TWI323287B - - Google Patents

Download PDF

Info

Publication number
TWI323287B
TWI323287B TW095110265A TW95110265A TWI323287B TW I323287 B TWI323287 B TW I323287B TW 095110265 A TW095110265 A TW 095110265A TW 95110265 A TW95110265 A TW 95110265A TW I323287 B TWI323287 B TW I323287B
Authority
TW
Taiwan
Prior art keywords
phase
thickness
alloy
mass
plating layer
Prior art date
Application number
TW095110265A
Other languages
English (en)
Chinese (zh)
Other versions
TW200706662A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200706662A publication Critical patent/TW200706662A/zh
Application granted granted Critical
Publication of TWI323287B publication Critical patent/TWI323287B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Conductive Materials (AREA)
TW095110265A 2005-03-29 2006-03-24 Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof TW200706662A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005096487 2005-03-29

Publications (2)

Publication Number Publication Date
TW200706662A TW200706662A (en) 2007-02-16
TWI323287B true TWI323287B (ko) 2010-04-11

Family

ID=37030538

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110265A TW200706662A (en) 2005-03-29 2006-03-24 Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof

Country Status (3)

Country Link
KR (1) KR100774226B1 (ko)
CN (1) CN100576366C (ko)
TW (1) TW200706662A (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8698002B2 (en) * 2009-01-20 2014-04-15 Mitsubishi Shindoh Co., Ltd. Conductive member and method for producing the same
KR101356258B1 (ko) 2009-09-30 2014-01-28 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 주석 도금의 내열 박리성이 우수한 Ｃｕ-Ｎｉ-Ｓｉ계 합금 주석 도금조
TW201311944A (zh) * 2011-08-12 2013-03-16 Mitsubishi Materials Corp 插拔性優異的鍍錫銅合金端子材及其製造方法
CN103014409B (zh) * 2011-09-21 2016-04-06 三菱伸铜株式会社 凸焊特性优异的Cu-Ni-Si系铜合金及其制造方法
JP5874827B2 (ja) * 2012-06-19 2016-03-02 株式会社村田製作所 接合用部材
CN105112715B (zh) * 2015-09-08 2017-10-20 长沙中工新材料有限公司 CuZnNiSi合金及其制备方法以及该合金制备带材的方法
CN105695797A (zh) * 2016-04-20 2016-06-22 苏州市相城区明达复合材料厂 一种铸造加工零部件用青铜合金
DE102016008753B4 (de) * 2016-07-18 2020-03-12 Wieland-Werke Ag Kupfer-Nickel-Zinn-Legierung, Verfahren zu deren Herstellung sowie deren Verwendung
KR101900793B1 (ko) 2017-06-08 2018-09-20 주식회사 풍산 전기·전자, 자동차 부품용 동합금의 주석 도금 방법 및 이로부터 제조된 동합금의 주석 도금재
CN115233131A (zh) * 2022-06-17 2022-10-25 武汉凌云光电科技有限责任公司 一种有色金属浸镀锡后激光熔覆、抛光的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0830235B2 (ja) * 1991-04-24 1996-03-27 日鉱金属株式会社 導電性ばね用銅合金
JP3391427B2 (ja) * 1996-05-14 2003-03-31 三菱伸銅株式会社 メッキ銅合金薄板およびその薄板で製造したコネクタ

Also Published As

Publication number Publication date
CN100576366C (zh) 2009-12-30
KR100774226B1 (ko) 2007-11-07
TW200706662A (en) 2007-02-16
KR20060105509A (ko) 2006-10-11
CN1841570A (zh) 2006-10-04

Similar Documents

Publication Publication Date Title
TWI323287B (ko)
TWI316554B (ko)
TWI331633B (ko)
US7972709B2 (en) Cu-Zn alloy strip superior in thermal peel resistance of Sn plating and Sn plating strip thereof
JP4934785B2 (ja) Ｓｎめっき銅合金材料およびその製造方法
TWI840541B (zh) 銅合金板、附鍍敷被膜銅合金板及此等之製造方法
JP2007291458A (ja) Ｃｕ−Ｎｉ−Ｓｉ合金すずめっき条
JP5132467B2 (ja) 導電率および強度に優れる電気・電子部品用銅合金およびＳｎめっき銅合金材
JP5950499B2 (ja) 電気・電子部品用銅合金及びＳｎめっき付き銅合金材
JP4489738B2 (ja) Ｃｕ−Ｎｉ−Ｓｉ−Ｚｎ系合金すずめっき条
JP2006307336A (ja) Ｃｕ−Ｎｉ−Ｓｉ−Ｚｎ系合金Ｓｎめっき条
KR101356258B1 (ko) 주석 도금의 내열 박리성이 우수한 Ｃｕ-Ｎｉ-Ｓｉ계 합금 주석 도금조
JP2007039789A (ja) すずめっきの耐熱剥離性に優れるＣｕ−Ｎｉ−Ｓｉ−Ｚｎ−Ｓｎ系合金条およびそのすずめっき条
JP4820228B2 (ja) Ｓｎめっきの耐熱剥離性に優れるＣｕ−Ｚｎ−Ｓｎ系合金条及びそのＳｎめっき条
JP2012007242A (ja) Ｃｕ−Ｎｉ−Ｓｉ合金すずめっき条
KR100774225B1 (ko) Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ 계 합금 주석 도금조
JP2003089832A (ja) めっき耐熱剥離性に優れた銅合金箔
JP2007084921A (ja) Ｃｕ−Ｚｎ−Ｓｎ系合金すずめっき条
TW200535260A (en) Cu-Ni-Si-Mg based copper alloy strip
JPH0987814A (ja) 電子機器用銅合金の製造方法
EP4123043A1 (en) Cu-ni-si-based copper alloy plate, film-plated cu-ni-si-based copper alloy plate, and production method for cu-ni-si-based copper alloy plate and film-plated cu-ni-si-based copper alloy plate
JP2004232049A (ja) Ｃｕめっきチタン銅
JP4642701B2 (ja) めっき密着性に優れるＣｕ−Ｎｉ−Ｓｉ系合金条
JP4838524B2 (ja) 電気電子部品用銅合金材
WO2009123139A1 (ja) すずめっきの耐熱剥離性に優れるＣｕ－Ｎｉ－Ｓｉ系合金すずめっき条