200952584 九、發明說明： •【發明所屬之技術領域】 本發明涉及軟硬複合電路板的技術，尤其涉及如何在一 軟硬複合電路板㈣財職―可紹紐層，來賴其軟性 電路板上諸如金手指之類的導電線路。 【先前技術】 ❹ 在台灣M259439號新型專利案令揭露-保護膠層係以 印刷方式塗覆在-電路板上的金手指上。該保護膠層是一種 包含石夕質基底材料之紫外線硬化膠，可經由紫外線照射予以 固化。該保護膠層具有彈性，厚度是〇1〜〇 2mm，能忍耐至 少250。(：的高溫，可隨該電路板經過電鍍或回焊製程之後 予撕除。 由於硬f生電路板與軟硬複合電路板(打ex_rigid printed wmng board)的製程不同，且硬性電路板與軟硬複合電路板 ⑩ 的軟板部份的表面特性亦不相同，所以，上述保護層僅適用 於硬性電路板，不適用於軟硬複合電路板。 【發明内容】 本發明提供一種軟硬複合電路板的製造方法。該軟硬複 口電路板包括一軟性電路板及一硬性電路板。該軟性電路板 有一硬板接收區及一外露區。該外露區有一導電線路，例如 金手指。該製造方法包括：提供該軟性電路板。於該軟性電 路板上疊合一網板，該網板有一鏤空孔圖案供對應露出該軟 5 200952584 性電路板的導電線路。將成份包括環氧樹脂及矽膠的膏狀材 料施加於該網板上。利用一刮刀將該膏狀材料對應填充於該 網板的鏤空孔圖案中，使得該膏狀材料覆蓋住該導電線路。 移除該網板。烘烤覆蓋住該導電線路的膏狀材料。於該軟性 電路板的硬板接收區形成一硬性電路板。 更特別的是，該製造方法還包括在前述過程中，控制該 網板的厚度、該膏狀材料的成份比例、該到刀的移動速度及 其施加於該網板上的壓力、以及烘烤該膏狀材料的溫度與時 間等衣程條件’以使覆盍在該導電線路上的膏狀材料變成一 可剝保護層。該可剝保護層係具有大於20度之邊緣角度， 且易於用手剝離’以及能抵抗該硬性電路板在其製程中所面 臨的高溫與化學藥劑。 再者’本發明也提供根據上述方法製造出來的軟硬複合 電路板’其特別具備上述的可剝保護層。 至於本發明的其它技術内容與更詳細的說明，將揭露於 隨後的說明。 【實施方式】 第一至五圖係顯示本發明方法之一較佳實施例，其中指 出一種軟硬複合電路板的製造方法包括隨後述及的a至g 步驟，即： a)提供如第一圖所示的軟性電路板1。該軟性電路板1 有一硬板接收區10及一外露區20。該外露區20的表面有 一導電線路201，例如金手指。該硬板接收區1〇亦有一線 6 200952584 ::第圖所來與後續的硬性電路板作電性連接= 該二:空:二1軟性電路板1上私-網板2。 導電線路20卜 0供對應露出該軟性電路板1的 M 核包姆氧魏切膠的纽鄉3，例如含有 衣乳樹脂及鄉的可剝止焊漆，施加於該網板2上 ❹ 空孔㈣纽材料3對應4充於該網板2的鏤 一如^_示膏狀材料3覆蓋住該導電線路撕， e)移除該網板2。 L烘烤覆錄料€料2()1的#狀材料3，以使該膏 狀材料3變成如第四、五圖中所示的可剥保護層3a Μ 枯/於該軟性電路板1的硬板接㈣10製作-硬性電路 Hr構成如α ^路 該硬性電路板4可為單層或多層。 上述是使用用網板印刷方式使該導電線路2〇1 ^用Ϊ形成該可剝保護層的#狀材料3，這也可選用鋼板 二網印刷或無網印刷方式來進行。 春狀titb至f步驟中’更分別控制該網板2的厚度、該 =則4 3的成份比例、該刮刀的移動速度及其施加於該網 你杜的壓力、以及供烤該膏狀材料3的溫度與時間等製程 使第五时所示的可剝保護層3a具有大於20度之 該_度θ即該可剥保護層％的邊緣切 、,、Ά人生電路板1之接觸角。此外，透過前述製程條件的 7 200952584 控制’該可剝保護層3a也因而具有易於用手剝離之特性， ‘並此抵抗在製造該硬性電路板4之過程中所面臨的高溫齊 化學藥劑的侵蝕。 由於該可剝保護層3a在製造該硬性電路板4的過程中 疋被保留的。所以，在此過程中，該導電線路是受到該 可剝保護層3a的保護’完全不會被製程中的高溫所破壞， 也不會受到化學侵蝕。一直到該導電線路2〇1被使用時，才 需要將該可剝保護層3a予以剝除。該可剝保護層3a是可以 ® 用手直接剝離乾淨的。 根據實驗，當該可剝保護層3a的邊緣角度0小於2〇 度時’該可剝保護層3a的邊緣部份相對變得太薄而容易被 烤焦。當該可剝保護層3a的邊緣部份被烤焦，就很難將該 可剝保護層3a剝離乾淨。 由於本發明方法是在製造軟性電路板的階段就先完成 一可剝保護層來保護於其外露區的導電線路，因此，在製造 硬性電路板等後續製程中，其軟性電路板的外露區上的導電 線路’都可受到該可剝保護層的良好保護，從而解決先前技 術中的保護層無法適用於軟硬複合電路板製程的問題。 再者，該可剝保護層的成份包含有環氧樹脂及石夕膠，且 是在一些受到適當控制的製程條件下而形成的，因此，該可 剝保護層具有易於用手剝離乾淨之特性，及能抵抗製造硬性 電路板等後續製程中的高溫破壞與化學藥劑侵姓。 無諭如何’任何人都可以從上述例子的說明中獲得足夠 教導，並據而了解到本發明確實具有產業上之利用性及進步200952584 IX. INSTRUCTIONS: • Technical field of invention The present invention relates to the technology of soft and hard composite circuit boards, and in particular relates to how to soften a flexible circuit board in a soft and hard composite circuit board (4) Conductive lines such as gold fingers. [Prior Art] 新型 In the new patent application No. M259439 in Taiwan, the protective layer is printed on the gold finger on the circuit board. The protective adhesive layer is an ultraviolet hardening gel comprising a stone base material which can be cured by ultraviolet irradiation. The protective rubber layer has elasticity and a thickness of 〇1 to 〇 2 mm, and can withstand at least 250. (: The high temperature can be removed after the board is subjected to electroplating or reflow process. Since the process of hard f-circuit board and soft-hard composite board (ex_rigid printed wmng board) is different, and the hard board and soft The surface characteristics of the soft board portion of the hard composite circuit board 10 are also different. Therefore, the above protective layer is only suitable for a rigid circuit board, and is not suitable for a soft and hard composite circuit board. SUMMARY OF THE INVENTION The present invention provides a soft and hard composite circuit The flexible and hard-working circuit board comprises a flexible circuit board and a rigid circuit board. The flexible circuit board has a hard board receiving area and an exposed area. The exposed area has a conductive line, such as a gold finger. The method comprises: providing the flexible circuit board. A stencil is superposed on the flexible circuit board, and the stencil has a vacant hole pattern for correspondingly exposing the conductive circuit of the soft circuit board. The component comprises epoxy resin and silicone rubber. The paste material is applied to the stencil. The paste material is filled into the vent pattern of the stencil by a scraper so that the paste material covers Conductive circuit. The stencil is removed. The paste material covering the conductive line is baked. A rigid circuit board is formed in the hard board receiving area of the flexible circuit board. More specifically, the manufacturing method is also included in the foregoing process. Controlling the thickness of the stencil, the composition ratio of the paste material, the moving speed of the knives and the pressure applied to the stencil, and the conditions and conditions such as the temperature and time for baking the paste material' So that the paste material covering the conductive line becomes a peelable protective layer. The peelable protective layer has an edge angle of more than 20 degrees, and is easy to peel off by hand' and can resist the hard circuit board in its process The high temperature and chemical agents faced in the present invention. Further, the present invention also provides a soft and hard composite circuit board manufactured according to the above method, which particularly has the above peelable protective layer. Other technical contents and more detailed description of the present invention BRIEF DESCRIPTION OF THE DRAWINGS [Embodiment] The first to fifth drawings show a preferred embodiment of the method of the present invention, which indicates the manufacture of a soft and hard composite circuit board. A method comprising subsequent to step g mentioned, namely: a) providing a first, as shown in FIG. 1 of the flexible circuit board. The flexible circuit board 1 has a hard board receiving area 10 and an exposed area 20. The surface of the exposed region 20 has a conductive trace 201, such as a gold finger. The hard board receiving area 1〇 also has a line 6 200952584 :: the figure is connected with the subsequent rigid circuit board = the second: empty: two 1 flexible circuit board 1 on the private - network board 2. The conductive line 20 is provided for the New Zealand 3 corresponding to the M-nuclear oxy-di- wei-cut of the flexible circuit board 1, for example, a peelable solder lacquer containing a latex resin and a household, and is applied to the stencil 2 to be hollowed out. The hole (four) button material 3 corresponds to the stencil of the stencil 2, and the paste material 3 covers the conductive line to tear, and e) removes the stencil 2. L bakes the material #2 of the material 2 () 1 so that the paste material 3 becomes the peelable protective layer 3a as shown in the fourth and fifth figures Μ / / on the flexible circuit board 1 The hard board connection (four) 10 is made - the hard circuit Hr is composed of, for example, α. The rigid circuit board 4 can be a single layer or a plurality of layers. The above is to use the screen printing method to make the conductive line 2〇1 ^ to form the peelable protective layer of the #-like material 3, which can also be carried out by using a steel screen two-screen printing or a screenless printing method. In the spring titb to f step, the thickness of the stencil 2 is controlled separately, the ratio of the composition of the stencil 4, the moving speed of the squeegee, the pressure applied to the net, and the paste material. The process of temperature and time of 3 causes the peelable protective layer 3a shown at the fifth time to have the _degree θ greater than 20 degrees, that is, the edge of the peelable protective layer %, and the contact angle of the circuit board 1. Further, the peelable protective layer 3a is controlled by the above-mentioned process conditions 7 200952584, and thus has the characteristics of being easily peeled off by hand, and is resistant to the erosion of the high-temperature chemical agent encountered in the process of manufacturing the rigid circuit board 4. . Since the peelable protective layer 3a is left in the process of manufacturing the rigid circuit board 4, it is retained. Therefore, in the process, the conductive line is protected by the peelable protective layer 3a' completely undamaged by the high temperature in the process and is not subjected to chemical attack. The peelable protective layer 3a needs to be stripped until the conductive line 2〇1 is used. The peelable protective layer 3a can be directly peeled off by hand. According to experiments, when the edge angle 0 of the peelable protective layer 3a is less than 2 ’ degrees, the edge portion of the peelable protective layer 3a becomes relatively thin and is easily scorched. When the edge portion of the peelable protective layer 3a is scorched, it is difficult to peel off the peelable protective layer 3a. Since the method of the present invention completes a strippable protective layer to protect the conductive lines in the exposed area at the stage of manufacturing the flexible circuit board, the exposed area of the flexible circuit board is formed in a subsequent process such as manufacturing a rigid circuit board. The conductive line 'is well protected by the strippable protective layer, thereby solving the problem that the protective layer in the prior art cannot be applied to the soft and hard composite circuit board process. Furthermore, the composition of the peelable protective layer comprises epoxy resin and shijiao, and is formed under some suitably controlled process conditions. Therefore, the peelable protective layer has the characteristics of being easily peeled off by hand. And can resist the high temperature damage and chemical intrusion in the subsequent processes such as the manufacture of rigid boards. Innocent How? Anyone can get enough instruction from the description of the above examples, and understand that the invention does have industrial applicability and progress.
I 200952584 性，且本發明在同一領域中均未見有相同或類似技術揭露在 先而具足有新穎性，是本發明確已符合發明專利要件，爰依 法提出申請。I 200952584, and the present invention does not disclose the same or similar technology in the same field. The invention is indeed in line with the invention patent requirements, and the application is filed according to the law.
❹ 9 200952584 【圖式簡單說明】 一種軟性電路板。 ，係顯示該軟性電路板覆 第一圖中的外觀示意圖，係顯示 第二圖中的部份斷面放大示意圖 蓋一網板的情形。 第三圖中的部份斷面放大示意_，係顯示膏狀特料被填充 在該網板的鏤空孔圖案内的情形。 ' 第四圖中的外觀示意圖，係顯示由該膏狀材料所形成之可❹ 9 200952584 [Simple description of the diagram] A flexible circuit board. , showing the appearance of the flexible circuit board in the first figure, showing a partial cross-sectional enlarged view of the second figure. The partial cross-section in the third figure is enlarged to show that the paste-like material is filled in the hollow hole pattern of the screen. 'The schematic diagram of the appearance in the fourth figure shows that it can be formed by the paste material.
剝保護層覆蓋於該軟性電路板的導電線路上的情 形。 第五圖中的部份斷面放大示意圖，係顯示一種以該軟性電 路板為核心的軟硬複合電路板。 【主要元件符號說明】 1軟性電路板 2網板 201導電線路 3膏狀材料 4硬性電路板 10硬板接收區 20外露區 3a可剝保護層 5軟硬複合電路板Stripping the protective layer over the conductive traces of the flexible circuit board. A partially enlarged cross-sectional view of the fifth figure shows a soft and hard composite circuit board with the flexible circuit board as the core. [Description of main components] 1 flexible circuit board 2 stencil 201 conductive circuit 3 paste material 4 rigid circuit board 10 hard board receiving area 20 exposed area 3a peelable protective layer 5 soft and hard composite circuit board