JP2000228572A - Formation of terminals of flexible circuit board - Google Patents
Formation of terminals of flexible circuit boardInfo
- Publication number
- JP2000228572A JP2000228572A JP11028337A JP2833799A JP2000228572A JP 2000228572 A JP2000228572 A JP 2000228572A JP 11028337 A JP11028337 A JP 11028337A JP 2833799 A JP2833799 A JP 2833799A JP 2000228572 A JP2000228572 A JP 2000228572A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- cover
- layer
- wiring layer
- circuit wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、可撓性回路基板の
回路配線層の表面を保護する為のカバ−層を形成する際
に回路配線層の端子部を適正に露出できる可撓性回路基
板の端子部形成法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit capable of properly exposing terminals of a circuit wiring layer when forming a cover layer for protecting the surface of the circuit wiring layer of a flexible circuit board. The present invention relates to a method for forming a terminal portion of a substrate.
【０００２】[0002]
【従来の技術】車載用などの近年の可撓性回路基板の或
る種の製品には、耐熱性と共に低価格化が要求されてい
る。このような可撓性回路基板では、回路配線層の表面
を保護する為のカバ−層として、感光性ポリイミドフィ
ルムやポリイミド系カバ−コ−トインク等の耐熱性カバ
−材料が使用されている。2. Description of the Related Art In recent years, certain products of flexible circuit boards for vehicles and the like are required to have heat resistance and low cost. In such a flexible circuit board, a heat-resistant cover material such as a photosensitive polyimide film or a polyimide-based cover ink is used as a cover layer for protecting the surface of the circuit wiring layer.
【０００３】このようなカバ−層としてポリイミド系カ
バ−コ−トインクを使用する場合には、スクリ−ン印刷
手段又は全面塗布後にレ−ザ−加工手段などで回路配線
層の端子部を露出させる開口部の形成を行っていた。When a polyimide-based cover ink is used as such a cover layer, a terminal portion of the circuit wiring layer is exposed by a screen printing means or a laser processing means after the entire surface is coated. An opening was formed.
【０００４】[0004]
【発明が解決しようとする課題】しかし、感光性ポリイ
ミドフィルムを用いた端子部の為の開口部の形成手法又
はポリイミド系カバ−コ−トインクを使用してレ−ザ−
加工手段で斯かる開口部を形成する手法はコストが高
く、また、スクリ−ン印刷手段では端子部の為の開口部
を適正に形成することが困難であるという問題があっ
た。However, a method of forming an opening for a terminal using a photosensitive polyimide film or a laser using a polyimide-based cover ink is used.
There is a problem that the method of forming such an opening by the processing means is expensive, and it is difficult to form the opening for the terminal portion properly by the screen printing means.
【０００５】即ち、例えば可撓性回路基板の回路配線層
に於ける端子部の表面に予め適当なマスクを設け、この
マスクの表面を露出させるように回路配線層の表面に所
要の厚さにポリイミド系カバ−コ−トインクを塗布硬化
させた後、適当な剥離液を用いてマスクを除去して開口
部を形成することにより、回路配線層の端子部を露出さ
せる手法の場合、上記カバ−コ−トインクを塗布する際
にマスクの表面を適正に露出させるように塗布しない
と、マスクの除去後にも開口部を部分的に覆うようにカ
バ−コ−トが残って不完全な開口部が形成される。That is, for example, an appropriate mask is previously provided on the surface of the terminal portion in the circuit wiring layer of the flexible circuit board, and the surface of the circuit wiring layer is formed to a required thickness so as to expose the surface of the mask. In the case of a method in which the polyimide-based cover coat ink is applied and cured, the mask is removed using an appropriate stripper to form an opening, thereby exposing the terminal portion of the circuit wiring layer. If the coating ink is not applied so as to properly expose the surface of the mask when the coating ink is applied, a cover coat remains so as to partially cover the opening even after the mask is removed, resulting in an incomplete opening. It is formed.
【０００６】また、上記カバ−コ−トインクを塗布する
際にマスクの表面をも覆うように塗布してしまうと、マ
スクの除去は剥離液では不可能となって開口部の形成は
できないこととなる。If the cover coat ink is applied so as to cover the surface of the mask, it is impossible to remove the mask with a stripping liquid and to form an opening. Become.
【０００７】そこで、このような問題を解消する為に例
えば図２（１）の如く、回路配線層１０に於ける端子部
の表面にマスク１１を形成し、このマスク１１の表面を
も覆うように回路配線層の表面に所要の厚さにポリイミ
ド系カバ−コ−トインク１２を塗布硬化させた後、マス
ク１１の表面を露出させる為に搬送ベルトロ−ル研磨手
段等を用いてカバ−コ−トインク１２を適当な厚さだけ
除去しようとしても、可撓性回路基板は平坦ではなく、
また、ベルトロ−ル研磨装置の圧力調整も困難である
為、同図（２）のように必要なカバ−コ−ト領域も除去
されて回路配線層１０が現れる露出部１４を生ずるよう
な不完全なカバ−層１３が形成される。To solve such a problem, a mask 11 is formed on the surface of the terminal portion of the circuit wiring layer 10 as shown in FIG. After the polyimide cover coat ink 12 is applied to a required thickness on the surface of the circuit wiring layer and cured, the cover belt is polished using a conveyor belt roll polishing means or the like to expose the surface of the mask 11. Even if an attempt is made to remove the ink 12 by an appropriate thickness, the flexible circuit board is not flat,
Also, since it is difficult to adjust the pressure of the belt roll polishing apparatus, the necessary cover coat area is also removed as shown in FIG. A complete cover layer 13 is formed.
【０００８】従って、このような不完全なカバ−層１３
を有する可撓性回路基板では、同図（３）のようにマス
ク１１を除去して端子部を露出させる開口部１５を形成
しても製品として使用することはできない。Accordingly, such an incomplete cover layer 13
In the case of the flexible circuit board having the above, even if the mask 11 is removed and the opening 15 exposing the terminal portion is formed as shown in FIG.
【０００９】本発明は、そこで、可撓性回路基板の回路
配線層の表面を保護する為のカバ−層を形成する際に回
路配線層の端子部を適正に露出できる可撓性回路基板の
端子部形成法を提供するものである。SUMMARY OF THE INVENTION Accordingly, the present invention provides a flexible circuit board capable of properly exposing terminals of the circuit wiring layer when forming a cover layer for protecting the surface of the circuit wiring layer of the flexible circuit board. A method for forming a terminal portion is provided.
【００１０】[0010]
【課題を解決するための手段】その為に本発明による可
撓性回路基板の端子部形成法では、絶縁べ−ス材上に所
要のパタ−ンで回路配線層を形成し、前記回路配線層に
於ける端子部上に感光性樹脂等で所要のマスクを形成
し、次いで、前記マスクの表面を覆うような厚さで回路
配線層の上面にポリイミド樹脂等のカバ−コ−ト層を塗
布硬化させた後、微粒子混入水のスプレ−によるウエッ
トブラスト手段で前記カバ−コ−ト層の上面を除去する
ことによって前記マスクの表面を露出させ且つ所要の厚
さを有するカバ−層を形成し、次に露出したマスクを除
去することにより前記端子部を露出させる開口部を形成
するものである。For this purpose, in the method of forming a terminal portion of a flexible circuit board according to the present invention, a circuit wiring layer is formed in a required pattern on an insulating base material, and the circuit wiring is formed. A required mask is formed of a photosensitive resin or the like on the terminal portion of the layer, and a cover coat layer of a polyimide resin or the like is formed on the upper surface of the circuit wiring layer so as to cover the surface of the mask. After coating and curing, the upper surface of the cover coat layer is removed by wet blasting with a spray of water mixed with fine particles, thereby exposing the surface of the mask and forming a cover layer having a required thickness. Then, an opening for exposing the terminal portion is formed by removing the exposed mask.
【００１１】[0011]
【発明の実施の形態】以下、図示の実施例を参照しなが
ら本発明を更に詳述する。図１の（１）から（３）は、
本発明による可撓性回路基板の端子部形成法を概念的に
説明する為の工程図であり、同図（１）の如く、例えば
耐熱性に富むポリイミドフィルム等の図示しない適当な
絶縁べ−ス材上には所要のパタ−ンで回路配線層１を形
成し、その回路配線層１に於けるランド或いは接続部等
の端子部上には感光性樹脂等を用いて所要のマスク２を
形成する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in further detail with reference to the illustrated embodiments. (1) to (3) in FIG.
FIG. 4 is a process diagram conceptually illustrating a method of forming a terminal portion of a flexible circuit board according to the present invention. As shown in FIG. A circuit wiring layer 1 is formed in a required pattern on the substrate material, and a required mask 2 is formed on a terminal portion such as a land or a connection portion of the circuit wiring layer 1 using a photosensitive resin or the like. Form.
【００１２】そして、このマスク２の表面をも覆うよう
な厚さで回路配線層１の上面には、ポリイミド樹脂から
なるカバ−コ−ト層３を塗布し硬化させる。このカバ−
コ−ト層３の塗布は、マスク２の表面をも覆うような所
要のカバ−層の厚さ以上の厚みで塗布するものであるか
ら、この塗布工程は容易である。A cover coat layer 3 made of a polyimide resin is applied on the upper surface of the circuit wiring layer 1 so as to cover the surface of the mask 2 and is cured. This cover
Since the coating of the coat layer 3 is performed so as to cover the surface of the mask 2 with a thickness greater than a required thickness of the cover layer, this coating step is easy.
【００１３】そこで、同図（２）の如く、マスク２の表
面を露出させてカバ−コ−ト層３を所要の厚さに形成す
る為に、微粒子混入水を最適な圧力でスプレ−するウエ
ットブラスト手段でカバ−コ−ト層３の上面を薄く除去
し、これによってマスク２の表面を適正に露出させ且つ
所要の厚さを有するカバ−層４を形成できる。In order to expose the surface of the mask 2 and to form the cover coat layer 3 to a required thickness as shown in FIG. 2B, water containing fine particles is sprayed at an optimum pressure. The upper surface of the cover coat layer 3 is thinly removed by wet blast means, whereby the surface of the mask 2 can be properly exposed and the cover layer 4 having a required thickness can be formed.
【００１４】次いで、同図（３）のように、露出したマ
スク２を適当な剥離液で除去することにより、所定の端
子部を確実に露出させる開口部５を適正に形成すること
ができる。Next, as shown in FIG. 3 (3), by removing the exposed mask 2 with an appropriate stripper, an opening 5 for reliably exposing a predetermined terminal portion can be formed properly.
【００１５】[0015]
【発明の効果】本発明による可撓性回路基板の端子部形
成法では、可撓性回路基板の回路配線層の表面を保護す
る為のカバ−層を形成する際に回路配線層の端子部を適
正に露出でき、また、微粒子混入水のスプレ−によるウ
エットブラスト手段でカバ−コ−ト層を薄く除去すると
共にマスクの表面を適正に露出させて所要の厚さを有す
るカバ−層を確実に形成できると同時にそのカバ−層の
洗浄も同時に処理できるという利点がある。According to the method for forming a terminal portion of a flexible circuit board according to the present invention, when forming a cover layer for protecting the surface of the circuit wiring layer of the flexible circuit board, the terminal portion of the circuit wiring layer is formed. In addition, the cover coat layer is removed thinly by wet blasting with a spray of water containing fine particles, and the surface of the mask is properly exposed to ensure a cover layer having a required thickness. And at the same time, the covering layer can be washed simultaneously.
【００１６】従って、耐熱性であって低価格且つ高品質
の可撓性回路基板を安定に提供することができる。Therefore, it is possible to stably provide a low-cost, high-quality heat-resistant flexible circuit board.
【図１】本発明による可撓性回路基板の端子部形成法を
概念的に説明する為の工程図。FIG. 1 is a process chart for conceptually explaining a method for forming a terminal portion of a flexible circuit board according to the present invention.
【図２】従来例の問題点を説明する為の図。FIG. 2 is a diagram for explaining a problem of a conventional example.
１ 回路配線層 ２ マスク ３ カバ−コ−ト層 ４ カバ−層 ５ 開口部 DESCRIPTION OF SYMBOLS 1 Circuit wiring layer 2 Mask 3 Cover coat layer 4 Cover layer 5 Opening
Claims (3)
線層を形成し、前記回路配線層に於ける端子部上に所要
のマスクを形成し、次いで、前記マスクの表面を覆うよ
うな厚さで前記回路配線層の上面にカバ−コ−ト層を塗
布硬化させた後、微粒子混入水のスプレ−によるウエッ
トブラスト手段で前記カバ−コ−ト層の上面を除去する
ことによって前記マスクの表面を露出させ且つ所要の厚
さを有するカバ−層を形成し、次に露出した前記マスク
を除去することにより前記端子部を露出させる開口部を
形成する工程を含む可撓性回路基板の端子部形成法。A circuit wiring layer is formed on an insulating base material in a required pattern, a required mask is formed on a terminal portion in the circuit wiring layer, and then the surface of the mask is removed. After coating and hardening a cover coat layer on the upper surface of the circuit wiring layer so as to cover it, removing the upper surface of the cover coat layer by wet blasting with a spray of water containing fine particles. Forming a cover layer having a required thickness by exposing the surface of the mask and then forming an opening for exposing the terminal portion by removing the exposed mask. A method for forming terminals on a circuit board.
る請求項１の可撓性回路基板の端子部形成法。2. The method according to claim 1, wherein said cover coat layer is made of a polyimide resin.
は２の可撓性回路基板の端子部形成法。3. The method according to claim 1, wherein the mask is made of a photosensitive resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02833799A JP3535030B2 (en) | 1999-02-05 | 1999-02-05 | Method for forming terminals of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02833799A JP3535030B2 (en) | 1999-02-05 | 1999-02-05 | Method for forming terminals of flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000228572A true JP2000228572A (en) | 2000-08-15 |
| JP3535030B2 JP3535030B2 (en) | 2004-06-07 |
Family
ID=12245805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02833799A Expired - Fee Related JP3535030B2 (en) | 1999-02-05 | 1999-02-05 | Method for forming terminals of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3535030B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005593A (en) * | 2005-06-24 | 2007-01-11 | Toppan Printing Co Ltd | Wiring substrate and method for manufacturing the same |
| JP2007088477A (en) * | 2005-09-22 | 2007-04-05 | Samsung Electro-Mechanics Co Ltd | Method for manufacturing substrate provided with cavity |
| JP2007526622A (en) * | 2003-06-27 | 2007-09-13 | スリーエム イノベイティブ プロパティズ カンパニー | Method for making patterned coating |
| JP2015037089A (en) * | 2013-08-12 | 2015-02-23 | 株式会社東芝 | Method of manufacturing wiring board and method of manufacturing semiconductor device |
| DE102020124111A1 (en) | 2020-09-16 | 2022-03-17 | Ersa Gmbh | Selective soldering system for selective wave soldering of printed circuit boards with gripper unit for changing the soldering nozzle |
-
1999
- 1999-02-05 JP JP02833799A patent/JP3535030B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007526622A (en) * | 2003-06-27 | 2007-09-13 | スリーエム イノベイティブ プロパティズ カンパニー | Method for making patterned coating |
| JP2007005593A (en) * | 2005-06-24 | 2007-01-11 | Toppan Printing Co Ltd | Wiring substrate and method for manufacturing the same |
| JP2007088477A (en) * | 2005-09-22 | 2007-04-05 | Samsung Electro-Mechanics Co Ltd | Method for manufacturing substrate provided with cavity |
| JP4648277B2 (en) * | 2005-09-22 | 2011-03-09 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Method for manufacturing a substrate having a cavity |
| JP2015037089A (en) * | 2013-08-12 | 2015-02-23 | 株式会社東芝 | Method of manufacturing wiring board and method of manufacturing semiconductor device |
| CN104378933A (en) * | 2013-08-12 | 2015-02-25 | 株式会社东芝 | Method for manufacturing wiring substrate and semiconductor device |
| TWI607546B (en) * | 2013-08-12 | 2017-12-01 | Toshiba Memory Corp | Wiring substrate manufacturing method and semiconductor device manufacturing method |
| DE102020124111A1 (en) | 2020-09-16 | 2022-03-17 | Ersa Gmbh | Selective soldering system for selective wave soldering of printed circuit boards with gripper unit for changing the soldering nozzle |
| DE102020124111B4 (en) | 2020-09-16 | 2022-12-01 | Ersa Gmbh | Selective soldering system for selective wave soldering of printed circuit boards with gripper unit for changing the soldering nozzle |
| US11623291B2 (en) | 2020-09-16 | 2023-04-11 | Ersa Gmbh | Selective soldering system for selective wave soldering of circuit boards comprising gripping unit for exchanging solder nozzles |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3535030B2 (en) | 2004-06-07 |
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