TWI339729B - - Google Patents

Info

Publication number
TWI339729B
TWI339729B TW096125296A TW96125296A TWI339729B TW I339729 B TWI339729 B TW I339729B TW 096125296 A TW096125296 A TW 096125296A TW 96125296 A TW96125296 A TW 96125296A TW I339729 B TWI339729 B TW I339729B
Authority
TW
Taiwan
Application number
TW096125296A
Other versions
TW200809205A (en
Inventor
Gunsei Kimoto
Original Assignee
Gunsei Kimoto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gunsei Kimoto filed Critical Gunsei Kimoto
Publication of TW200809205A publication Critical patent/TW200809205A/zh
Application granted granted Critical
Publication of TWI339729B publication Critical patent/TWI339729B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW096125296A 2006-08-08 2007-07-11 Coordinate transforming apparatus for electrical signal connection TW200809205A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006240812A JP5041275B2 (ja) 2006-08-08 2006-08-08 電気信号接続用座標変換装置

Publications (2)

Publication Number Publication Date
TW200809205A TW200809205A (en) 2008-02-16
TWI339729B true TWI339729B (zh) 2011-04-01

Family

ID=39050099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096125296A TW200809205A (en) 2006-08-08 2007-07-11 Coordinate transforming apparatus for electrical signal connection

Country Status (5)

Country Link
US (1) US7514943B2 (zh)
JP (1) JP5041275B2 (zh)
KR (1) KR20080013792A (zh)
CN (1) CN101153878B (zh)
TW (1) TW200809205A (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4924881B2 (ja) * 2006-11-14 2012-04-25 軍生 木本 電気信号接続用座標変換装置
JP4859820B2 (ja) * 2007-12-05 2012-01-25 東京エレクトロン株式会社 プローブ
US8089294B2 (en) * 2008-08-05 2012-01-03 WinMENS Technologies Co., Ltd. MEMS probe fabrication on a reusable substrate for probe card application
JP2010054487A (ja) * 2008-08-26 2010-03-11 Isao Kimoto プローバ装置
US7737714B2 (en) * 2008-11-05 2010-06-15 Winmems Technologies Holdings Co., Ltd. Probe assembly arrangement
TWI397691B (zh) * 2010-02-09 2013-06-01 Gunsei Kimoto Probe station device
KR101337881B1 (ko) * 2012-03-28 2013-12-06 주식회사 고영테크놀러지 Ｐｃｂ 검사장치의 작업 데이터 생성 및 검사방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611128A (en) * 1968-07-26 1971-10-05 Hitachi Ltd Probe header for testing integrated circuits
JPS61225781A (ja) * 1985-03-29 1986-10-07 富士通株式会社 マトリクスボ−ド
JPH07318586A (ja) 1994-05-30 1995-12-08 Nec Kansai Ltd プローブカード
US6271674B1 (en) * 1999-04-07 2001-08-07 Kabushiki Kaisha Nihon Micronics Probe card
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays
JP2001267024A (ja) * 2000-03-16 2001-09-28 Enplas Corp 拡張端子部品
JP2001272430A (ja) * 2000-03-24 2001-10-05 Oht Inc 検査装置及び検査方法
JP2002296297A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体
JP4496456B2 (ja) 2001-09-03 2010-07-07 軍生 木本 プローバ装置
CN2713630Y (zh) * 2004-06-03 2005-07-27 威盛电子股份有限公司 探针卡包覆结构
JP4700353B2 (ja) * 2005-01-13 2011-06-15 山一電機株式会社 プローブエレメントの製造方法

Also Published As

Publication number Publication date
US7514943B2 (en) 2009-04-07
JP2008039756A (ja) 2008-02-21
CN101153878A (zh) 2008-04-02
TW200809205A (en) 2008-02-16
KR20080013792A (ko) 2008-02-13
CN101153878B (zh) 2011-06-15
US20080036449A1 (en) 2008-02-14
JP5041275B2 (ja) 2012-10-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees