TWI323338B - Board for the measurement of the surface parallelity between the upper mold base and the lower mold base,measurement system for the surface parallelity between the upper mold base and the lower mold base,and method for adjusting the distance between the - Google Patents

Board for the measurement of the surface parallelity between the upper mold base and the lower mold base,measurement system for the surface parallelity between the upper mold base and the lower mold base,and method for adjusting the distance between the Download PDF

Info

Publication number
TWI323338B
TWI323338B TW095138720A TW95138720A TWI323338B TW I323338 B TWI323338 B TW I323338B TW 095138720 A TW095138720 A TW 095138720A TW 95138720 A TW95138720 A TW 95138720A TW I323338 B TWI323338 B TW I323338B
Authority
TW
Taiwan
Prior art keywords
mold base
measuring
lower mold
parallelism
distance
Prior art date
Application number
TW095138720A
Other languages
English (en)
Chinese (zh)
Other versions
TW200732623A (en
Inventor
Takashi Kurokawa
Mitsuhiro Takahashi
Hiromasa Takahashi
Original Assignee
Takahashi Keisei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takahashi Keisei Corp filed Critical Takahashi Keisei Corp
Publication of TW200732623A publication Critical patent/TW200732623A/zh
Application granted granted Critical
Publication of TWI323338B publication Critical patent/TWI323338B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/24Measuring arrangements characterised by the use of mechanical techniques for measuring angles or tapers; for testing the alignment of axes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/16Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/401Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW095138720A 2005-10-20 2006-10-20 Board for the measurement of the surface parallelity between the upper mold base and the lower mold base,measurement system for the surface parallelity between the upper mold base and the lower mold base,and method for adjusting the distance between the TWI323338B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005305313 2005-10-20
JP2006115261 2006-04-19
JP2006159162 2006-06-08
JP2006274521A JP2008014925A (ja) 2005-10-20 2006-10-05 上下定盤面平行度測定用ボード、上下定盤面平行度測定システムおよび上下定盤面間距離調整方法

Publications (2)

Publication Number Publication Date
TW200732623A TW200732623A (en) 2007-09-01
TWI323338B true TWI323338B (en) 2010-04-11

Family

ID=37962632

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138720A TWI323338B (en) 2005-10-20 2006-10-20 Board for the measurement of the surface parallelity between the upper mold base and the lower mold base,measurement system for the surface parallelity between the upper mold base and the lower mold base,and method for adjusting the distance between the

Country Status (5)

Country Link
JP (1) JP2008014925A (ja)
KR (1) KR20070043617A (ja)
HK (1) HK1100044A1 (ja)
TW (1) TWI323338B (ja)
WO (1) WO2007046552A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009166220A (ja) * 2008-01-21 2009-07-30 Takahashi Keisei:Kk 型抜きプレス装置および型抜きプレス装置の平行度測定システム
JP5674194B2 (ja) * 2010-10-14 2015-02-25 株式会社エス・ケー・ジー 平行度測定装置
CN102135409B (zh) * 2011-01-07 2012-05-23 南京理工大学 一种压力机动态精度测量装置
CN103673966A (zh) * 2012-09-04 2014-03-26 东北林业大学 一种两平面平行度的测量方法
JP5775619B2 (ja) * 2014-04-07 2015-09-09 株式会社エス・ケー・ジー 平行度測定装置
CN106313602B (zh) * 2015-06-01 2018-08-14 江苏创源电子有限公司 压力机
KR102167176B1 (ko) * 2019-07-19 2020-11-18 충북대학교 산학협력단 평행도 측정 장치 및 이를 포함하는 금형 장치
JP7335605B2 (ja) * 2019-11-25 2023-08-30 株式会社デュプロ 打ち抜き装置、定盤間平行調整方法及び定盤間平行調整部材
CN113124781A (zh) * 2021-03-30 2021-07-16 莆田杰木科技有限公司 平行度检测方法及平行度检测装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59218909A (ja) * 1983-05-26 1984-12-10 Fuso Light Alloys Co Ltd ダイカスト機におけるダイハイト平行度測定装置
JP2000111310A (ja) * 1998-10-05 2000-04-18 Mitsubishi Electric Corp 平行度測定装置

Also Published As

Publication number Publication date
TW200732623A (en) 2007-09-01
JP2008014925A (ja) 2008-01-24
KR20070043617A (ko) 2007-04-25
HK1100044A1 (en) 2007-08-31
WO2007046552A1 (ja) 2007-04-26

Similar Documents

Publication Publication Date Title
TWI323338B (en) Board for the measurement of the surface parallelity between the upper mold base and the lower mold base,measurement system for the surface parallelity between the upper mold base and the lower mold base,and method for adjusting the distance between the
JP2006281502A (ja) シール装置
CN100470195C (zh) 上下模座面的平行度测定板、测定系统、间距的调整方法
CN102166761A (zh) 用于修整工具的方法
JP2012024165A (ja) 放射線画像撮影装置、及び圧迫板
CN102778312A (zh) 一种测试模切压力的方法及其装置
JP3177347U (ja) 紙質材料判定装置
JP2009012006A (ja) 絞りプレス型用ディスタンスブロックの当り強さ測定装置及びその測定方法
CN105181452A (zh) 一种测力组件
US10814666B2 (en) Method of manufacturing foil stamped artwork
CN106546144A (zh) 一种间隙和面差一体测量仪及其测量方法
CN108604138A (zh) 压力传感装置及具有该压力传感装置的电子设备
CN204694198U (zh) 一种硫化胶扯断永久变形测试装置
JP2004347354A (ja) プレス成形中の金型変位量の測定方法および測定装置
CN113093417A (zh) 测量装置
US5887638A (en) Apparatus for measuring strength of a mold and for pressing marks on the mold
CN103050481A (zh) 印字检测治具
CN219625271U (zh) 一种用于测试线材软硬度的治具
CN203325899U (zh) 印字检测治具
CN219685924U (zh) 一种卧式平压平模切机用智能补压平台
CN201522248U (zh) 一种测量板尺
KR101876467B1 (ko) 점자 디스플레이용 액츄에이터
CN217236646U (zh) 一种电雕版平面厚度测量装置
JP4788396B2 (ja) シート打抜型およびバランス調整用有刃ブロック
CN218330036U (zh) 一种温度与高度变化同步实时测量仪

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees