TW200835409A - Method of manufacturing circuit board capable of preventing etchant from eroding aluminum substrate - Google Patents
Method of manufacturing circuit board capable of preventing etchant from eroding aluminum substrate Download PDFInfo
- Publication number
- TW200835409A TW200835409A TW96105626A TW96105626A TW200835409A TW 200835409 A TW200835409 A TW 200835409A TW 96105626 A TW96105626 A TW 96105626A TW 96105626 A TW96105626 A TW 96105626A TW 200835409 A TW200835409 A TW 200835409A
- Authority
- TW
- Taiwan
- Prior art keywords
- aluminum substrate
- substrate
- circuit board
- aluminum
- holes
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 121
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 95
- 230000003628 erosive effect Effects 0.000 title claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 title abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 42
- 238000005530 etching Methods 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 238000005553 drilling Methods 0.000 claims abstract description 10
- 238000004381 surface treatment Methods 0.000 claims abstract description 8
- 239000013043 chemical agent Substances 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims description 23
- 239000003223 protective agent Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 238000012805 post-processing Methods 0.000 claims description 6
- 230000001680 brushing effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 241000446313 Lamella Species 0.000 claims 1
- 210000004556 brain Anatomy 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 abstract description 8
- 239000011814 protection agent Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 230000000873 masking effect Effects 0.000 abstract 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- 239000000976 ink Substances 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- 229920001451 polypropylene glycol Polymers 0.000 description 6
- 239000002202 Polyethylene glycol Substances 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- SFNALCNOMXIBKG-UHFFFAOYSA-N ethylene glycol monododecyl ether Chemical compound CCCCCCCCCCCCOCCO SFNALCNOMXIBKG-UHFFFAOYSA-N 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- CBXWGGFGZDVPNV-UHFFFAOYSA-N so4-so4 Chemical group OS(O)(=O)=O.OS(O)(=O)=O CBXWGGFGZDVPNV-UHFFFAOYSA-N 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 2
- NOOLISFMXDJSKH-UTLUCORTSA-N (+)-Neomenthol Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@@H]1O NOOLISFMXDJSKH-UTLUCORTSA-N 0.000 description 1
- NOOLISFMXDJSKH-UHFFFAOYSA-N DL-menthol Natural products CC(C)C1CCC(C)CC1O NOOLISFMXDJSKH-UHFFFAOYSA-N 0.000 description 1
- PQUCIEFHOVEZAU-UHFFFAOYSA-N Diammonium sulfite Chemical compound [NH4+].[NH4+].[O-]S([O-])=O PQUCIEFHOVEZAU-UHFFFAOYSA-N 0.000 description 1
- 241000238631 Hexapoda Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- -1 Polyethylene Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004141 Sodium laurylsulphate Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PLUHAVSIMCXBEX-UHFFFAOYSA-N azane;dodecyl benzenesulfonate Chemical compound N.CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 PLUHAVSIMCXBEX-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 229940041616 menthol Drugs 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- HFQQZARZPUDIFP-UHFFFAOYSA-M sodium;2-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HFQQZARZPUDIFP-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96105626A TW200835409A (en) | 2007-02-15 | 2007-02-15 | Method of manufacturing circuit board capable of preventing etchant from eroding aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96105626A TW200835409A (en) | 2007-02-15 | 2007-02-15 | Method of manufacturing circuit board capable of preventing etchant from eroding aluminum substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200835409A true TW200835409A (en) | 2008-08-16 |
| TWI318547B TWI318547B (enExample) | 2009-12-11 |
Family
ID=44819706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96105626A TW200835409A (en) | 2007-02-15 | 2007-02-15 | Method of manufacturing circuit board capable of preventing etchant from eroding aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200835409A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9648736B2 (en) | 2012-05-04 | 2017-05-09 | A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate |
-
2007
- 2007-02-15 TW TW96105626A patent/TW200835409A/zh not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9648736B2 (en) | 2012-05-04 | 2017-05-09 | A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate |
| US10091874B2 (en) | 2012-05-04 | 2018-10-02 | Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Circuit board, particulary for a power-electronic module, comprising an electrically-conductive substrate |
| TWI649013B (zh) * | 2012-05-04 | 2019-01-21 | Ａｂ微電子有限公司 | 導電板，含導電基板在內，尤指用於功率電子模組者 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI318547B (enExample) | 2009-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |