TWI318547B - - Google Patents
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- Publication number
- TWI318547B TWI318547B TW96105626A TW96105626A TWI318547B TW I318547 B TWI318547 B TW I318547B TW 96105626 A TW96105626 A TW 96105626A TW 96105626 A TW96105626 A TW 96105626A TW I318547 B TWI318547 B TW I318547B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- aluminum substrate
- circuit board
- aluminum
- holes
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 95
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 75
- 229910052782 aluminium Inorganic materials 0.000 claims description 75
- 238000000034 method Methods 0.000 claims description 33
- 238000005530 etching Methods 0.000 claims description 21
- 230000001681 protective effect Effects 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000003223 protective agent Substances 0.000 claims description 12
- 230000003628 erosive effect Effects 0.000 claims description 9
- 230000001680 brushing effect Effects 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 238000012805 post-processing Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000011814 protection agent Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000000976 ink Substances 0.000 claims 2
- 239000003814 drug Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000007639 printing Methods 0.000 description 7
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 1
- 241000238631 Hexapoda Species 0.000 description 1
- 206010036790 Productive cough Diseases 0.000 description 1
- NHLJQEGDLCNJFL-UHFFFAOYSA-M S(=O)(=O)(OCCCCCCCCCCCC)[O-].[Na+].C(C1=CC=CC=C1)(=O)O Chemical compound S(=O)(=O)(OCCCCCCCCCCCC)[O-].[Na+].C(C1=CC=CC=C1)(=O)O NHLJQEGDLCNJFL-UHFFFAOYSA-M 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- SFNALCNOMXIBKG-UHFFFAOYSA-N ethylene glycol monododecyl ether Chemical compound CCCCCCCCCCCCOCCO SFNALCNOMXIBKG-UHFFFAOYSA-N 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- CBXWGGFGZDVPNV-UHFFFAOYSA-N so4-so4 Chemical group OS(O)(=O)=O.OS(O)(=O)=O CBXWGGFGZDVPNV-UHFFFAOYSA-N 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96105626A TW200835409A (en) | 2007-02-15 | 2007-02-15 | Method of manufacturing circuit board capable of preventing etchant from eroding aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96105626A TW200835409A (en) | 2007-02-15 | 2007-02-15 | Method of manufacturing circuit board capable of preventing etchant from eroding aluminum substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200835409A TW200835409A (en) | 2008-08-16 |
| TWI318547B true TWI318547B (enExample) | 2009-12-11 |
Family
ID=44819706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96105626A TW200835409A (en) | 2007-02-15 | 2007-02-15 | Method of manufacturing circuit board capable of preventing etchant from eroding aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200835409A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT512525B1 (de) * | 2012-05-04 | 2013-09-15 | Mikroelektronik Ges Mit Beschraenkter Haftung Ab | Leiterplatte, insbesondere für ein Leistungselektronikmodul, umfassend ein elektrisch leitfähiges Substrat |
-
2007
- 2007-02-15 TW TW96105626A patent/TW200835409A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200835409A (en) | 2008-08-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |