polyether ether ketone, polyphenylene sulfide, liquid crystal polymer, fluororesin, polysulfone, polyether sulfone, polyamide 46, polyethylene naphthalate, polybutylene terephthalate. The method for producing a resin molded article according to any one of claims 2, 4, 5, and 6, comprising a material selected from the group consisting of aromatic polyester and polyester. 8. The single material is polyimide, polyamideimide, polyetheretherketone, polyphenylenesulfide, liquid crystal polymer, fluororesin, polysulfone, polyethersulfone, polyamide 46, polyethylene naphthalate, polybutylene terephthalate. 4. The resin molded product according to claim 1, comprising a material selected from the group consisting of: 9. The media of the wet blast is polygonal particles having a center particle size of 10 to 300 μm and a hardness of 1300 to 2500 in the Knoop hardness or 7 to 15 in the Mohs hardness. A method for producing a resin molded product according to claim 6. 10. A method of manufacturing a resin molded body in which a resin made of a single material and a metal layer are directly laminated without interposing an adhesive material layer, wherein the step of directly laminating the metal layer on the resin comprises the step of: A step of roughening the surface itself to a surface roughness of 0.1 μm or more and 10 μm or less, a step of forming a conductive layer by electroless plating directly on the surface of the resin roughened in this step, Forming a thick metal layer by electrolytic plating using the conductive layer as a base. 11. A method for producing a resin molded body in which a resin made of a single material and a metal layer are directly laminated without interposing an adhesive material layer, wherein the step of directly laminating the metal layer on the resin surface comprises: A step of roughening the surface of the resin to a surface roughness of 0.1 μm or more and 10 μm or less, and forming a conductive layer made of copper and inevitable impurities directly on the surface of the resin roughened by this step by electroless plating. A method for producing a resin molded body, comprising: a step of forming a thick metal layer by electrolytic plating using a conductive layer formed in this step as a base.