TWI323500B - - Google Patents

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Publication number
TWI323500B
TWI323500B TW095149129A TW95149129A TWI323500B TW I323500 B TWI323500 B TW I323500B TW 095149129 A TW095149129 A TW 095149129A TW 95149129 A TW95149129 A TW 95149129A TW I323500 B TWI323500 B TW I323500B
Authority
TW
Taiwan
Prior art keywords
bracket
flange
slider
adhesive
dispenser
Prior art date
Application number
TW095149129A
Other languages
English (en)
Chinese (zh)
Other versions
TW200805585A (en
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200805585A publication Critical patent/TW200805585A/zh
Application granted granted Critical
Publication of TWI323500B publication Critical patent/TWI323500B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Coating Apparatus (AREA)
TW095149129A 2006-03-17 2006-12-27 Dispenser head TW200805585A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006074563A JP4558669B2 (ja) 2006-03-17 2006-03-17 ディスペンサへッド及びディスペンサヘッドの着地検出方法

Publications (2)

Publication Number Publication Date
TW200805585A TW200805585A (en) 2008-01-16
TWI323500B true TWI323500B (ko) 2010-04-11

Family

ID=38594931

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149129A TW200805585A (en) 2006-03-17 2006-12-27 Dispenser head

Country Status (3)

Country Link
JP (1) JP4558669B2 (ko)
KR (1) KR100808834B1 (ko)
TW (1) TW200805585A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101082999B1 (ko) 2010-01-05 2011-11-11 주식회사 두오텍 수지도포장치
KR101388123B1 (ko) * 2011-12-06 2014-04-24 신한다이아몬드공업 주식회사 디스펜서 구조

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2523340B2 (ja) * 1987-11-05 1996-08-07 東芝精機株式会社 ペレットボンディング用ペ―スト塗布装置
JPH01166531A (ja) * 1987-12-23 1989-06-30 Shinkawa Ltd デイスペンサー装置
JP2671005B2 (ja) * 1988-04-13 1997-10-29 株式会社 新川 ディスペンサー装置
JP3801674B2 (ja) * 1995-12-15 2006-07-26 松下電器産業株式会社 電子部品の実装方法
JP2005236103A (ja) * 2004-02-20 2005-09-02 Shinkawa Ltd ワイヤボンディング装置

Also Published As

Publication number Publication date
TW200805585A (en) 2008-01-16
KR100808834B1 (ko) 2008-03-03
KR20070094455A (ko) 2007-09-20
JP4558669B2 (ja) 2010-10-06
JP2007250980A (ja) 2007-09-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees